View source for 17704676. SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:SEUNGCHUL Lee of HWASEONG-SI (KR)|SEUNGCHUL Lee of HWASEONG-SI (KR)]][[Category:SEUNGCHUL Lee of HWASEONG-SI (KR)]]

[[:Category:DONGIL Kim of HWASEONG-SI (KR)|DONGIL Kim of HWASEONG-SI (KR)]][[Category:DONGIL Kim of HWASEONG-SI (KR)]]

[[:Category:HYUNJOON Park of SUWON-SI (KR)|HYUNJOON Park of SUWON-SI (KR)]][[Category:HYUNJOON Park of SUWON-SI (KR)]]

[[:Category:KIJU Sohn of GUNPO-SI (KR)|KIJU Sohn of GUNPO-SI (KR)]][[Category:KIJU Sohn of GUNPO-SI (KR)]]

[[:Category:JONGHUN Pi of GUNWI-GUN (KR)|JONGHUN Pi of GUNWI-GUN (KR)]][[Category:JONGHUN Pi of GUNWI-GUN (KR)]]

==SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17704676 titled 'SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD

==Simplified Explanation==

The abstract describes a slurry supply device that consists of a slurry distribution part and a support part. The slurry distribution part includes a guide bar with a slot, a distribution bar inserted into the slot, and a slurry delivery member.

* The slurry distribution part dispenses slurry, while the support part provides support for the distribution part.
* The guide bar has a slot that extends in a first direction.
* The distribution bar is inserted into the slot and has a distribution channel that also extends in the first direction.
* The distribution channel is recessed upwardly from the bottom surface of the distribution bar.
* The slurry delivery member is responsible for delivering the slurry to the distribution channel.

Potential applications of this technology:

* Slurry supply devices can be used in various industries that require the dispensing of slurry, such as construction, mining, and manufacturing.
* It can be utilized in processes that involve coating, polishing, or grinding surfaces with slurry-based materials.
* The device can be integrated into automated systems for efficient and precise slurry distribution.

Problems solved by this technology:

* The slurry supply device provides a controlled and efficient way of dispensing slurry, ensuring uniform distribution.
* The recessed distribution channel prevents slurry from overflowing or spilling during the dispensing process.
* The support part ensures stability and prevents any potential damage to the slurry distribution part.

Benefits of this technology:

* The slurry supply device improves the accuracy and consistency of slurry distribution, leading to better quality results.
* It reduces waste and minimizes the risk of slurry spills or accidents.
* The device is easy to use and can be integrated into existing systems or processes without significant modifications.


==Original Abstract Submitted==

A slurry supply device includes; a slurry distribution part configured to dispense slurry, and a support part connected to the slurry distribution part and configured to support the slurry distribution part. The slurry distribution part includes; a guide bar including a slot extending in a first direction, a distribution bar inserted into the slot and including a distribution channel extending in the first direction, the distribution channel being recessed upwardly from a bottom surface of the distribution bar, and a slurry delivery member configured to deliver slurry to the distribution channel.



[[Category:B24B57/02]]
[[Category:H01L21/306]]