View source for 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)

=LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Kristof Darmawikarta of Chandler AZ (US)|Kristof Darmawikarta of Chandler AZ (US)]][[Category:Kristof Darmawikarta of Chandler AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Tarek A. Ibrahim of Mesa AZ (US)|Tarek A. Ibrahim of Mesa AZ (US)]][[Category:Tarek A. Ibrahim of Mesa AZ (US)]]

[[:Category:Aaron Garelick of Chandler AZ (US)|Aaron Garelick of Chandler AZ (US)]][[Category:Aaron Garelick of Chandler AZ (US)]]

[[:Category:Srikant Nekkanty of Chandler AZ (US)|Srikant Nekkanty of Chandler AZ (US)]][[Category:Srikant Nekkanty of Chandler AZ (US)]]

[[:Category:Ravindranath V. Mahajan of Chandler AZ (US)|Ravindranath V. Mahajan of Chandler AZ (US)]][[Category:Ravindranath V. Mahajan of Chandler AZ (US)]]

[[:Category:Rahul N. Manepalli of Chandler AZ (US)|Rahul N. Manepalli of Chandler AZ (US)]][[Category:Rahul N. Manepalli of Chandler AZ (US)]]

==LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18089491 titled 'LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

The patent application describes package substrates with a core, buildup layers, pads, and liquid metal wells.

* Package substrates consist of a core with buildup layers.
* Pads are provided on the buildup layers.
* Liquid metal wells are placed over the pads.

Potential Applications:
- Electronic packaging
- Semiconductor devices
- Integrated circuits

Problems Solved:
- Enhanced connectivity in electronic devices
- Improved thermal management
- Increased reliability of semiconductor components

Benefits:
- Higher performance in electronic systems
- Better heat dissipation
- Longer lifespan of semiconductor devices

Commercial Applications:
Title: Advanced Package Substrates for High-Performance Electronics
This technology can be used in the manufacturing of high-performance electronic devices such as smartphones, computers, and automotive electronics. The market implications include improved product reliability and performance, leading to increased consumer satisfaction and brand loyalty.

Questions about Package Substrates:
1. How do package substrates impact the performance of electronic devices?
   - Package substrates play a crucial role in enhancing connectivity and thermal management in electronic devices, leading to improved overall performance.
2. What are the key features of package substrates that make them suitable for semiconductor applications?
   - The core, buildup layers, pads, and liquid metal wells in package substrates provide the necessary structure and functionality for semiconductor devices.


==Original Abstract Submitted==

Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core and buildup layers over the core. In an embodiment, a pad is provided on the buildup layers. In an embodiment, a liquid metal well is over the pad.



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