View source for 18059465. SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR simplified abstract (NXP USA, Inc.)

=SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR=


==Organization Name==

[[:Category:NXP USA, Inc.|NXP USA, Inc.]]


[[Category:NXP USA, Inc.]]

==Inventor(s)==

[[:Category:Chayathorn Saklang of Bangplee (TH)|Chayathorn Saklang of Bangplee (TH)]][[Category:Chayathorn Saklang of Bangplee (TH)]]

[[:Category:Namrata Kanth of Mesa AZ (US)|Namrata Kanth of Mesa AZ (US)]][[Category:Namrata Kanth of Mesa AZ (US)]]

[[:Category:Stephen Ryan Hooper of Queen Creek AZ (US)|Stephen Ryan Hooper of Queen Creek AZ (US)]][[Category:Stephen Ryan Hooper of Queen Creek AZ (US)]]

[[:Category:Scott M. Hayes of Chandler AZ (US)|Scott M. Hayes of Chandler AZ (US)]][[Category:Scott M. Hayes of Chandler AZ (US)]]

==SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18059465 titled 'SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR

==Simplified Explanation==

The abstract describes a method of manufacturing a semiconductor device with an attached battery. Here are the key points of the innovation:

* Affixing a semiconductor die to a die pad region of a first battery lead of a leadframe.
* Encapsulating the semiconductor die and portions of the first and second battery leads of the leadframe.
* Affixing the battery to the first battery lead of the leadframe, connecting the first terminal of the battery to the first battery lead.
* Bending an exposed portion of the second battery lead to overlap the top surface portion of the battery, connecting the second terminal of the battery to the second battery lead.

== Potential Applications ==
This technology could be applied in the manufacturing of various electronic devices that require both a semiconductor component and a battery, such as sensors, IoT devices, and medical devices.

== Problems Solved ==
1. Simplifies the manufacturing process by integrating the battery with the semiconductor device.
2. Ensures a reliable electrical connection between the battery and the semiconductor device.

== Benefits ==
1. Compact design with integrated battery.
2. Improved reliability and performance of the semiconductor device.
3. Cost-effective manufacturing process.

== Potential Commercial Applications ==
* "Integrated Semiconductor Device with Attached Battery: Commercial Applications"

== Possible Prior Art ==
There may be prior art related to the integration of batteries with semiconductor devices, but specific examples are not provided in the abstract.

== Unanswered Questions ==

=== How does this method impact the overall size of the semiconductor device? ===
The abstract does not mention the impact of integrating the battery on the size of the semiconductor device. This could be important for applications where size constraints are critical.

=== What materials are used for the encapsulant in this method? ===
The abstract does not specify the materials used for the encapsulant. Understanding the materials could be crucial for assessing the durability and performance of the semiconductor device.


==Original Abstract Submitted==

A method of manufacturing a semiconductor device with an attached battery is provided. The method includes affixing a semiconductor die to a die pad region of a first battery lead of a leadframe. The first battery lead of the leadframe is separated from a second battery lead of the leadframe. An encapsulant encapsulates the semiconductor die and portions of the first and second battery leads of the leadframe. The battery is affixed to an exposed portion of the first battery lead of the leadframe such that a first terminal of the battery is conductively connected to the first battery lead. An exposed portion of the second battery lead of the leadframe is bent to overlap a top surface portion of the battery such that a second terminal of the battery conductively connected to the second battery lead.



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