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Category:H10B80/00
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Pages in category "H10B80/00"
The following 200 pages are in this category, out of 932 total.
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- 17893654. WORD LINE DRIVERS FOR MULTIPLE-DIE MEMORY DEVICES simplified abstract (Micron Technology, Inc.)
- 18070602. ELECTRONIC MODULE AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation)
- 18087384. HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract (International Business Machines Corporation)
- 18089488. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089495. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089506. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18089632. EFFICIENT AUTOCATALYTIC METALLIZATION OF POLYMERIC SURFACES simplified abstract (Applied Materials, Inc.)
- 18090049. THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18090216. PROGRAMMABLE HYBRID MEMORY AND CAPACITIVE DEVICE IN A DRAM PROCESS simplified abstract (XILINX, INC.)
- 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18091264. STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE simplified abstract (Intel Corporation)
- 18098987. SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099697. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18099715. METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18103747. SEMICONDUCTOR CHIP HAVING CHAMFER REGION FOR CRACK PREVENTION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18108657. MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
- 18109392. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18111676. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18117736. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18118775. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18119270. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18119272. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18120038. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18121374. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18122285. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125958. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18132171. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18132749. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18133105. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18134314. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18134344. SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18135623. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18140960. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18142872. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18143127. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18144350. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18148338. MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 18148528. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation)
- 18151545. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152171. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152665. Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18154261. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18154329. SEMICONDUCTOR PACKAGE FIXTURE AND METHODS OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18159111. FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS simplified abstract (International Business Machines Corporation)
- 18163378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18163412. STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18164212. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18165412. STACK-TYPE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18165772. Thermal Dissipation Structures and Methods for Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18166322. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18167081. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18171428. PACKAGE DIES INCLUDING VERTICAL INTERCONNECTS FOR SIGNAL AND POWER DISTRIBUTION IN A THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18174865. SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18176695. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18178229. SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18178371. SEMICONDUCTOR DEVICE WITH STACKED MEMORY PERIPHERY AND ARRAY AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18179646. TEMPLATING LAYERS FOR SPIN ORBIT TORQUE ASSISTED SWITCHING OF PERPENDICULARLY MAGNETIZED HEUSLER FILMS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18179646. TEMPLATING LAYERS FOR SPIN ORBIT TORQUE ASSISTED SWITCHING OF PERPENDICULARLY MAGNETIZED HEUSLER FILMS simplified abstract (Samsung Electronics Co., Ltd.)
- 18180188. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18180366. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18180437. SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS simplified abstract (Samsung Electronics Co., Ltd.)
- 18181148. SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Kioxia Corporation)
- 18181731. SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18184222. HETEROGENEOUS INTEGRATION FOR MEMRISTOR-BASED HARDWARE ACCELERATORS simplified abstract (HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP)
- 18184527. Upside-Down DRAM Package Structure simplified abstract (Apple Inc.)
- 18185248. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18186209. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18186229. STACKED RESISTIVE RANDOM-ACCESS MEMORY CROSS-POINT CELL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18187803. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18188311. THREE DIMENSIONAL NON-VOLATILE MEMORY DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18188627. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18189299. DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18191212. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18197258. MEMORY DEVICE INCLUDING PAGE BUFFER CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18197283. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199553. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18202019. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18202249. SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS AND BACK-END INTERFACE CONTACTS, AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18206785. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18207475. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18208459. SEMICONDUCTOR DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18209820. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18212323. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM COMPRISING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216521. HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18216632. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18218886. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18219697. SEMICONDUCTOR DEVICE HAVING COMMON SOURCE LINE LAYER, ELECTRONIC SYSTEM INCLUDING THE SAME, AND RELATED METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18220053. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18222278. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18222567. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18226534. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226990. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18233296. MEMORY PACKAGE EXPANSION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18233974. METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS (Yangtze Memory Technologies Co., Ltd.)
- 18234092. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18234325. 3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION (Yangtze Memory Technologies Co., Ltd.)
- 18235033. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18235643. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18236607. METHOD OF FABRICATING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18238099. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18239504. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEMS INCLUDING A SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18241531. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18243437. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18244429. NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
- 18295518. MAGNETIC SHIELDING FOR MAGNETO RESISTIVE MEMORY simplified abstract (Honeywell International Inc.)
- 18297266. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18298702. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18299896. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18300975. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18301374. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18301706. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18303641. CHIP PACKAGE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18303659. SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC INTERFERENCE AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18308222. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18308358. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18309149. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18309250. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18312331. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18313491. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18315432. SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract (SK hynix Inc.)
- 18315689. HIGHLY INTEGRATED SEMICONDUCTOR DEVICE CONTAINING MULTIPLE BONDED DIES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18317274. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18320455. MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE simplified abstract (SK hynix Inc.)
- 18322040. HIGHLY VERTICALLY INTEGRATED NONVOLATILE MEMORY DEVICES AND MEMORY SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18322774. SOLDERING DEVICE INCLUDING PULSED LIGHT IRRADIATOR, SOLDERING METHOD USING PULSED LIGHT IRRADIATION, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18322842. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323440. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE ANDELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18323528. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18331977. SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18334100. METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LAYER AND SEMICONDUCTOR PACKAGE MANUFACTURED BY USING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18336413. MIM Capacitor in IC Heterogenous Integration (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18336775. DYNAMIC RANDOM-ACCESS MEMORY (DRAM) ON HOT COMPUTE LOGIC FOR LAST-LEVEL-CACHE APPLICATIONS (QUALCOMM Incorporated)
- 18336791. BACK END DIELECTRIC-BASED MEMORY STRUCTURE IN A SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18337040. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18337113. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18337180. INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18340101. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18340193. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18340193. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 18340733. PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18341490. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18342182. SOLID STATE DRIVE APPARATUS AND DATA STORAGE APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18343011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18344927. SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18346921. CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18348591. SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNAL SHARED BY LOWER AND UPPER BYTES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18352177. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18353621. THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A MID-STACK SOURCE LAYER AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)
- 18355004. SEMICONDUCTOR CHIP STACK STRUCTURE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFACTURING THEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18355450. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18355718. SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18356289. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18356324. SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18357484. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18358727. THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION simplified abstract (SanDisk Technologies LLC)
- 18360056. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18360711. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18361189. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18362688. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)
- 18363000. NON-VOLATILE MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364127. MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18367619. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18367704. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18368760. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18370913. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18370940. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18370949. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374123. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374310. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374392. MEMORY DEVICE INCLUDING STACKED PASS TRANSISTORS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18374718. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18375173. SEMICONDUCTOR MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380222. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18380854. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18380876. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18381905. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18387682. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18389251. SEMICONDUCTOR DEVICE INCLUDING A THREE-DIMENSIONAL INTEGRATED CIRCUIT simplified abstract (Samsung Electronics Co., Ltd.)
- 18390258. VERTICAL TYPE MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18391844. SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18393132. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (SK hynix Inc.)
- 18394575. HEAT DISSIPATION STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.)
- 18394974. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)