View source for 18076545. LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME simplified abstract (INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE)

=LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME=


==Organization Name==

[[:Category:INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE|INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE]]


[[Category:INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE]]

==Inventor(s)==

[[:Category:JUI-MEI Hsu of Zhubei City (TW)|JUI-MEI Hsu of Zhubei City (TW)]][[Category:JUI-MEI Hsu of Zhubei City (TW)]]

[[:Category:YO-SUNG Lee of New Taipei (TW)|YO-SUNG Lee of New Taipei (TW)]][[Category:YO-SUNG Lee of New Taipei (TW)]]

[[:Category:YI-JIUN Lin of Chiayi County (TW)|YI-JIUN Lin of Chiayi County (TW)]][[Category:YI-JIUN Lin of Chiayi County (TW)]]

[[:Category:CHIH-CHIANG Weng of Taoyuan (TW)|CHIH-CHIANG Weng of Taoyuan (TW)]][[Category:CHIH-CHIANG Weng of Taoyuan (TW)]]

==LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18076545 titled 'LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME

==Simplified Explanation==

The localized heating device described in the patent application includes a plasma deforming portion and a heating portion. The plasma deforming portion has an inlet end with a circular hole, an outlet end with an elongated hole, and a channel connecting the two. The heating portion, located at the outlet end, consists of two control covers separated by a slot. The plasma flow enters the channel through the circular hole, passes through the elongated hole, and reaches the slot.

* Plasma deforming portion with circular and elongated holes
* Heating portion with control covers and slot
* Plasma flow enters through circular hole, flows through elongated hole, and reaches slot

== Potential Applications ==
The technology could be used in industrial heating processes, such as in the manufacturing of materials that require localized heating.

== Problems Solved ==
The device provides a controlled and localized heating method, which can be more efficient and precise compared to traditional heating methods.

== Benefits ==
- Precise and controlled heating
- Energy efficiency
- Potential for automation in heating processes

== Potential Commercial Applications ==
Optimizing Localized Heating Device for Industrial Processes

== Possible Prior Art ==
There may be prior art related to plasma heating devices or localized heating methods, but specific examples are not provided in the patent application.

== Unanswered Questions ==

=== How does the device handle different types of materials for heating? ===
The patent application does not specify how the device can be adapted for heating various materials with different properties.

=== What is the expected lifespan of the device and how easy is it to maintain? ===
Information regarding the durability and maintenance requirements of the device is not included in the patent application.


==Original Abstract Submitted==

A localized heating device includes a plasma deforming portion and a heating portion. The plasma deforming portion includes an inlet end having a circular hole, an outlet end having an elongated hole with a first length and a first width, and a channel smoothly connected with the circular hole and the elongated hole. The heating portion, disposed at the outlet end, includes two control covers spaced by a slot. The elongated hole and the slot being oppositely disposed with respect to the plasma deforming portion. A plasma flow provided by a plasma producing source being to enter the channel via the circular hole, then to flow through the elongated hole, and finally to reach the slot.



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