View source for 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)

=BUMPLESS HYBRID ORGANIC GLASS INTERPOSER=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Jeremy D. Ecton of Gilbert AZ (US)|Jeremy D. Ecton of Gilbert AZ (US)]][[Category:Jeremy D. Ecton of Gilbert AZ (US)]]

[[:Category:Brandon Christian Marin of Gilbert AZ (US)|Brandon Christian Marin of Gilbert AZ (US)]][[Category:Brandon Christian Marin of Gilbert AZ (US)]]

[[:Category:Aleksandar Aleksov of Chandler AZ (US)|Aleksandar Aleksov of Chandler AZ (US)]][[Category:Aleksandar Aleksov of Chandler AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Haobo Chen of Chandler AZ (US)|Haobo Chen of Chandler AZ (US)]][[Category:Haobo Chen of Chandler AZ (US)]]

==BUMPLESS HYBRID ORGANIC GLASS INTERPOSER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17988051 titled 'BUMPLESS HYBRID ORGANIC GLASS INTERPOSER

==Simplified Explanation==

The abstract describes a patent application for a bumpless hybrid organic glass interposer that utilizes high density pattern (HDP) routing layers to achieve electrical connections between layers.

* High density pattern (HDP) routing layers are placed on a separate carrier from the organic substrate package.
* The HDP layers are attached to the substrate package.
* Electrical connections are achieved through a self-align dry etch process via landing pads connected to the HDP routing.

== Potential Applications ==
The technology could be applied in various electronic devices such as smartphones, tablets, and computers to improve signal transmission and reduce interference.

== Problems Solved ==
This technology solves the problem of achieving reliable electrical connections between layers in electronic devices without the need for traditional bump structures.

== Benefits ==
The bumpless hybrid organic glass interposer offers improved signal integrity, reduced signal loss, and increased reliability in electronic devices.

== Potential Commercial Applications ==
The technology could be used in the manufacturing of high-performance electronic devices, leading to improved product quality and performance.

== Possible Prior Art ==
One possible prior art could be the use of traditional bump structures for achieving electrical connections between layers in electronic devices.

=== Unanswered Questions ===

=== How does the bumpless hybrid organic glass interposer compare to traditional bump structures in terms of performance and reliability? ===
The article does not provide a direct comparison between the bumpless hybrid organic glass interposer and traditional bump structures in terms of performance and reliability.

=== What are the potential challenges in implementing the bumpless hybrid organic glass interposer technology in mass production? ===
The article does not address the potential challenges in implementing the bumpless hybrid organic glass interposer technology in mass production, such as cost-effectiveness and scalability.


==Original Abstract Submitted==

A bumpless hybrid organic glass interposer. One or more high density pattern (HDP) routing layers are placed on a functional, thin, carrier, separate from the intended organic substrate patch or package. The HDP layer(s) is/are then attached to the substrate package. The interposers achieve electrical connections between the HDP layer and underlying routing layer of the substrate package by utilizing a self-align dry etch process through landing pads connected to the HDP routing.



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