View source for 17769825. DRIVING SUBSTRATE, LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF, AND SPLICING DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)

=DRIVING SUBSTRATE, LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF, AND SPLICING DISPLAY APPARATUS=


==Organization Name==

[[:Category:BOE Technology Group Co., Ltd.|BOE Technology Group Co., Ltd.]]


[[Category:BOE Technology Group Co., Ltd.]]

==Inventor(s)==

[[:Category:Xinhong Lu of Beijing (CN)|Xinhong Lu of Beijing (CN)]][[Category:Xinhong Lu of Beijing (CN)]]

[[:Category:Xiaoyan Zhu of Beijing (CN)|Xiaoyan Zhu of Beijing (CN)]][[Category:Xiaoyan Zhu of Beijing (CN)]]

[[:Category:Chao Liu of Beijing (CN)|Chao Liu of Beijing (CN)]][[Category:Chao Liu of Beijing (CN)]]

[[:Category:Shuilang Dong of Beijing (CN)|Shuilang Dong of Beijing (CN)]][[Category:Shuilang Dong of Beijing (CN)]]

[[:Category:Jiushi Wang of Beijing (CN)|Jiushi Wang of Beijing (CN)]][[Category:Jiushi Wang of Beijing (CN)]]

[[:Category:Liuqing Li of Beijing (CN)|Liuqing Li of Beijing (CN)]][[Category:Liuqing Li of Beijing (CN)]]

==DRIVING SUBSTRATE, LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF, AND SPLICING DISPLAY APPARATUS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17769825 titled 'DRIVING SUBSTRATE, LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF, AND SPLICING DISPLAY APPARATUS

The driving substrate, light-emitting apparatus, and manufacturing method described in the patent application involve a unique structure that allows for bending along a specific axis.

* The driving substrate consists of a device disposing area, a bending area, and a bonding area.
* Each area of the driving substrate includes a buffer layer, a first conductive layer, and a flexible dielectric layer stacked in sequence.
* The device disposing area and bonding area also have a base plate and a second conductive layer on opposite sides of the buffer and dielectric layers.
* The driving substrate in the bending area is designed to bend along a specific axis, providing flexibility in display applications.

Potential Applications:
- This technology can be used in flexible display screens for smartphones, tablets, and other electronic devices.
- It can also be applied in curved or foldable displays for smartwatches, TVs, and automotive displays.

Problems Solved:
- Traditional rigid substrates limit the design and functionality of displays, whereas this flexible driving substrate allows for innovative form factors and applications.

Benefits:
- Enables the creation of bendable and curved displays with improved durability and performance.
- Enhances the user experience by offering unique display designs and functionalities.

Commercial Applications:
Title: Flexible Driving Substrate for Innovative Display Applications
This technology has significant commercial potential in the consumer electronics industry, particularly in the development of next-generation display technologies for various devices.

Questions about the technology:
1. How does the flexible driving substrate improve the user experience compared to traditional rigid substrates?
2. What are the key challenges in manufacturing and implementing this technology in commercial display products?


==Original Abstract Submitted==

A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.



[[Category:H01L25/075]]
[[Category:H01L25/16]]
[[Category:H01L33/62]]
[[Category:CPC_H01L25/0753]]