View source for 18078923. HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

=HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE=


==Organization Name==

[[:Category:TEXAS INSTRUMENTS INCORPORATED|TEXAS INSTRUMENTS INCORPORATED]]


[[Category:TEXAS INSTRUMENTS INCORPORATED]]

==Inventor(s)==

[[:Category:Kwang-Soo Kim of Sunnyvale CA (US)|Kwang-Soo Kim of Sunnyvale CA (US)]][[Category:Kwang-Soo Kim of Sunnyvale CA (US)]]

[[:Category:Vivek Arora of San Jose CA (US)|Vivek Arora of San Jose CA (US)]][[Category:Vivek Arora of San Jose CA (US)]]

[[:Category:Ken Pham of San Jose CA (US)|Ken Pham of San Jose CA (US)]][[Category:Ken Pham of San Jose CA (US)]]

==HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18078923 titled 'HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

The patent application describes an electronic device with a multilevel ceramic body, plates, and semiconductor dies. The ceramic body has openings and a separator structure creating interior portions.

* The electronic device includes a multilevel ceramic body with multiple plates and semiconductor dies.
* The ceramic body has openings on opposite sides and a separator structure dividing interior portions.
* Plates are attached to cover the openings on the ceramic body.
* Semiconductor dies are placed in the interior portions of the ceramic body.

Potential Applications:
This technology could be used in electronic devices such as smartphones, tablets, and laptops.

Problems Solved:
This innovation helps in compactly integrating multiple components in electronic devices.

Benefits:
The multilevel ceramic body allows for efficient space utilization and improved thermal management in electronic devices.

Commercial Applications:
This technology could be beneficial for electronics manufacturers looking to enhance the performance and reliability of their products.

Prior Art:
Researchers can explore prior patents related to multilevel ceramic bodies and semiconductor integration in electronic devices.

Frequently Updated Research:
Stay updated on advancements in multilevel ceramic body technology and semiconductor integration for electronic devices.

Questions about Multilevel Ceramic Body Electronic Device:
1. How does the multilevel ceramic body improve thermal management in electronic devices?
2. What are the potential challenges in integrating semiconductor dies in a multilevel ceramic body?


==Original Abstract Submitted==

An electronic device includes a multilevel ceramic body, first, second, and third plates, and first and second semiconductor dies, with the multilevel ceramic body having opposite first and second sides, a first and second openings in the first side, a third opening in the second side, and a ceramic separator structure defining first and second interior portions between the first and second openings. The first plate is attached to the first side and covers the first opening, the second plate is attached to the first side and covers the second opening, the third plate is attached to the second side and covers the third opening, the first semiconductor die is in the first interior portion, and the second semiconductor die is in the second interior portion of the ceramic body.



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