View source for 17702259. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)

=SEMICONDUCTOR PACKAGE=


==Organization Name==

[[:Category:Samsung Electronics Co., Ltd.|Samsung Electronics Co., Ltd.]]


[[Category:Samsung Electronics Co., Ltd.]]

==Inventor(s)==

[[:Category:Yong Ho Kim of Hwaseong-si (KR)|Yong Ho Kim of Hwaseong-si (KR)]][[Category:Yong Ho Kim of Hwaseong-si (KR)]]

[[:Category:Bo In Noh of Suwon-si (KR)|Bo In Noh of Suwon-si (KR)]][[Category:Bo In Noh of Suwon-si (KR)]]

[[:Category:Jeong Hoon Ahn of Seongnam-si (KR)|Jeong Hoon Ahn of Seongnam-si (KR)]][[Category:Jeong Hoon Ahn of Seongnam-si (KR)]]

==SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17702259 titled 'SEMICONDUCTOR PACKAGE

==Simplified Explanation==

The patent application describes a semiconductor package that includes a first stack with a first semiconductor substrate, a through via that penetrates the substrate, and a second stack with a second face facing the first stack. The package also includes a first pad in contact with the through via on the first face of the first stack, and a second pad with a concave inner side face on the second face of the second stack. A bump connects the first pad and the second pad, with a first upper bump on the first pad and a first lower bump between the first upper bump and the first pad.

* The semiconductor package includes a first and second stack with a through via that allows for electrical connections between the stacks.
* The first pad on the first stack is in contact with the through via, providing a connection point for electrical signals.
* The second pad on the second stack has a concave inner side face that creates an insertion recess for the bump.
* The bump connects the first pad and the second pad, with a first upper bump and a first lower bump providing the connection.

==Potential Applications==
* This semiconductor package can be used in various electronic devices that require compact and efficient electrical connections.
* It can be applied in mobile devices, computers, automotive electronics, and other electronic systems.

==Problems Solved==
* The semiconductor package solves the problem of providing a reliable and efficient electrical connection between different semiconductor substrates.
* It addresses the need for compact and space-saving designs in electronic devices.

==Benefits==
* The use of through vias and pads allows for efficient electrical connections between different semiconductor substrates.
* The concave inner side face of the second pad provides a secure and stable insertion recess for the bump.
* The design of the bump ensures a reliable and durable connection between the first and second pads.


==Original Abstract Submitted==

A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the through via, on the first face of the first stack; a second pad including a concave inner side face that defines an insertion recess, the second pad located on the second face of the second stack; and a bump that connects the first pad and the second pad, wherein the bump includes a first upper bump on the first pad, and a first lower bump between the first upper bump and the first pad.



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