View source for 17918026. Electronic Device simplified abstract (Huawei Technologies Co., Ltd.)

=Electronic Device=


==Organization Name==

[[:Category:Huawei Technologies Co., Ltd.|Huawei Technologies Co., Ltd.]]


[[Category:Huawei Technologies Co., Ltd.]]

==Inventor(s)==

[[:Category:Chih Yu Tsai of Taipei (CN)|Chih Yu Tsai of Taipei (CN)]][[Category:Chih Yu Tsai of Taipei (CN)]]

[[:Category:Chien-Ming Lee of Shenzhen (CN)|Chien-Ming Lee of Shenzhen (CN)]][[Category:Chien-Ming Lee of Shenzhen (CN)]]

[[:Category:Hanyang Wang of Reading (GB)|Hanyang Wang of Reading (GB)]][[Category:Hanyang Wang of Reading (GB)]]

[[:Category:Dong Yu of Shanghai (CN)|Dong Yu of Shanghai (CN)]][[Category:Dong Yu of Shanghai (CN)]]

==Electronic Device - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17918026 titled 'Electronic Device

==Simplified Explanation==

An embodiment of this patent application describes an electronic device with a decoupling member, two radiators, two feed units, and a rear cover. The decoupling member is indirectly connected to the radiators and is located on the surface of the rear cover. There is a gap between the two radiators. The decoupling member does not overlap with the projections of the radiators on the rear cover in a specific direction.

* The electronic device includes a decoupling member, radiators, feed units, and a rear cover.
* A gap is present between the radiators.
* The decoupling member is indirectly connected to the radiators and is located on the rear cover's surface.
* The decoupling member does not overlap with the projections of the radiators on the rear cover in a specific direction.

Potential applications of this technology:

* Electronic devices with improved heat dissipation capabilities.
* Devices with reduced interference between components.
* Improved performance and reliability of electronic devices.

Problems solved by this technology:

* Overheating issues in electronic devices.
* Interference between components affecting device performance.
* Ensuring efficient heat dissipation in compact electronic devices.

Benefits of this technology:

* Enhanced heat dissipation capabilities.
* Improved performance and reliability of electronic devices.
* Reduction in interference between components.
* Compact design without compromising functionality.


==Original Abstract Submitted==

An embodiment of this application provides an electronic device, including a decoupling member, a first radiator, a second radiator, a first feed unit, a second feed unit, and a rear cover. A gap is formed between the first radiator and the second radiator, the decoupling member is indirectly coupled to the first radiator and the second radiator, and the decoupling member is disposed on a surface of the rear cover. The decoupling member does not overlap a first projection, and the first projection is a projection of the first radiator on the rear cover in a first direction. The decoupling member does not overlap a second projection, and the second projection is a projection of the second radiator on the rear cover in the first direction. The first direction is a direction perpendicular to a plane on which the rear cover is located.



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