View source for 17896039. CONDUCTIVE STRUCTURES simplified abstract (Micron Technology, Inc.)

=CONDUCTIVE STRUCTURES=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Daniel Billingsley of Meridian ID (US)|Daniel Billingsley of Meridian ID (US)]][[Category:Daniel Billingsley of Meridian ID (US)]]

[[:Category:Jaydip Guha of Boise ID (US)|Jaydip Guha of Boise ID (US)]][[Category:Jaydip Guha of Boise ID (US)]]

[[:Category:Marko Milojevic of Boise ID (US)|Marko Milojevic of Boise ID (US)]][[Category:Marko Milojevic of Boise ID (US)]]

[[:Category:Sau Ha Cheung of Boise ID (US)|Sau Ha Cheung of Boise ID (US)]][[Category:Sau Ha Cheung of Boise ID (US)]]

[[:Category:Luca Fumagalli of Rio Rancho NM (US)|Luca Fumagalli of Rio Rancho NM (US)]][[Category:Luca Fumagalli of Rio Rancho NM (US)]]

==CONDUCTIVE STRUCTURES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17896039 titled 'CONDUCTIVE STRUCTURES

==Simplified Explanation==

The patent application describes methods, apparatuses, and systems related to conductive structures. 

* A conductive structure is described, which includes:
  * A first conductive material made of a conductive metal nitride with a thickness of at least 0.5 nanometers.
  * A second conductive material made of a conductive metal, which is placed on a first surface of the first conductive material.

**Potential Applications:**

* This technology can be used in electronic devices such as sensors, transistors, and other semiconductor devices.
* It can also be applied in the manufacturing of integrated circuits and microprocessors.

**Problems Solved:**

* Provides improved conductivity and performance in electronic devices.
* Offers a more efficient and reliable method for creating conductive structures.

**Benefits:**

* Enhanced conductivity due to the use of conductive metal nitride.
* Increased durability and longevity of electronic devices.
* Improved efficiency and performance of semiconductor devices.


==Original Abstract Submitted==

Methods, apparatuses, and systems related to conductive structures are described. An example conductive structure includes a first conductive material including a conductive metal nitride, where the first conductive material has a thickness of at least 0.5 nanometers, and a second conductive material including a conductive metal, where the second conductive material is disposed on a first surface of the first conductive material.



[[Category:H01L27/108]]
[[Category:H01B1/02]]