View source for 18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)

=PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Jeremy Ecton of Gilbert AZ (US)|Jeremy Ecton of Gilbert AZ (US)]][[Category:Jeremy Ecton of Gilbert AZ (US)]]

[[:Category:Changhua Liu of Chandle AZ (US)|Changhua Liu of Chandle AZ (US)]][[Category:Changhua Liu of Chandle AZ (US)]]

[[:Category:Brandon C. Marin of Gilbert AZ (US)|Brandon C. Marin of Gilbert AZ (US)]][[Category:Brandon C. Marin of Gilbert AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Mohammad Mamunur Rahman of Gilbert AZ (US)|Mohammad Mamunur Rahman of Gilbert AZ (US)]][[Category:Mohammad Mamunur Rahman of Gilbert AZ (US)]]

==PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18054211 titled 'PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS

==Simplified Explanation==

The abstract describes a package substrate with a conductive via in a first layer, a conductive trace in a second layer, and an insulative material between the two layers that absorbs electromagnetic radiation in a specific wavelength range. The layers are made of different types of photo-imageable dielectrics that react differently to exposure to electromagnetic radiation.

* Conductive via in first layer
* Conductive trace in second layer
* Insulative material between layers absorbs electromagnetic radiation
* Positive-type photo-imageable dielectric in first layer
* Negative-type photo-imageable dielectric in second layer
* Layers react differently to exposure to electromagnetic radiation

== Potential Applications ==
This technology could be used in electronic packaging, integrated circuits, and other semiconductor devices.

== Problems Solved ==
This technology helps in reducing electromagnetic interference and improving signal integrity in electronic devices.

== Benefits ==
The benefits of this technology include improved performance, reliability, and efficiency of electronic devices.

== Potential Commercial Applications ==
Potential commercial applications of this technology include consumer electronics, telecommunications equipment, and automotive electronics.

== Possible Prior Art ==
One possible prior art could be the use of photo-imageable dielectrics in electronic packaging to create conductive traces and vias.

== Unanswered Questions ==
1. How does the insulative material specifically absorb electromagnetic radiation in the wavelength range mentioned?
2. What specific types of electronic devices would benefit the most from this technology?


==Original Abstract Submitted==

Embodiments of a package substrate includes: a conductive via in a first layer, the first layer comprising a positive-type photo-imageable dielectric; a conductive trace in a second layer, the second layer comprising a negative-type photo-imageable dielectric; and an insulative material between the first layer and the second layer, the insulative material configured to absorb electromagnetic radiation in a wavelength range between 10 nanometers and 800 nanometers. The conductive via is directly attached to the conductive trace through the insulative material, the positive-type photo-imageable dielectric is soluble in a photoresist developer upon exposure to the electromagnetic radiation, and the negative-type photo-imageable dielectric is insoluble in the photoresist developer upon exposure to the electromagnetic radiation.



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