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Category:H05K1/03
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This category has the following 26 subcategories, out of 26 total.
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Pages in category "H05K1/03"
The following 151 pages are in this category, out of 151 total.
1
- 17968438. INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract (Dell Products L.P.)
- 18024017. FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY APPARATUS simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18024017. FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY APPARATUS simplified abstract (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 18055997. FOLDABLE ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18089489. SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION simplified abstract (Intel Corporation)
- 18103837. ELECTRONIC DEVICE HAVING WIRELESS CHARGING FUNCTION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18131019. CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18157864. AUXETIC STRETCHABLE SUBSTRATE WITH FLEXIBLE JOINT STRUCTURE AND METHOD OF MANUFACTURING SAME simplified abstract (KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY)
- 18159097. ELECTRONIC MODULE, ELECTRONIC EQUIPMENT, IMAGING SENSOR MODULE, IMAGING APPARATUS, AND DISPLAY APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18208748. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18209616. PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18278967. ELECTRONIC SUBSTRATE simplified abstract (LG INNOTEK CO., LTD.)
- 18282929. RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18282942. RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18284386. RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN- EQUIPPED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18293247. ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE simplified abstract (KYOCERA Corporation)
- 18294293. COPPER CLAD LAMINATE AND PRINTED WIRING BOARD simplified abstract (Sony Group Corporation)
- 18335145. ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD (Intel Corporation)
- 18367963. LOW STRESS THROUGH GLASS VIAS (TGVS) (Intel Corporation)
- 18384181. FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE simplified abstract (Apple Inc.)
- 18384709. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18388302. CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18400022. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18417033. CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A LIGHTING SYSTEM WITH LED LIGHTS simplified abstract (Musco Corporation)
- 18435032. STRETCHABLE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18441422. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18469991. MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD (Dell Products L.P.)
- 18489422. ENCAPSULATING ELECTRONICS ON FLEXIBLE FLUOROELASTOMER SUBSTRATES simplified abstract (Saudi Arabian Oil Company)
- 18499899. STORAGE simplified abstract (Kabushiki Kaisha Toshiba)
- 18499899. STORAGE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18503462. CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18504549. Fabric with Electrical Components simplified abstract (Apple Inc.)
- 18519656. CONTINUOUS SILICA FIBER REINFORCED COMPOSITES FOR HIGH-FREQUENCY PRINTED CIRCUIT BOARD AND METHODS OF MAKING simplified abstract (CORNING INCORPORATED)
- 18520642. CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE simplified abstract (AGC Inc.)
- 18525799. COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT simplified abstract (AAC Microtech (Changzhou) Co., Ltd.)
- 18534734. ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18549063. POWER MODULE WITH A CERAMIC CIRCUIT CARRIER, A FLEXIBLE CIRCUIT BOARD AND A TEMPERATURE SENSOR simplified abstract (Robert Bosch GmbH)
- 18569894. BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND FLEXIBLE PRINTED WIRING BOARD simplified abstract (LG Innotek Co.,LTD.)
- 18569894. BISMALEIMIDE COMPOSITION, CURED PRODUCT, SHEET, LAMINATED BODY, AND FLEXIBLE PRINTED WIRING BOARD simplified abstract (Resonac Corporation)
- 18582059. ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18601337. PRINTED CIRCUIT BOARD simplified abstract (Hamilton Sundstrand Corporation)
- 18623091. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
- 18625488. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18646300. RESIN COMPOSITION, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18663314. PATTERNED CONDUCTIVE ARTICLE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18665379. THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18670986. CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD simplified abstract (Kabushiki Kaisha Toshiba)
- 18673686. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18681035. PRINTED WIRING BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18683123. COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME simplified abstract (LG ELECTRONICS INC.)
- 18703347. DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, AND HIGH FREQUENCY PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18708252. MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIRCULATOR (Mitsubishi Electric Corporation)
- 18734875. GLASS SUBSTRATE FOR HIGH-FREQUENCY DEVICE AND CIRCUIT BOARD FOR HIGH-FREQUENCY DEVICE simplified abstract (AGC Inc.)
- 18735872. FOLDING DISPLAYER SUPPORT AND DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18736577. POWER SUPPLY UNIT OF AEROSOL GENERATING DEVICE simplified abstract (Japan Tobacco Inc.)
- 18736771. INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME simplified abstract (CORNING INCORPORATED)
- 18737608. COMPOSITIONS AND METHODS THEREOF simplified abstract (THE BOEING COMPANY)
- 18751647. PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICONDUCTOR CHIP DEVICE (Infineon Technologies AG)
- 18760610. STRETCHABLE DEVICE (Japan Display Inc.)
- 18789287. RESIN COMPOSITION (Shin-Etsu Chemical Co., Ltd.)
- 18848555. PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18892610. PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS (3M INNOVATIVE PROPERTIES COMPANY)
- 18960290. MULTILAYER SUBSTRATE (Murata Manufacturing Co., Ltd.)
- 18969254. BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME (KABUSHIKI KAISHA TOSHIBA)
2
A
- Aac microtech (changzhou) co., ltd. (20240341031). COMPOSITE BOARD MATERIAL AND FLEXIBLE PRINTED CIRCUIT simplified abstract
- AAC Microtech (Changzhou) Co., Ltd. patent applications on October 10th, 2024
- Apple inc. (20240186686). Antennas Having Substrate Layers With Compound Curvature simplified abstract
- Apple Inc. patent applications on February 15th, 2024
- Apple Inc. patent applications on February 29th, 2024
- Apple Inc. patent applications on January 30th, 2025
- Apple Inc. patent applications on June 6th, 2024
B
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 14th, 2024
- Blockchain patent applications on March 28th, 2024
- Boe technology group co., ltd. (20240321148). FOLDING DISPLAYER SUPPORT AND DISPLAY APPARATUS simplified abstract
- BOE Technology Group Co., Ltd. patent applications on September 26th, 2024
C
D
- Dell products l.p. (20240130041). INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract
- Dell products l.p. (20250098074). MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD
- Dell Products L.P. patent applications on April 18th, 2024
- DELL PRODUCTS L.P. patent applications on February 6th, 2025
- Dell Products L.P. patent applications on March 20th, 2025
H
I
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240188222). METHOD OF FORMING A PACKAGE SUBSTRATE simplified abstract
- Intel corporation (20240188225). GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS simplified abstract
- Intel corporation (20240215163). SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT REDUCTION simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20240422899). ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
- Intel corporation (20250089156). LOW STRESS THROUGH GLASS VIAS (TGVS)
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 13th, 2025
- Intel Corporation patent applications on September 26th, 2024
J
K
- Kabushiki kaisha toshiba (20240324105). CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD simplified abstract
- Kabushiki kaisha toshiba (20240324116). STORAGE simplified abstract
- Kabushiki kaisha toshiba (20250098065). BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
- KABUSHIKI KAISHA TOSHIBA patent applications on February 6th, 2025
- KABUSHIKI KAISHA TOSHIBA patent applications on March 20th, 2025
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
L
M
- Mitsubishi electric corporation (20250016919). MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIRCULATOR
- Mitsubishi Electric Corporation patent applications on January 9th, 2025
- Murata manufacturing co., ltd. (20250089160). MULTILAYER SUBSTRATE
- Murata Manufacturing Co., Ltd. patent applications on February 6th, 2025
- Murata Manufacturing Co., Ltd. patent applications on March 13th, 2025
P
- Panasonic intellectual property management co., ltd. (20240239974). RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract
- Panasonic intellectual property management co., ltd. (20240263003). RESIN COMPOSITION, PREPREG USING SAME, FILM PROVIDED WITH RESIN, METAL FOIL PROVIDED WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract
- Panasonic intellectual property management co., ltd. (20240279458). RESIN COMPOSITION, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD simplified abstract
- Panasonic intellectual property management co., ltd. (20240301173). THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD simplified abstract
- Panasonic Intellectual Property Management Co., Ltd. patent applications on August 22nd, 2024
- Panasonic Intellectual Property Management Co., Ltd. patent applications on August 8th, 2024
- Panasonic Intellectual Property Management Co., Ltd. patent applications on January 30th, 2025
- Panasonic Intellectual Property Management Co., Ltd. patent applications on July 18th, 2024
- Panasonic Intellectual Property Management Co., Ltd. patent applications on September 12th, 2024
R
S
- Samsung display co., ltd. (20240206065). DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract
- Samsung Display Co., Ltd. patent applications on June 20th, 2024
- Samsung electro-mechanics co., ltd. (20240215158). PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract
- Samsung electro-mechanics co., ltd. (20240215159). CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on March 6th, 2025
- Samsung electronics co., ltd. (20240195895). ELECTRONIC DEVICE INCLUDING WATERPROOF STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240206068). PRINTED CIRCUIT BOARD simplified abstract
- Samsung electronics co., ltd. (20240357741). PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on October 24th, 2024
- Sony group corporation (20240349422). COPPER CLAD LAMINATE AND PRINTED WIRING BOARD simplified abstract
- Sony Group Corporation patent applications on October 17th, 2024
U
- US Patent Application 18033444. CIRCUIT BOARD ARRANGEMENT COMPRISING A CIRCUIT BOARD PROVIDED WITH A GRAPHENE ISLAND AND METHOD OF COMMUNICATING BETWEEN A FIRST AND A SECOND CIRCUIT simplified abstract
- US Patent Application 18073956. CIRCUIT BOARD simplified abstract
- US Patent Application 18447502. MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE FOR CIRCUIT BOARD, CIRCUIT BOARD, AND METHOD FOR PRODUCING MODIFIED FLUORORESIN MATERIAL simplified abstract
- US Patent Application 18448598. INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM simplified abstract
