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Category:H05K3/36
Subcategories
This category has the following 12 subcategories, out of 12 total.
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Pages in category "H05K3/36"
The following 51 pages are in this category, out of 51 total.
1
- 17779836. DISPLAY SCREEN AND MANUFACTURING METHOD THEREOF simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 18022376. CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)
- 18069004. HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)
- 18090383. ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract (Intel Corporation)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18497420. SYSTEMS AND METHOD FOR IMPEDANCE MATCHING ACROSS SUBASSEMBLIES (Dell Products L.P.)
- 18525280. BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT simplified abstract (SAMSUNG SDI CO., LTD.)
- 18576236. SUBSTRATE JOINING STRUCTURE simplified abstract (Mitsubishi Electric Corporation)
- 18582059. ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18653496. ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18666091. ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18724156. CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE (HUAWEI TECHNOLOGIES CO., LTD.)
- 18728619. ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME (Telefonaktiebolaget LM Ericsson (publ))
- 18819312. STRETCHABLE DEVICE (Murata Manufacturing Co., Ltd.)
- 18820555. STRETCHABLE DEVICE (Murata Manufacturing Co., Ltd.)
B
C
- Canon kabushiki kaisha (20240107670). ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS simplified abstract
- Canon kabushiki kaisha (20240306306). ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS simplified abstract
- CANON KABUSHIKI KAISHA patent applications on March 28th, 2024
- CANON KABUSHIKI KAISHA patent applications on September 12th, 2024
D
H
I
- Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract
- Intel corporation (20240292539). CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD simplified abstract
- Intel corporation (20240405459). Modular Printed Circuit Boards with Connectors
- Intel corporation (20240405459). Modular Printed Circuit Boards with Connectors simplified abstract
- Intel Corporation patent applications on August 29th, 2024
- Intel Corporation patent applications on December 5th, 2024
- Intel Corporation patent applications on July 4th, 2024
M
- Meta platforms technologies, llc (20240121882). THERMOPLASTIC INTERPOSER simplified abstract
- Meta Platforms Technologies, LLC patent applications on April 11th, 2024
- Mitsubishi electric corporation (20240314943). SUBSTRATE JOINING STRUCTURE simplified abstract
- Mitsubishi Electric Corporation patent applications on September 19th, 2024
- Murata manufacturing co., ltd. (20240422918). STRETCHABLE DEVICE
- Murata manufacturing co., ltd. (20240422919). STRETCHABLE DEVICE
- Murata Manufacturing Co., Ltd. patent applications on December 19th, 2024
Q
S
- Samsung display co., ltd. (20240284594). ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF simplified abstract
- Samsung Display Co., LTD. patent applications on August 22nd, 2024
- Samsung electronics co., ltd. (20240195895). ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE simplified abstract
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024