View source for 17932765. ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)

=ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE=


==Organization Name==

[[:Category:HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP|HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP]]


[[Category:HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP]]

==Inventor(s)==

[[:Category:See Yun Yow of Singapore (SG)|See Yun Yow of Singapore (SG)]][[Category:See Yun Yow of Singapore (SG)]]

[[:Category:Kah Hoe Ng of Singapore (SG)|Kah Hoe Ng of Singapore (SG)]][[Category:Kah Hoe Ng of Singapore (SG)]]

[[:Category:Chien-Shuo Tang of Singapore (SG)|Chien-Shuo Tang of Singapore (SG)]][[Category:Chien-Shuo Tang of Singapore (SG)]]

==ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17932765 titled 'ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE

==Simplified Explanation==

The abstract describes an integrated circuit (IC) package with an electromagnetic shield to prevent electromagnetic interference (EMI) noise. The shield is made of a ferromagnetic material and is grounded to the printed circuit board (PCB) of the electronic device.

* The IC package includes a substrate, a chip, and an electromagnetic shield.
* The chip is connected to the substrate, and the shield encloses the chip between the substrate and itself.
* The shield protrudes beyond the substrate and is grounded to the PCB to prevent EMI noise from radiating through the IC package.

== Potential Applications ==
This technology could be applied in various electronic devices where EMI noise needs to be minimized, such as smartphones, tablets, laptops, and other consumer electronics.

== Problems Solved ==
This innovation solves the problem of EMI noise interference in electronic devices, which can affect their performance and reliability.

== Benefits ==
The technology provides improved EMI shielding, leading to better overall performance and reliability of electronic devices.

== Potential Commercial Applications ==
The technology could be valuable for manufacturers of electronic devices looking to enhance the quality and reliability of their products. A potential SEO-optimized title for this section could be "Commercial Applications of EMI Shielding Technology in Electronic Devices."

== Possible Prior Art ==
One possible prior art could be the use of traditional EMI shielding methods in electronic devices, such as metal enclosures or coatings. However, the specific implementation of using a ferromagnetic material for the shield and grounding it to the PCB may be a novel aspect of this technology.

=== Unanswered Questions ===

=== How does the ferromagnetic material of the shield contribute to EMI shielding in comparison to other materials? ===
The article does not delve into the specific properties of the ferromagnetic material used in the shield and how it enhances EMI shielding effectiveness.

=== Are there any limitations or drawbacks to this technology that should be considered? ===
The article does not address any potential limitations or drawbacks of implementing this EMI shielding technology in electronic devices.


==Original Abstract Submitted==

Example implementations relate to an integrated circuit (IC) package, an electronic device having the IC package, and a method of assembling the IC package to a printed circuit board (PCB) of the electronic device. The IC package includes a substrate, a chip, and an electromagnetic shield. The chip is coupled to the substrate. The electromagnetic shield is coupled to the substrate such that the chip is enclosed between the substrate and the electromagnetic shield. The electromagnetic shield includes a ferromagnetic material. Further, the electromagnetic shield protrudes beyond the substrate and is electrically grounded to the PCB to prevent an electromagnetic interference (EMI) noise from radiating through the IC package.



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