View source for 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)

=MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF=


==Organization Name==

[[:Category:Yangtze Memory Technologies Co., Ltd.|Yangtze Memory Technologies Co., Ltd.]]


[[Category:Yangtze Memory Technologies Co., Ltd.]]

==Inventor(s)==

[[:Category:Xinru Zeng of Wuhan (CN)|Xinru Zeng of Wuhan (CN)]][[Category:Xinru Zeng of Wuhan (CN)]]

[[:Category:Zhen Xu of Wuhan (CN)|Zhen Xu of Wuhan (CN)]][[Category:Zhen Xu of Wuhan (CN)]]

[[:Category:Weisong Qian of Wuhan (CN)|Weisong Qian of Wuhan (CN)]][[Category:Weisong Qian of Wuhan (CN)]]

[[:Category:Peng Chen of Wuhan (CN)|Peng Chen of Wuhan (CN)]][[Category:Peng Chen of Wuhan (CN)]]

==MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18090608 titled 'MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

==Simplified Explanation==

The memory system package structure described in the patent application includes a memory chip, a memory controller, and a redistribution layer. The memory chip has a first surface, the memory controller is positioned on this surface, and the redistribution layer is placed on a side of the memory controller facing away from the memory chip. The memory chip and the memory controller are electrically connected through the redistribution layer.

* Memory system package structure:
    - Includes memory chip, memory controller, and redistribution layer
    - Memory chip has a first surface
    - Memory controller positioned on the first surface
    - Redistribution layer placed on a side of the memory controller facing away from the memory chip
    - Memory chip and memory controller electrically connected through redistribution layer

== Potential Applications ==
The technology described in this patent application could be applied in:
- Memory modules for computers and servers
- Solid-state drives (SSDs)
- Mobile devices such as smartphones and tablets

== Problems Solved ==
This technology helps in:
- Improving memory system performance
- Enhancing data transfer speeds
- Reducing power consumption

== Benefits ==
The benefits of this technology include:
- Higher efficiency in data processing
- Increased reliability of memory systems
- Compact design for space-saving in devices

== Potential Commercial Applications ==
The potential commercial applications of this technology could be seen in:
- Memory chip manufacturing companies
- Electronics manufacturers
- Data storage solution providers

== Possible Prior Art ==
One possible prior art for this technology could be the use of redistribution layers in semiconductor packaging to improve electrical connections between components. 

=== Unanswered Questions ===

== How does this technology compare to existing memory system package structures in terms of performance and efficiency? ==
The patent application does not provide a direct comparison with existing memory system package structures, so it is unclear how this technology stands out in terms of performance and efficiency.

== What are the potential challenges in implementing this memory system package structure on a large scale for commercial production? ==
The patent application does not address the potential challenges in implementing this technology on a large scale for commercial production, leaving room for uncertainty regarding the scalability and practicality of the innovation.


==Original Abstract Submitted==

A memory system package structure and a manufacturing method thereof are disclosed. For example, the memory system package structure can include a memory chip, a memory controller and a distribution layer. The memory chip can include a first surface. The memory controller can be positioned on the first surface. The redistribution layer can be positioned on a side of the memory controller facing away from the memory chip. The memory chip and the memory controller can be electrically connected with the redistribution layer.



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