There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H05K1/18
Jump to navigation
Jump to search
(previous page) (next page)
Subcategories
This category has the following 118 subcategories, out of 118 total.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
W
X
Y
Z
Pages in category "H05K1/18"
The following 200 pages are in this category, out of 535 total.
(previous page) (next page)1
- 17383241. PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD simplified abstract (QUALCOMM Incorporated)
- 17621252. DISPLAY MODULE AND SEAMLESS SPLICING DISPLAY DEVICE simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17709920. INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17815838. CONFIGURABLE CARD CONNECTOR simplified abstract (Dell Products L.P.)
- 17818722. ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17825508. BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17828501. ULTRAVIOLET (UV) LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)
- 17849453. LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE simplified abstract (Microsoft Technology Licensing, LLC)
- 17867016. WIRELESS POWER TRANSMISSION APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 17870977. ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17873385. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17877729. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 17887834. ELECTRONIC DEVICE INCLUDING CONDUCTIVE FIXING MEMBER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17894070. SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT simplified abstract (Micron Technology, Inc.)
- 17908759. Circuit Board, Electronic Device, and Production Method for Circuit Board simplified abstract (HONOR DEVICE CO., LTD.)
- 17911345. ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)
- 17912531. FLEXIBLE BATTERY, CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17914644. CURVED SCREEN BENDING DEVICE AND CURVED SCREEN BENDING METHOD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17915707. DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17927576. WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (BOE Technology Group Co., Ltd.)
- 17955796. EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17956383. Compact Optical System For A VCSEL Based Laser Aim Pattern Generator simplified abstract (ZEBRA TECHNOLOGIES CORPORATION)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17957697. ELECTRONIC DEVICE INCLUDING COIN-CELL BATTERY simplified abstract (Samsung Electronics Co., Ltd.)
- 17965378. SPEAKER WITH POROUS SHEET AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17967870. CAMERAS FOR SMALL FORM FACTOR DEVICES (Meta Platforms Technologies, LLC)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17992543. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17994058. ELECTRONIC DEVICE INCLUDING CABLE CONNECTOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18016679. Display Module and Display Device simplified abstract (BOE Technology Group Co., Ltd.)
- 18016845. DISPLAY APPARATUS AND METHOD FOR DRIVING DISPLAY APPARATUS simplified abstract (BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.)
- 18016845. DISPLAY APPARATUS AND METHOD FOR DRIVING DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18022379. DISPLAY MODULE AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18022379. DISPLAY MODULE AND DISPLAY DEVICE simplified abstract (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 18022418. DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18083033. ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18085775. ELECTRONIC DEVICE AND METHOD OF ESTIMATING BODY TEMPERATURE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18089489. SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION simplified abstract (Intel Corporation)
- 18089877. INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS simplified abstract (Intel Corporation)
- 18090214. ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18122891. VOLTAGE REGULATOR MODULE HAVING A POWER STAGE simplified abstract (Infineon Technologies Austria AG)
- 18124101. SYSTEMS, APPARATUSES, METHODS, AND NON-TRANSITORY COMPUTER-READABLE STORAGE DEVICES FOR DE-SERIALIZING AND SERIALIZING DATA TRANSMISSION simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18147270. ANTENNA MODULE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE ANTENNA MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18148017. FASTENER AND SEALANT simplified abstract (LEAR CORPORATION)
- 18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18161394. ANTENNA HAVING SINGLE NON-CONDUCTIVE PORTION AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18164788. CIRCUIT BOARD HAVING ELECTROMAGNETIC SHIELDING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18171083. ROUGHNESS EDGE OF A HEAT SINK simplified abstract (Dell Products L.P.)
- 18173767. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18181929. SIGNAL TRANSMISSION DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18181929. SIGNAL TRANSMISSION DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18188297. ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT simplified abstract (Intel Corporation)
- 18191787. Forming Trench In IC Chip Through Multiple Trench Formation And Deposition Processes simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18213005. ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18221430. CONTROL CIRCUIT AND POWER SUPPLY DEVICE simplified abstract (SHARP KABUSHIKI KAISHA)
- 18221893. DISPLAY DEVICE AND METHOD OF DRIVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18243250. COMPOSITE ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18263271. Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18264093. ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE (BOE TECHNOLOGY GROUP CO., LTD.)
- 18273222. WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE simplified abstract (KYOCERA Corporation)
- 18273277. TOUCH DISPLAY DEVICE AND DISPLAY SYSTEM simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18273277. TOUCH DISPLAY DEVICE AND DISPLAY SYSTEM simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 18276476. COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, ELECTRONIC DEVICE (BOE TECHNOLOGY GROUP CO., LTD.)
- 18276636. FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE (BOE TECHNOLOGY GROUP CO., LTD.)
- 18278967. ELECTRONIC SUBSTRATE simplified abstract (LG INNOTEK CO., LTD.)
- 18293247. ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE simplified abstract (KYOCERA Corporation)
- 18331759. SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT simplified abstract (CANON KABUSHIKI KAISHA)
- 18336096. FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18343993. DEFLECTION SPRING COMPRESSION MOUNTING (Intel Corporation)
- 18352580. WEARABLE ELECTRONIC DEVICE COMPRISING DAMPING STRUCTURE OF CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18357379. SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT simplified abstract (Western Digital Technologies, Inc.)
- 18364578. DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18372990. DISPLAY APPARATUS simplified abstract (Samsung Display Co., LTD.)
- 18373776. CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18382321. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18387351. FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18397108. FLEXIBLE DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18405268. ELECTRONIC DEVICE COMPRISING CAMERA MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18417033. CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A LIGHTING SYSTEM WITH LED LIGHTS simplified abstract (Musco Corporation)
- 18418364. MINIATURE SPEAKER simplified abstract (AAC Microtech (Changzhou) Co., Ltd.)
- 18418513. RADIO FREQUENCY FRONT-END STRUCTURES simplified abstract (Intel Corporation)
- 18420769. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJIFILM Corporation)
- 18421196. METHOD FOR EFFICIENTLY CONNECTING MANY HIGH DENSITY SMT PCB/BACKPLANE CONNECTORS FOR GREATEST PCB EDGE EFFICIENCY (SAMSUNG ELECTRONICS CO., LTD.)
- 18432021. ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18435032. STRETCHABLE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18438124. CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18441334. APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18442812. METHOD OF HUB COMMUNICATION, PROCESSING, STORAGE AND DISPLAY simplified abstract (Cilag GmbH International)
- 18444152. SPEAKER simplified abstract (ALPS ALPINE CO., LTD.)
- 18446820. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18453682. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Kabushiki Kaisha Toshiba)
- 18453682. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18455234. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18455558. DUAL SWITCHING POWER DEVICE (Texas Instruments Incorporated)
- 18461268. SEMICONDUCTOR DEVICE AND CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18464259. CHIP ON FILMS AND DISPLAY MODULES simplified abstract (Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.)
- 18465803. LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE simplified abstract (NICHIA CORPORATION)
- 18467062. PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE RELATIVE TO SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18468474. IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION (QUALCOMM Incorporated)
- 18475392. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18483870. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18483884. CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18506538. Electronic Device simplified abstract (SEIKO EPSON CORPORATION)
- 18514973. IMAGE FORMING APPARATUS AND CIRCUIT BOARD FOR IMAGE FORMING APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18520338. DISPLAY DEVICE, PHOTOMASK, AND MANUFACTURING METHOD OF DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18523280. INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18524845. PANEL ALIGNMENT DEVICE AND PANEL ALIGNMENT METHOD FOR DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18524932. DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18526389. MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING MULTILAYER ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18529346. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18538822. WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE WIRE CAPACITOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18542843. ELECTRONIC MODULE AND CONTACT ARRANGEMENT simplified abstract (Robert Bosch GmbH)
- 18543094. COIL DEVICE simplified abstract (TDK CORPORATION)
- 18546796. CIRCUIT BOARD HAVING COMPOSITE MAGNETIC COMPONENTS MOUNTED THEREON simplified abstract (LG INNOTEK CO., LTD.)
- 18547999. MULTI-HUNDRED OR THOUSAND CHANNEL ELECTRODE ELECTROPHYSIOLOGICAL ARRAY AND FABRICATION METHOD simplified abstract (THE REGENTS OF THE UNIVERSITY OF CALIFORNIA)
- 18551598. ELECTRONIC CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (SONY GROUP CORPORATION)
- 18560149. CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 18560671. CIRCUIT BOARD, CHIP ON FILM, DISPLAY APPARATUS AND BONDING METHOD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18564139. POWER CONVERSION DEVICE simplified abstract (Hitachi Astemo, Ltd.)
- 18577077. CIRCUIT BOARD simplified abstract (LG INNOTEK CO., LTD.)
- 18583215. STORAGE DEVICE (Samsung Electronics Co., Ltd.)
- 18585498. BARRIER LAYER FOR AN ELECTRICAL DEVICE simplified abstract (Honeywell International Inc.)
- 18587832. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJIFILM Corporation)
- 18588294. SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER simplified abstract (NEC Corporation)
- 18588633. SEMICONDUCTOR STORAGE DEVICE simplified abstract (Kioxia Corporation)
- 18588729. CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18588800. System and method for determining product count information using magnetic sensors simplified abstract (7-Eleven, Inc.)
- 18594754. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18595991. FLOW SENSING DEVICE AND ASSOCIATED METHOD simplified abstract (Honeywell International Inc.)
- 18598579. ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18602648. POWER SUPPLY SYSTEM, RADIO FREQUENCY SYSTEM, COMMUNICATION DEVICE, AND TRACKER MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18603113. METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS simplified abstract (STMicroelectronics International N.V.)
- 18609928. APPARATUSES INCLUDING ONE OR MORE SEMICONDUCTOR DEVICES AND RELATED SYSTEMS simplified abstract (MICRON TECHNOLOGY, INC.)
- 18610035. POWER MODULE AND ELECTRICAL DEVICE simplified abstract (BYD COMPANY LIMITED)
- 18610141. STAGGERED FLIP PIN SMT CONNECTOR TO REDUCE CROSSTALK ON HIGH-SPEED CHANNELS simplified abstract (Intel Corporation)
- 18614822. DISPLAY DEVICE simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18618181. ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18621775. DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18622813. DUAL IN-LINE MEMORY MODULE RETAINER simplified abstract (Intel Corporation)
- 18625500. SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18627096. ELECTRONIC DEVICE INCLUDING SUPPORTING STRUCTURE FOR PRINTED CIRCUIT BOARD (SAMSUNG ELECTRONICS CO., LTD.)
- 18631273. IMAGE DISPLAY DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18632935. WATERPROOF MEMBRANE ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18633698. CONTROL BOARD AND METHOD FOR MANUFACTURING SAME (Hitachi, Ltd.)
- 18637095. PRESS APPARATUS AND PRESSING METHOD THEREOF simplified abstract (Samsung Display Co., LTD.)
- 18638231. Battery Connector simplified abstract (Google LLC)
- 18641420. FLEXIBLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF simplified abstract (BOE Technology Group Co., Ltd.)
- 18660945. CIRCUIT BOARD REINFORCING STRUCTURE, PHOTOSENSITIVE APPARATUS, AND TERMINAL simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18666570. ELECTRONIC DEVICE INCLUDING SHIELDING STRUCTURE FOR REDUCING MOUNTING VOLUME OF COMPONENT simplified abstract (Samsung Electronics Co., Ltd.)
- 18672545. PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18676546. POWER SUPPLY UNIT FOR AEROSOL INHALER simplified abstract (Japan Tobacco Inc.)
- 18676986. CAPACITOR AND ELECTRONIC DEVICE WITH THE CAPACITOR MOUNTED THEREON (Samsung Electronics Co., Ltd.)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18685137. ELECTRONIC ASSEMBLY HAVING A POWER SEMICONDUCTOR COMPONENT BETWEEN TWO CIRCUIT CARRIERS, AND METHOD FOR PRODUCING SAME simplified abstract (Robert Bosch GmbH)
- 18697777. IMAGE DISPLAY DEVICE LAMINATE, IMAGE DISPLAY DEVICE, AND MODULE (DAI NIPPON PRINTING CO., LTD.)
- 18702389. DISPLAY MODULE AND DISPLAY DEVICE (BOE TECHNOLOGY GROUP CO., LTD.)
- 18703702. PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS (BOE TECHNOLOGY GROUP CO., LTD.)
- 18705669. CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY (Telefonaktiebolaget LM Ericsson (publ))
- 18708255. MODULE, IMAGE DISPLAY DEVICE LAMINATE, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD OF MODULE, AND WIRING BOARD (DAI NIPPON PRINTING CO., LTD.)
- 18726707. CIRCUIT BOARD (LG Innotek Co., Ltd.)
- 18731522. PACKAGING STRUCTURE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18732247. BATTERY SYSTEM WITH A FLEXIBLE PRINTED CIRCUIT simplified abstract (Samsung SDI Co., Ltd.)
- 18746667. ELECTRONIC APPARATUS INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18747085. Head-Mounted Electronic Display Device With Lens Position Sensing simplified abstract (Apple Inc.)
- 18751647. PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICONDUCTOR CHIP DEVICE (Infineon Technologies AG)
- 18758031. FERRITE BEAD, BIAS CIRCUIT, OPTICAL MODULE, AND COMMUNICATION DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18792346. SOLID STATE TRANSFORMER AND STACK-UP STRUCTURE OF PRINTED CIRCUIT BOARD THEREOF (DELTA ELECTRONICS, INC.)
- 18805678. COMPONENT-ATTACHED FPC MANUFACTURING METHOD (Yazaki Corporation)
- 18808203. ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD (Murata Manufacturing Co., Ltd.)
- 18815013. DISPLAY MODULE AND DISPLAY DEVICE (LG Display Co., Ltd.)
- 18816812. SEMICONDUCTOR MODULE (FUJI ELECTRIC CO., LTD.)
- 18882301. DISPLAY APPARATUS INCLUDING ANTISTATIC PORTION (SAMSUNG ELECTRONICS CO., LTD.)
- 18882385. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18883594. SWITCHING POWER SUPPLY DEVICE (Murata Manufacturing Co., Ltd.)
- 18884004. SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT (Kioxia Corporation)
- 18887798. BATTERY MODULE WITH FLEXIBLE INTERCONNECTOR (SAMSUNG SDI CO., LTD.)
- 18888185. RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE (Murata Manufacturing Co., Ltd.)
- 18888464. DISPLAY DEVICE, APPARATUS OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING THE DISPLAY DEVICE (Samsung Display Co., LTD.)
- 18889286. CHIP SYSTEM AND ELECTRONIC DEVICE (Huawei Technologies Co., Ltd.)
- 18889578. WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD (DAI NIPPON PRINTING CO., LTD.)
- 18893130. ANTENNA HAVING SINGLE NON-CONDUCTIVE PORTION AND ELECTRONIC DEVICE INCLUDING THE SAME (Samsung Electronics Co., Ltd.)
- 18893873. METHODS, APPARATUSES, INTEGRATED CIRCUITS, AND PRINTED CIRCUIT BOARDS FOR POWER CONVERSION WITH REDUCED PARASITICS (Murata Manufacturing Co., Ltd.)
- 18894586. BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES (Intel Corporation)
- 18895796. PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES (Intel Corporation)
- 18941471. SUBSTRATE AND MODULE (Murata Manufacturing Co., Ltd.)
- 18944243. RADIO FREQUENCY FRONT-END STRUCTURES (Intel Corporation)
- 18963884. NON-ISOLATED DC/DC CONVERTER, POWER SUPPLY, AND COMMUNICATION DEVICE (HUAWEI TECHNOLOGIES CO., LTD.)
- 18966756. ACOUSTIC WAVEGUIDE WITH DIFFRACTION GRATING (Texas Instruments Incorporated)
- 18967359. ELECTRONIC COMPONENT (ROHM CO., LTD.)
- 18970353. SEMICONDUCTOR PACKAGE INCLUDING RESIN, AND ELECTRONIC DEVICE INCLUDING SAME (SAMSUNG ELECTRONICS CO., LTD.)
2
- 20240018019. HEAT DISSIPATION APPARATUS AND METHODS FOR UV-LED PHOTOREACTORS simplified abstract (THE UNIVERSITY OF BRITISH COLUMBIA)
- 20240018295. THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD simplified abstract (TAIYO INK MFG. CO., LTD.)
- 20240022008. INTEGRATED ANTENNA MODULE simplified abstract (QUALCOMM Incorporated)
- 20240032186. STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, AND COMPOSITION simplified abstract (FUJIFILM Corporation)