View source for 18089489. SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION simplified abstract (Intel Corporation)

=SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Onur Ozkan of Scottsdale AZ (US)|Onur Ozkan of Scottsdale AZ (US)]][[Category:Onur Ozkan of Scottsdale AZ (US)]]

[[:Category:Jacob Vehonsky of Gilbert AZ (US)|Jacob Vehonsky of Gilbert AZ (US)]][[Category:Jacob Vehonsky of Gilbert AZ (US)]]

[[:Category:Vinith Bejugam of Chandler AZ (US)|Vinith Bejugam of Chandler AZ (US)]][[Category:Vinith Bejugam of Chandler AZ (US)]]

[[:Category:Nicholas S. Haehn of Scottsdale AZ (US)|Nicholas S. Haehn of Scottsdale AZ (US)]][[Category:Nicholas S. Haehn of Scottsdale AZ (US)]]

[[:Category:Andrea Nicolas Flores of Chandler AZ (US)|Andrea Nicolas Flores of Chandler AZ (US)]][[Category:Andrea Nicolas Flores of Chandler AZ (US)]]

[[:Category:Mao-Feng Tseng of Tempe AZ (US)|Mao-Feng Tseng of Tempe AZ (US)]][[Category:Mao-Feng Tseng of Tempe AZ (US)]]

==SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18089489 titled 'SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION

The patent application describes a package core that includes a substrate with a first surface and a second surface, made of glass in this embodiment. The substrate has a via that is electrically conductive and a recess on the first surface where an electrically conductive trace is embedded.

* The package core comprises a substrate with a first and second surface, with the substrate being made of glass.
* A via is present in the substrate, providing electrical conductivity.
* A recess is formed in the first surface of the substrate, with an electrically conductive trace embedded within it.

Potential Applications:
- This technology could be used in electronic packaging for various devices.
- It could find applications in the semiconductor industry for integrated circuits.

Problems Solved:
- Provides a structure for efficient electrical connectivity in electronic devices.
- Offers a reliable and durable packaging solution for sensitive electronic components.

Benefits:
- Enhanced electrical conductivity.
- Improved reliability and durability of electronic packaging.

Commercial Applications:
Title: Innovative Package Core Technology for Enhanced Electronic Connectivity
This technology could be utilized in the manufacturing of electronic devices, such as smartphones, tablets, and computers, to improve their performance and reliability in various industries.

Questions about Package Core Technology:
1. How does the use of glass as a substrate benefit the package core technology?
Glass as a substrate provides durability and reliability to the package core, making it suitable for various electronic applications.
2. What are the advantages of having an electrically conductive trace embedded in a recess on the substrate?
Embedding an electrically conductive trace in a recess ensures efficient electrical connectivity and enhances the overall performance of electronic devices.


==Original Abstract Submitted==

Embodiments disclosed herein include a package core. In an embodiment, the package core comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprise glass. In an embodiment, a via is provided through the substrate, where the via is electrically conductive. In an embodiment, a recess is formed into the first surface of the substrate, and a trace is embedded in the recess. In an embodiment, the trace is electrically conductive.



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