View source for 18090273. DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

=DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS=


==Organization Name==

[[:Category:TEXAS INSTRUMENTS INCORPORATED|TEXAS INSTRUMENTS INCORPORATED]]


[[Category:TEXAS INSTRUMENTS INCORPORATED]]

==Inventor(s)==

[[:Category:Masamitsu Matsuura of Beppu-Shi Oita-Ken (JP)|Masamitsu Matsuura of Beppu-Shi Oita-Ken (JP)]][[Category:Masamitsu Matsuura of Beppu-Shi Oita-Ken (JP)]]

==DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18090273 titled 'DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS

The semiconductor package described in the patent application includes two die pads with a gap between them, a semiconductor die spanning the gap and electrically connected to the die pads, and multiple conductive terminals with different configurations extending from the die pads.

* The package features a first die pad and a second die pad in horizontal alignment, separated by a gap, with a semiconductor die bridging the two pads.
* The semiconductor die has circuitry on its device side, facing away from the die pads, and is connected to the die pads through conductive terminals.
* The first and second die pads have multiple down-set conductive terminals extending laterally, while a third conductive terminal with fewer down-sets extends from below the first die pad.
* A bond wire connects the semiconductor die to the third conductive terminal, and the entire assembly is covered by a mold compound.
* The package also includes a passive electrical component external to the mold compound, with electrical contacts coupled to the first and second die pads.
* The distal ends of the conductive terminals are exposed through a common side surface of the mold compound, aligned horizontally with each other.

Potential Applications:
- This semiconductor package design could be used in various electronic devices requiring compact and efficient packaging solutions.
- It may find applications in consumer electronics, automotive systems, industrial equipment, and more.

Problems Solved:
- The package addresses the need for a compact and reliable way to connect a semiconductor die to external components.
- It provides a solution for efficiently routing electrical connections in a confined space.

Benefits:
- Improved reliability and performance due to the direct connection between the semiconductor die and external components.
- Space-saving design allows for smaller and more efficient electronic devices.

Commercial Applications:
- This technology could be valuable for semiconductor manufacturers, electronics companies, and other industries requiring advanced packaging solutions for integrated circuits.

Questions about the technology:
1. How does the design of the conductive terminals contribute to the overall efficiency of the semiconductor package?
2. What are the potential challenges in manufacturing and implementing this packaging design in mass production?


==Original Abstract Submitted==

In some examples, a semiconductor package comprises a first die pad having a first top surface and a first bottom surface opposing the first top surface and a second die pad in horizontal alignment with the first die pad, the second die pad having a second top surface and a second bottom surface opposing the second top surface, a gap separating the first and second die pads. The package comprises a semiconductor die electrically coupled to the first and second bottom surfaces and extending across the gap, the semiconductor die having a device side including circuitry formed therein, the device side facing away from the first and second die pads. The package comprises a first conductive terminal extending from a lateral surface of the first die pad and away from the first die pad, the first conductive terminal having multiple down-sets. The package comprises a second conductive terminal extending from a lateral surface of the second die pad and away from the second die pad, the second conductive terminal having multiple down-sets. The package comprises a third conductive terminal having fewer down-sets than the first and second conductive terminals and extending from below the first die pad and away from the first die pad. The package comprises a bond wire coupling the device side of the semiconductor die to the third conductive terminal. The package comprises a mold compound covering the semiconductor die and the bond wire, the first and second die pads exposed to an exterior of the mold compound through a top surface of the mold compound. The package comprises a passive electrical component external to the mold compound and having a first electrical contact coupled to the first die pad and having a second electrical contact coupled to the second die pad. The first, second, and third conductive terminals include distal ends that are exposed through a common side surface of the mold compound, the distal ends in horizontal alignment with each other.



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