View source for 18060305. LASER DICING TO CONTROL SPLASH simplified abstract (TEXAS INSTRUMENTS INCORPORATED)

=LASER DICING TO CONTROL SPLASH=


==Organization Name==

[[:Category:TEXAS INSTRUMENTS INCORPORATED|TEXAS INSTRUMENTS INCORPORATED]]


[[Category:TEXAS INSTRUMENTS INCORPORATED]]

==Inventor(s)==

[[:Category:Yang Liu of Chengdu (CN)|Yang Liu of Chengdu (CN)]][[Category:Yang Liu of Chengdu (CN)]]

[[:Category:Hao Zhang of Chengdu (CN)|Hao Zhang of Chengdu (CN)]][[Category:Hao Zhang of Chengdu (CN)]]

[[:Category:Venkataramanan Kalyanaraman of ALLEN TX (US)|Venkataramanan Kalyanaraman of ALLEN TX (US)]][[Category:Venkataramanan Kalyanaraman of ALLEN TX (US)]]

[[:Category:Lejuan Zhou of Chengdu (CN)|Lejuan Zhou of Chengdu (CN)]][[Category:Lejuan Zhou of Chengdu (CN)]]

==LASER DICING TO CONTROL SPLASH - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18060305 titled 'LASER DICING TO CONTROL SPLASH

==Simplified Explanation==

The abstract describes a method involving the use of laser beams to create modified regions and cracks within a semiconductor substrate along a scribe street.

* Laser beams are directed at the substrate surface to form modified regions and cracks.
* The cracks created form a zigzag-shaped pattern within the substrate along the scribe street.

== Potential Applications ==
This technology could be applied in the semiconductor industry for scribing and separating semiconductor substrates.

== Problems Solved ==
This technology helps in the precise and efficient separation of semiconductor substrates along scribe streets.

== Benefits ==
The method offers a controlled and accurate way to create modified regions and cracks within semiconductor substrates for scribing purposes.

== Potential Commercial Applications ==
"Semiconductor Substrate Scribing Technology: Enhancing Precision and Efficiency"

== Possible Prior Art ==
There may be prior art related to laser scribing techniques in the semiconductor industry, but specific examples are not provided in the abstract.

== Unanswered Questions ==

=== How does this method compare to traditional scribing techniques in terms of efficiency and precision? ===
The abstract does not provide a direct comparison between this laser-based method and traditional scribing techniques.

=== Are there any limitations or challenges associated with implementing this technology on a large scale in semiconductor manufacturing? ===
The abstract does not address any potential limitations or challenges that may arise when scaling up this technology for commercial production.


==Original Abstract Submitted==

One example provides a method that includes directing a first laser beam at a surface of a semiconductor substrate along a scribe street thereof. The first laser beam is focused inside the substrate to form a first modified region, which is offset from a second modified region in a direction orthogonal to a scan direction of the first laser beam, and a first crack extending between the second modified region and the first modified region. A second laser beam is directed at the surface to form a third modified region, which is offset from the first and second modified regions, and a second crack extending from the first modified region to the surface. The first and second cracks form a zigzag-shaped crack within the substrate along the scribe street.



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