View source for 18067148. HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract (International Business Machines Corporation)

=HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK=


==Organization Name==

[[:Category:International Business Machines Corporation|International Business Machines Corporation]]


[[Category:International Business Machines Corporation]]

==Inventor(s)==

[[:Category:Ruilong Xie of Niskayuna NY (US)|Ruilong Xie of Niskayuna NY (US)]][[Category:Ruilong Xie of Niskayuna NY (US)]]

[[:Category:Lawrence A. Clevenger of Saratoga Springs NY (US)|Lawrence A. Clevenger of Saratoga Springs NY (US)]][[Category:Lawrence A. Clevenger of Saratoga Springs NY (US)]]

[[:Category:Nicholas Anthony Lanzillo of Wynantskill NY (US)|Nicholas Anthony Lanzillo of Wynantskill NY (US)]][[Category:Nicholas Anthony Lanzillo of Wynantskill NY (US)]]

[[:Category:Albert M. Chu of Nashua NH (US)|Albert M. Chu of Nashua NH (US)]][[Category:Albert M. Chu of Nashua NH (US)]]

[[:Category:Reinaldo Vega of Mahopac NY (US)|Reinaldo Vega of Mahopac NY (US)]][[Category:Reinaldo Vega of Mahopac NY (US)]]

[[:Category:Brent A. Anderson of Jericho VT (US)|Brent A. Anderson of Jericho VT (US)]][[Category:Brent A. Anderson of Jericho VT (US)]]

==HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18067148 titled 'HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK

**Simplified Explanation:**
The patent application describes a multi-layer integrated circuit structure with signal lines in the front-end-of-line region and power rails in the backside region of a wafer.

**Key Features and Innovation:**
* Multi-layer integrated circuit structure
* Signal lines in the front-end-of-line region
* Power rails in the backside region
* Constant signal-line pitch
* Varying power-rail pitch

**Potential Applications:**
This technology could be used in various electronic devices such as smartphones, computers, and other integrated circuits.

**Problems Solved:**
This technology addresses the need for efficient power distribution and signal transmission in integrated circuits.

**Benefits:**
* Improved performance of integrated circuits
* Enhanced power distribution efficiency
* Better signal transmission capabilities

**Commercial Applications:**
Potential commercial applications include the semiconductor industry, electronics manufacturing, and telecommunications.

**Prior Art:**
Readers can start searching for prior art related to this technology in the field of integrated circuit design and semiconductor manufacturing processes.

**Frequently Updated Research:**
Stay updated on the latest advancements in integrated circuit design, semiconductor technology, and power distribution in electronic devices.

**Questions about Multi-Layer Integrated Circuit Structure:**
1. How does the varying power-rail pitch in the backside region contribute to the efficiency of the integrated circuit structure?
2. What are the potential challenges in implementing a multi-layer integrated circuit structure with signal lines and power rails in different regions of the wafer?


==Original Abstract Submitted==

Embodiments of the invention provide a multi-layer integrated circuit (IC) structure that includes a back-end-of-line (BEOL) region at a first side of a wafer. A backside region is at a second side of the wafer that is opposite the first side of the wafer. A set of signal lines are in the BEOL region, and a set of power rails are in the backside region. The set of signal lines includes a substantially constant signal-line pitch between each signal line in the set of signal lines. The set of power rails includes a substantially varying power-rail pitch between each power rail in the set of power rails.



[[Category:H01L27/118]]
[[Category:H01L23/528]]
[[Category:H01L27/02]]
[[Category:CPC_H01L27/11807]]