View source for 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)

=APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Kristof Darmawikarta of Chandler AZ (US)|Kristof Darmawikarta of Chandler AZ (US)]][[Category:Kristof Darmawikarta of Chandler AZ (US)]]

[[:Category:Steve S. Cho of Chandler AZ (US)|Steve S. Cho of Chandler AZ (US)]][[Category:Steve S. Cho of Chandler AZ (US)]]

[[:Category:Hiroki Tanaka of Gilbert AZ (US)|Hiroki Tanaka of Gilbert AZ (US)]][[Category:Hiroki Tanaka of Gilbert AZ (US)]]

[[:Category:Haobo Chen of Chandler AZ (US)|Haobo Chen of Chandler AZ (US)]][[Category:Haobo Chen of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Brandon Christian Marin of Gilbert AZ (US)|Brandon Christian Marin of Gilbert AZ (US)]][[Category:Brandon Christian Marin of Gilbert AZ (US)]]

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

==APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18065250 titled 'APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

'''Simplified Explanation:'''
The patent application describes a method and apparatus for electroless surface finishing on glass substrates by performing a planarization process on dielectric and solder resist layers to create a flat surface for applying an electroless NiPdAu process.

* The innovation involves planarizing buildup dielectric and/or solder resist layers on a glass substrate to create a flat surface with surface variations of less than about 5 microns.
* The planar surface enables the application of an electroless NiPdAu process for surface finishing.
* The process results in a smoother and more uniform surface finish on glass substrates, improving the overall quality and performance of electronic devices.

'''Potential Applications:'''
This technology can be applied in the manufacturing of electronic devices, such as printed circuit boards, semiconductor devices, and sensors, where a smooth and uniform surface finish on glass substrates is required.

'''Problems Solved:'''
The technology addresses the challenge of achieving a flat and planar surface on glass substrates for electroless surface finishing processes, ensuring improved quality and performance of electronic components.

'''Benefits:'''
- Enhanced surface finish quality on glass substrates
- Improved performance and reliability of electronic devices
- Cost-effective and efficient manufacturing process

'''Commercial Applications:'''
The technology can be utilized in the production of various electronic devices, including smartphones, tablets, laptops, and other consumer electronics, to enhance their performance and durability.

'''Prior Art:'''
Readers can explore prior research on electroless surface finishing processes on glass substrates, planarization techniques, and surface treatment methods in the field of electronic manufacturing.

'''Frequently Updated Research:'''
Stay updated on the latest advancements in electroless surface finishing technologies, planarization processes, and surface treatment methods for glass substrates to enhance electronic device performance.

'''Questions about Electroless Surface Finishing on Glass:'''
1. How does planarization of dielectric and solder resist layers contribute to the success of the electroless NiPdAu process?
2. What are the key advantages of using electroless surface finishing on glass substrates compared to other surface treatment methods?


==Original Abstract Submitted==

Apparatus and methods for electroless surface finishing on glass. A planarization process is performed on buildup dielectric and/or solder resist to create a flatter, more planar, upper surface for a substrate having a glass layer. Planarity is characterized by having surface variations of less than about 5 microns, as measured by recesses and/or protrusions. The planar surface enables finishing the substrate surface with an electroless NiPdAu process.



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