View source for 17547700. INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

=INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS OF FORMING THE SAME=


==Organization Name==

[[:Category:SAMSUNG ELECTRONICS CO., LTD.|SAMSUNG ELECTRONICS CO., LTD.]]


[[Category:SAMSUNG ELECTRONICS CO., LTD.]]

==Inventor(s)==

[[:Category:Byounghak Hong of Albany NY (US)|Byounghak Hong of Albany NY (US)]][[Category:Byounghak Hong of Albany NY (US)]]

[[:Category:Hoonseok Seo of Albany NY (US)|Hoonseok Seo of Albany NY (US)]][[Category:Hoonseok Seo of Albany NY (US)]]

[[:Category:Seungchan Yun of Waterford NY (US)|Seungchan Yun of Waterford NY (US)]][[Category:Seungchan Yun of Waterford NY (US)]]

[[:Category:Inchan Hwang of Schenectady NY (US)|Inchan Hwang of Schenectady NY (US)]][[Category:Inchan Hwang of Schenectady NY (US)]]

[[:Category:Kang-ill Seo of Albany NY (US)|Kang-ill Seo of Albany NY (US)]][[Category:Kang-ill Seo of Albany NY (US)]]

==INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17547700 titled 'INTEGRATED CIRCUIT DEVICES INCLUDING A METAL RESISTOR AND METHODS OF FORMING THE SAME

==Simplified Explanation==

The abstract describes a patent application for integrated circuit devices that include a metal resistor. The devices consist of a substrate with a first and second surface, a transistor with a gate electrode, and first and second resistor contacts. The metal resistor has a third and fourth surface, with the fourth surface being closer to the second surface of the substrate and contacting the first and second resistor contacts.

* The patent application is for integrated circuit devices with a metal resistor.
* The devices include a substrate, a transistor, and first and second resistor contacts.
* The metal resistor has a third and fourth surface, with the fourth surface contacting the first and second resistor contacts.
* The fourth surface of the metal resistor is closer to the second surface of the substrate.
* The first surface of the substrate faces the gate electrode of the transistor.

== Potential Applications ==
* Integrated circuit devices with metal resistors can be used in various electronic devices.
* This technology can be applied in the manufacturing of computer chips and other electronic components.

== Problems Solved ==
* The integration of a metal resistor in an integrated circuit device solves the problem of limited space on the substrate.
* The metal resistor allows for more efficient and compact designs of integrated circuits.

== Benefits ==
* The use of a metal resistor in integrated circuit devices provides improved performance and functionality.
* The compact design of the devices allows for more efficient use of space on the substrate.
* The metal resistor enhances the overall reliability and durability of the integrated circuit devices.


==Original Abstract Submitted==

Integrated circuit devices including a metal resistor and methods of forming the same are provided. The integrated circuit devices may include a substrate including a first surface and a second surface that is opposite the first surface and is parallel to the first surface, a transistor including a gate electrode, first and second resistor contacts that are spaced apart from each other in a horizontal direction that is parallel to the second surface of the substrate, and a metal resistor. The first surface of the substrate may face the gate electrode. The metal resistor may include a third surface and a fourth surface that is parallel to the third surface and the second surface of the substrate, and the fourth surface of the metal resistor may be closer to the second surface than the first surface and contacts the first and second resistor contacts.



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