View source for 17911345. ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)

=ELECTRONIC DEVICE=


==Organization Name==

[[:Category:HONOR DEVICE CO., LTD.|HONOR DEVICE CO., LTD.]]


[[Category:HONOR DEVICE CO., LTD.]]

==Inventor(s)==

[[:Category:Yinjiong Tan of Shenzhen (CN)|Yinjiong Tan of Shenzhen (CN)]][[Category:Yinjiong Tan of Shenzhen (CN)]]

[[:Category:Liang Bai of Shenzhen (CN)|Liang Bai of Shenzhen (CN)]][[Category:Liang Bai of Shenzhen (CN)]]

[[:Category:Chao Yao of Shenzhen (CN)|Chao Yao of Shenzhen (CN)]][[Category:Chao Yao of Shenzhen (CN)]]

[[:Category:Ruiying Shang of Shenzhen (CN)|Ruiying Shang of Shenzhen (CN)]][[Category:Ruiying Shang of Shenzhen (CN)]]

==ELECTRONIC DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17911345 titled 'ELECTRONIC DEVICE

==Simplified Explanation==

The electronic device described in the patent application includes a shell, a contact member, a temperature sensor, and a circuit board. The temperature sensor is connected to the circuit board and the contact member, allowing for temperature monitoring and control within the device.

* The shell of the electronic device has an accommodating space for the internal components.
* The contact member is positioned on the shell and forms part of the outer surface of the device.
* The temperature sensor, with positive and negative electrodes, is located within the accommodating space.
* The circuit board, also within the accommodating space, is connected to the temperature sensor and the contact member.
* The positive and negative wires on the circuit board are thermally conductively connected to the contact member.

== Potential Applications ==
This technology could be applied in various electronic devices that require temperature monitoring and control, such as smartphones, laptops, and wearables.

== Problems Solved ==
This innovation solves the problem of efficiently monitoring and controlling the temperature within electronic devices to prevent overheating and potential damage.

== Benefits ==
The benefits of this technology include improved device performance, increased safety, and extended lifespan of electronic devices.

== Potential Commercial Applications ==
This technology could be commercially applied in consumer electronics, medical devices, automotive systems, and industrial equipment for enhanced temperature management.

== Possible Prior Art ==
One possible prior art for this technology could be similar temperature control systems used in electronic devices, but with different configurations or components.

=== Unanswered Questions ===

=== How does this technology compare to existing temperature control systems in electronic devices? ===
This article does not provide a direct comparison between this technology and existing temperature control systems in electronic devices. 

=== What are the specific materials used in the construction of the shell, contact member, and circuit board in this electronic device? ===
The article does not detail the specific materials used in the construction of the shell, contact member, and circuit board in this electronic device.


==Original Abstract Submitted==

An electronic device includes a shell, a contact member, a temperature sensor, and a circuit board. The shell has an accommodating space. The contact member is arranged on the shell, and at least part of a surface of the contact member forms an outer surface of the electronic device. The temperature sensor is arranged in the accommodating space and has a positive electrode and a negative electrode. The circuit board is arranged in the accommodating space and provided with a positive wire and a negative wire. The positive wire is connected to the positive electrode of the temperature sensor. The negative wire is connected to the negative electrode of the temperature sensor. At least one of the positive wire and the negative wire is thermally conductively connected to the contact member.



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