View source for 18048972. SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR simplified abstract (NXP B.V.)

=SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR=


==Organization Name==

[[:Category:NXP B.V.|NXP B.V.]]


[[Category:NXP B.V.]]

==Inventor(s)==

[[:Category:Kuan-Hsiang Mao of Kaohsiung (CN)|Kuan-Hsiang Mao of Kaohsiung (CN)]][[Category:Kuan-Hsiang Mao of Kaohsiung (CN)]]

[[:Category:Zhiwei Gong of Chandler AZ (US)|Zhiwei Gong of Chandler AZ (US)]][[Category:Zhiwei Gong of Chandler AZ (US)]]

[[:Category:Neil Thomas Tracht of Paradise Valley AZ (US)|Neil Thomas Tracht of Paradise Valley AZ (US)]][[Category:Neil Thomas Tracht of Paradise Valley AZ (US)]]

==SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18048972 titled 'SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR

The abstract describes a method of forming a semiconductor device by affixing semiconductor dies on encapsulants and encapsulating them with another encapsulant, followed by the formation of a package substrate with conductive traces interconnected to the dies.

* Formation of a first cavity on a first encapsulant's major surface
* Affixing a first semiconductor die on the first major surface
* Affixing a second semiconductor die on the bottom surface of the first cavity
* Encapsulating the dies and exposed portions of the first major surface with a second encapsulant
* Forming a package substrate on the second encapsulant's major surface with conductive traces interconnected to the dies

Potential Applications:
- Semiconductor manufacturing
- Electronics industry
- Integrated circuit production

Problems Solved:
- Efficient encapsulation of semiconductor dies
- Interconnection of dies with package substrate

Benefits:
- Improved reliability of semiconductor devices
- Enhanced electrical connectivity
- Streamlined manufacturing process

Commercial Applications:
Title: Semiconductor Device Packaging Method
This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive electronics, enhancing their performance and durability.

Questions about Semiconductor Device Packaging Method:
1. How does this method improve the reliability of semiconductor devices?
This method ensures proper encapsulation and interconnection of semiconductor dies, reducing the risk of damage and improving overall device reliability.

2. What are the potential cost savings associated with using this packaging method?
By streamlining the manufacturing process and enhancing device reliability, this method can lead to cost savings in production and maintenance.


==Original Abstract Submitted==

A method of forming a semiconductor device is provided. The method includes forming a first cavity at a first major surface of a first encapsulant. A first semiconductor die is affixed on the first major surface of the first encapsulant and a second semiconductor die is affixed on a bottom surface of the first cavity. A second encapsulant encapsulates the first semiconductor die, the second semiconductor die, and at least exposed portions of the first major surface of the first encapsulant. A package substrate is formed on a first major surface of the second encapsulant. The package substrate includes conductive traces interconnected to the first semiconductor die and the second semiconductor die.



[[Category:H01L23/04]]
[[Category:H01L21/56]]
[[Category:H01L23/00]]
[[Category:H01L23/31]]
[[Category:H01L23/538]]
[[Category:CPC_H01L23/041]]