View source for 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)

=TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Minglu Liu of Chandler AZ (US)|Minglu Liu of Chandler AZ (US)]][[Category:Minglu Liu of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Liang He of Chandler AZ (US)|Liang He of Chandler AZ (US)]][[Category:Liang He of Chandler AZ (US)]]

[[:Category:Ziyin Lin of Chandler AZ (US)|Ziyin Lin of Chandler AZ (US)]][[Category:Ziyin Lin of Chandler AZ (US)]]

[[:Category:Elizabeth Nofen of Phoenix AZ (US)|Elizabeth Nofen of Phoenix AZ (US)]][[Category:Elizabeth Nofen of Phoenix AZ (US)]]

[[:Category:Yiqun Bai of Chandler AZ (US)|Yiqun Bai of Chandler AZ (US)]][[Category:Yiqun Bai of Chandler AZ (US)]]

[[:Category:Jonathan Atkins of Phoenix AZ (US)|Jonathan Atkins of Phoenix AZ (US)]][[Category:Jonathan Atkins of Phoenix AZ (US)]]

[[:Category:Jesus S. Nieto Pescador of Chandler AZ (US)|Jesus S. Nieto Pescador of Chandler AZ (US)]][[Category:Jesus S. Nieto Pescador of Chandler AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Kristof Darmawikarta of Chandler AZ (US)|Kristof Darmawikarta of Chandler AZ (US)]][[Category:Kristof Darmawikarta of Chandler AZ (US)]]

==TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18089483 titled 'TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS

The abstract of the patent application describes an electronic package with a package substrate, an opening in the substrate, first pads at the bottom of the opening, and a bridge die with second pads connected to the first pads via solder and a non-conductive film (NCF).

* Package includes a substrate with an opening, first pads, a bridge die, second pads, solder, and NCF.
* Bridge die is positioned in the opening and has second pads connected to first pads through solder.
* NCF surrounds the solder between the first and second pads.

Potential Applications:
- This technology can be used in electronic devices such as smartphones, tablets, and laptops.
- It can also be applied in automotive electronics, medical devices, and industrial equipment.

Problems Solved:
- Provides a reliable and efficient way to connect components in electronic packages.
- Ensures secure connections between different parts of the electronic package.

Benefits:
- Improved reliability and durability of electronic packages.
- Enhanced performance and functionality of electronic devices.
- Cost-effective manufacturing process for electronic components.

Commercial Applications:
- This technology can be utilized by electronics manufacturers to enhance the quality and performance of their products.
- It can also benefit companies in the automotive, medical, and industrial sectors looking to improve the reliability of their electronic systems.

Questions about the technology:
1. How does the non-conductive film (NCF) contribute to the reliability of the connections in the electronic package?
2. What are the advantages of using solder to connect the first and second pads in the bridge die?


==Original Abstract Submitted==

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.



[[Category:H01L23/538]]
[[Category:H01L23/00]]
[[Category:H01L23/522]]
[[Category:H01L23/528]]
[[Category:CPC_H01L23/5381]]