View source for 18080152. INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (Intel Corporation)

=INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

[[:Category:Brandon Marin of Gilbert AZ (US)|Brandon Marin of Gilbert AZ (US)]][[Category:Brandon Marin of Gilbert AZ (US)]]

[[:Category:Jeremy Ecton of Gilbert AZ (US)|Jeremy Ecton of Gilbert AZ (US)]][[Category:Jeremy Ecton of Gilbert AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Srinivas Pietambaram of Chandler AZ (US)|Srinivas Pietambaram of Chandler AZ (US)]][[Category:Srinivas Pietambaram of Chandler AZ (US)]]

==INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18080152 titled 'INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

'''Simplified Explanation:'''
The patent application describes a method of integrating photonics integrated circuit devices and electronic integrated circuit devices into a single assembly or module. This involves placing a photonics integrated circuit device within a glass core substrate and bonding an electronic integrated circuit device directly to it, with an optical waveguide connecting the two.

* Glass core substrate with photonics integrated circuit device inside
* Electronic integrated circuit device bonded directly to the photonics integrated circuit device
* Optical waveguide connecting the two devices

'''Key Features and Innovation:'''
* Integration of photonics and electronic integrated circuit devices
* Direct bonding of electronic integrated circuit device to photonics integrated circuit device
* Use of optical waveguide within glass core substrate

'''Potential Applications:'''
This technology could be used in telecommunications, data centers, and high-speed computing applications.

'''Problems Solved:'''
* Integration of photonics and electronic devices
* Efficient data transfer between devices
* Space-saving design

'''Benefits:'''
* Faster data transfer speeds
* Compact design
* Improved overall performance

'''Commercial Applications:'''
The technology could be utilized in telecommunications equipment, data center infrastructure, and high-performance computing systems.

'''Prior Art:'''
Readers can explore prior research on integrated photonics and electronics integration in the field of semiconductor technology.

'''Frequently Updated Research:'''
Stay updated on advancements in integrated photonics and electronics integration for potential new applications and improvements in performance.

'''Questions about Integrated Photonics and Electronics Integration:'''
1. How does the direct bonding of electronic integrated circuit devices to photonics integrated circuit devices improve performance?
2. What are the potential challenges in scaling up this technology for mass production?


==Original Abstract Submitted==

Apparatuses, systems, assemblies, and techniques related to integrating photonics integrated circuit devices and electronic integrated circuit devices into an assembly or module are described. An integrated module includes a photonics integrated circuit device within an opening of a glass core substrate and an electronic integrated circuit device direct bonded to the photonics integrated circuit device. An optical waveguide is within or on the glass core substrate and has a terminal end edge coupled to the photonics integrated circuit device within the opening.



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