View source for 17821920. Warpage Compensation for BGA Package simplified abstract (Apple Inc.)

=Warpage Compensation for BGA Package=


==Organization Name==

[[:Category:Apple Inc.|Apple Inc.]]


[[Category:Apple Inc.]]

==Inventor(s)==

[[:Category:Brett W. Degner of Menlo Park CA (US)|Brett W. Degner of Menlo Park CA (US)]][[Category:Brett W. Degner of Menlo Park CA (US)]]

[[:Category:Jie-Hua Zhao of Cupertino CA (US)|Jie-Hua Zhao of Cupertino CA (US)]][[Category:Jie-Hua Zhao of Cupertino CA (US)]]

[[:Category:Kristopher P. Laurent of Portola Valley CA (US)|Kristopher P. Laurent of Portola Valley CA (US)]][[Category:Kristopher P. Laurent of Portola Valley CA (US)]]

[[:Category:Michael E. Leclerc of Mountain View CA (US)|Michael E. Leclerc of Mountain View CA (US)]][[Category:Michael E. Leclerc of Mountain View CA (US)]]

[[:Category:Rangaraj Dhanasekaran of San Jose CA (US)|Rangaraj Dhanasekaran of San Jose CA (US)]][[Category:Rangaraj Dhanasekaran of San Jose CA (US)]]

[[:Category:Simon J. Trivett of Waterloo (CA)|Simon J. Trivett of Waterloo (CA)]][[Category:Simon J. Trivett of Waterloo (CA)]]

==Warpage Compensation for BGA Package - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17821920 titled 'Warpage Compensation for BGA Package

==Simplified Explanation==

The abstract describes an electronic assembly and method of assembly that involves bonding a stiffener structure to a module substrate opposite a ball grid array (BGA) package. The stiffener structure is bonded at an elevated temperature after the BGA package is bonded to maintain a flat or near-flat surface contour of the module substrate.

* The electronic assembly includes a stiffener structure bonded to the module substrate opposite the BGA package.
* The stiffener structure is shear bonded at an elevated temperature.
* The bonding of the stiffener structure is performed after the BGA package is bonded to the module substrate.
* The purpose of the stiffener structure is to maintain a flat or near-flat surface contour of the module substrate.

== Potential Applications ==
* Electronic manufacturing industry
* Circuit board assembly

== Problems Solved ==
* Ensures a flat or near-flat surface contour of the module substrate
* Provides stability and support to the electronic assembly

== Benefits ==
* Improved reliability and durability of electronic assemblies
* Reduces the risk of damage or failure due to uneven surfaces or warping


==Original Abstract Submitted==

Electronic assemblies and methods of assembly are described. In an embodiment, an electronic assembly includes a stiffener structure shear bonded to an opposite side of a module substrate from a ball grid array (BGA) package. The stiffener structure may be shear bonded at elevated temperature after bonding of the BGA package to lock in a flat or near-flat surface contour of the module substrate.



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