View source for 18080729. MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract (Google LLC)

=MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION=


==Organization Name==

[[:Category:Google LLC|Google LLC]]


[[Category:Google LLC]]

==Inventor(s)==

[[:Category:Zhimin Jamie Yao of Santa Barbara CA (US)|Zhimin Jamie Yao of Santa Barbara CA (US)]][[Category:Zhimin Jamie Yao of Santa Barbara CA (US)]]

[[:Category:Michael C. Hamilton of Auburn AL (US)|Michael C. Hamilton of Auburn AL (US)]][[Category:Michael C. Hamilton of Auburn AL (US)]]

[[:Category:Marissa Giustina of Santa Barbara CA (US)|Marissa Giustina of Santa Barbara CA (US)]][[Category:Marissa Giustina of Santa Barbara CA (US)]]

[[:Category:Brian James Burkett of Santa Barbara CA (US)|Brian James Burkett of Santa Barbara CA (US)]][[Category:Brian James Burkett of Santa Barbara CA (US)]]

[[:Category:Theodore Charles White of Santa Barbara CA (US)|Theodore Charles White of Santa Barbara CA (US)]][[Category:Theodore Charles White of Santa Barbara CA (US)]]

[[:Category:Ofer Naaman of Santa Barbara CA (US)|Ofer Naaman of Santa Barbara CA (US)]][[Category:Ofer Naaman of Santa Barbara CA (US)]]

==MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18080729 titled 'MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

'''Simplified Explanation:'''
The patent application describes a method involving a first chip with multiple circuit elements distributed across different layers, separated by sacrificial material. A coherent device layer is placed on top of the circuit element layer stack, and the sacrificial material is then removed.

* Key Features and Innovation:
    - Method involves a circuit element layer stack with sacrificial material.
    - Coherent device layer is added on top of the stack.
    - Sacrificial material removal process is included in the method.

'''Potential Applications:'''
This technology could be applied in semiconductor manufacturing processes, integrated circuit design, and microelectronics production.

'''Problems Solved:'''
This method addresses the challenge of integrating multiple circuit elements across different layers while maintaining coherence and functionality.

'''Benefits:'''
- Enables efficient stacking of circuit elements.
- Facilitates the creation of complex integrated circuits.
- Improves the overall performance of electronic devices.

'''Commercial Applications:'''
The technology could be utilized in the production of advanced electronic devices, such as smartphones, tablets, and computers, enhancing their performance and functionality.

'''Prior Art:'''
Readers can explore prior art related to this technology in the field of semiconductor manufacturing, integrated circuit design, and microelectronics research.

'''Frequently Updated Research:'''
Stay informed about the latest advancements in semiconductor manufacturing processes, integrated circuit design, and microelectronics production to enhance your understanding of this technology.

'''Questions about the Technology:'''
1. What are the potential challenges in implementing this method in large-scale semiconductor manufacturing?
2. How does the removal of sacrificial material impact the overall performance and reliability of the electronic devices?


==Original Abstract Submitted==

A method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. The circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. The method includes removing the sacrificial material.



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