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Category:H05K1/02
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Pages in category "H05K1/02"
The following 200 pages are in this category, out of 801 total.
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- 16976907. ANTENNA AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17280888. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.)
- 17383241. PACKAGE COMPRISING A BLOCK DEVICE WITH A SHIELD simplified abstract (QUALCOMM Incorporated)
- 17644431. Integrated Attenuator with Thermal Vias simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17709920. INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17745238. ANTENNA STRUCTURE SUPPORTING WIRELESS CHARGING AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17800660. PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17800660. PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYING DEVICE simplified abstract (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17825508. BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17848092. STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER simplified abstract (Meta Platforms Technologies, LLC)
- 17849093. CIRCUIT BOARD STRUCTURES FOR COMPONENT PROTECTION simplified abstract (MICRON TECHNOLOGY, INC.)
- 17850555. MULTIMEDIA STREAMING DEVICE simplified abstract (Amazon Technologies, Inc.)
- 17877729. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 17879303. FLEXIBLE CONNECTING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17885338. STRESS-RELEASING SOLDER MASK PATTERN FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17885640. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17914644. CURVED SCREEN BENDING DEVICE AND CURVED SCREEN BENDING METHOD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17921887. FLEXIBLE PRINTED CIRCUIT BOARD AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17925403. ANTI-INTERFERENCE MODULE AND TERMINAL DEVICE simplified abstract (HONOR DEVICE CO., LTD.)
- 17933693. MICROSTRIP CROSSTALK REDUCTION simplified abstract (International Business Machines Corporation)
- 17947397. MODULE BOARD AND MEMORY MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17948854. MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract (Dell Products L.P.)
- 17948893. STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL simplified abstract (Dell Products L.P.)
- 17957316. PRINTED CIRCUIT BOARD INCLUDING COAXIAL PLATED THROUGH HOLE AND ELECTRONIC APPARATUS INCLUDING SAME IN WIRELESS COMMUNICATION SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17957330. NON-PLANAR ANTENNAS FOR PORTABLE STORAGE DEVICES simplified abstract (Western Digital Technologies, Inc.)
- 17957870. PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAND AND ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17960404. ELECTRONIC DEVICE INCLUDING HEAT RADIATING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17962286. RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17963138. TEARING SECURITY FEATURE OF PRINTED CIRCUIT SUBSTRATES simplified abstract (International Business Machines Corporation)
- 17967532. PRINTED CIRCUIT BOARD WITH INCREASED DURABILITY IN BENDING REGION AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17967870. CAMERAS FOR SMALL FORM FACTOR DEVICES (Meta Platforms Technologies, LLC)
- 17968308. PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17968438. INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract (Dell Products L.P.)
- 17974982. WEARABLE ELECTRONIC DEVICE INCLUDING ANTENNA simplified abstract (Samsung Electronics Co., Ltd.)
- 17986242. ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18002199. Electronic Assembly and Electronic Device simplified abstract (Honor Device Co., Ltd.)
- 18014440. POWER SUPPLY CIRCUIT, DRIVING METHOD THEREOF, PRINTED CIRCUIT BOARD, DISPLAY MODULE, AND DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 18016679. Display Module and Display Device simplified abstract (BOE Technology Group Co., Ltd.)
- 18016836. ELECTRONIC DEVICE simplified abstract (Honor Device Co., Ltd.)
- 18022376. CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE simplified abstract (HONOR DEVICE CO., LTD.)
- 18025180. CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18025180. CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE simplified abstract (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 18026887. CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR CIRCUIT BOARD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18039454. CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME simplified abstract (LG INNOTEK CO., LTD.)
- 18041767. Circuit Board and Manufacturing Method Thereof, and Terminal Device simplified abstract (Honor Device Co., Ltd.)
- 18048155. SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES simplified abstract (Dell Products L.P.)
- 18048622. IMAGE PICKUP APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18059703. SLOTTED ABSORBER simplified abstract (Cisco Technology, Inc.)
- 18071903. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18072897. RECONFIGURABLE CONNECTOR SYSTEM simplified abstract (GM Global Technology Operations LLC)
- 18073966. PRINTED CIRCUIT BOARD INTEGRATED ANTENNA FOR TRANSMITTING / RECEIVING DATA simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18075010. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18077570. WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18090214. ELECTRONIC DEVICE INCLUDING HIGH-FREQUENCY TRANSMISSION CIRCUIT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18091368. ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD STRUCTURE INCLUDING THERMAL INTERFACE MATERIAL simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18106129. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18106435. DISPLAY UNIT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE ELECTRONIC APPARATUS simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18118725. ELECTRONIC DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18118725. ELECTRONIC DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18118736. ELECTRONIC PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18120900. Circuit Board Cooling Configurations simplified abstract (Microsoft Technology Licensing, LLC)
- 18121297. THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES simplified abstract (Intel Corporation)
- 18122891. VOLTAGE REGULATOR MODULE HAVING A POWER STAGE simplified abstract (Infineon Technologies Austria AG)
- 18123049. PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB simplified abstract (Intel Corporation)
- 18130718. HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME simplified abstract (TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.)
- 18139900. FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18148465. SAFETY AND EMC COMPLIANT INTERNAL POWER PLANE HEAT SINK CAPACITOR simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18149026. Interposers with Millimeter-Wave Transitions simplified abstract (NXP B.V.)
- 18149919. Shield Can as Stiffener on Flexible Printed Circuits simplified abstract (Meta Platforms Technologies, LLC)
- 18154433. ANTENNA FILTER AND ELECTRONIC DEVICE INCLUDING SAME IN WIRELESS COMMUNICATION SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18155759. LAYOUT STRUCTURE AND METHOD FOR FABRICATING SAME simplified abstract (Changxin Memory Technologies, Inc.)
- 18155880. AUXETIC STRETCHABLE SUBSTRATE WITH FLEXIBLE JOINT STRUCTURE AND METHOD OF MANUFACTURING SAME simplified abstract (KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY)
- 18157864. AUXETIC STRETCHABLE SUBSTRATE WITH FLEXIBLE JOINT STRUCTURE AND METHOD OF MANUFACTURING SAME simplified abstract (KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY)
- 18158085. APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW HOLES IN CIRCUIT PACKAGING FOR MOBILE DEVICES simplified abstract (Meta Platforms Technologies, LLC)
- 18161272. ELECTRONIC DEVICE INCLUDING MULTIPLE PRINTED CIRCUIT BOARDS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18164788. CIRCUIT BOARD HAVING ELECTROMAGNETIC SHIELDING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18165182. DISPLAY DEVICE AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
- 18171083. ROUGHNESS EDGE OF A HEAT SINK simplified abstract (Dell Products L.P.)
- 18172377. CONFIGURABLE RADIO TRANSCEIVER AND METHOD THEREOF simplified abstract (Realtek Semiconductor Corp.)
- 18173767. ISOLATOR simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18179223. SPLIT PAD WITH TEST LINE simplified abstract (QUALCOMM Incorporated)
- 18188297. ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT simplified abstract (Intel Corporation)
- 18195454. DISPLAY DEVICE simplified abstract (Samsung Display Co., Ltd.)
- 18200224. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18210758. CLOSED-LOOP ACTUATING AND SENSING EPIDERMAL SYSTEMS simplified abstract (The Regents of the University of California)
- 18212867. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18213005. ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18221430. CONTROL CIRCUIT AND POWER SUPPLY DEVICE simplified abstract (SHARP KABUSHIKI KAISHA)
- 18225944. Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies simplified abstract (GOOGLE LLC)
- 18230027. ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD AND OPERATING METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18231289. METHOD OF MANUFACTURING ELECTRONIC DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18231936. CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18235062. INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18236542. DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18263271. Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18266254. SYSTEMS AND METHODS FOR FLEX CIRCUIT CONNECTIONS IN TOUCH SCREENS simplified abstract (Apple Inc.)
- 18267115. CIRCUIT BOARD simplified abstract (Mitsubishi Electric Corporation)
- 18273222. WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE simplified abstract (KYOCERA Corporation)
- 18274489. FLEXIBLE ELECTRODE, DISPLAY APPARATUS AND WEARABLE DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18275209. PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUIT BOARD, AND IMAGE DISPLAY SYSTEM (BOE TECHNOLOGY GROUP CO., LTD.)
- 18278928. HIGH FREQUENCY CIRCUIT simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18278967. ELECTRONIC SUBSTRATE simplified abstract (LG INNOTEK CO., LTD.)
- 18282914. CAPACITOR BOARD UNIT AND POWER CONVERSION DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18293247. ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE simplified abstract (KYOCERA Corporation)
- 18294158. METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD simplified abstract (Resonac Corporation)
- 18294293. COPPER CLAD LAMINATE AND PRINTED WIRING BOARD simplified abstract (Sony Group Corporation)
- 18298667. SUBSTRATE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18306874. SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE CALIBRATOR simplified abstract (SK hynix Inc.)
- 18313722. WIRELESS MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- 18324127. Flexible Circuit Board And Multifunctional Acoustic Device simplified abstract (AAC Microtech (Changzhou) Co., Ltd.)
- 18331759. SENSOR UNIT AND IMAGE FORMING APPARATUS INCLUDING SENSOR UNIT simplified abstract (CANON KABUSHIKI KAISHA)
- 18335145. ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD (Intel Corporation)
- 18335580. STRUCTURALLY ENHANCED FILTERING OF CIRCUIT BOARD PLANES (Microsoft Technology Licensing, LLC)
- 18335642. SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS (SAUDI ARABIAN OIL COMPANY)
- 18336096. FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18343773. Cooling Methodology for Package-on-Package Structures (Intel Corporation)
- 18344147. CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR (International Business Machines Corporation)
- 18344308. COLD PLATES FOR SECONDARY SIDE COMPONENTS OF PRINTED CIRCUIT BOARDS simplified abstract (Intel Corporation)
- 18344869. APPARATUS AND METHOD FOR DETECTING WARPAGE IN AN ELECTRONIC SYSTEM (Intel Corporation)
- 18344934. METHOD AND APPARATUS FOR STIFFENING AN ELECTRONIC DEVICE (Intel Corporation)
- 18353384. BATTERY AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18364578. DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18367963. LOW STRESS THROUGH GLASS VIAS (TGVS) (Intel Corporation)
- 18374481. CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS simplified abstract (SEIKO EPSON CORPORATION)
- 18375156. PRINTED CIRCUIT BOARD ASSEMBLY INCLUDING THERMAL MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18375179. ELECTRONIC APPARATUS FOR STABLE ELECTRICAL CONNECTION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18382202. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18384181. FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE simplified abstract (Apple Inc.)
- 18384709. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18385012. PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD ASSEMBLY (Samsung SDI Co., Ltd.)
- 18387351. FLEXIBLE CIRCUIT BOARD AND FOLDABLE ELECTRONIC DEVICE COMPRISING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18389923. HEAT DISSIPATION APPARATUS, CIRCUIT MODULE, ELECTRONIC DEVICE, AND CIRCUIT MODULE ASSEMBLY METHOD simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18390805. HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract (Dell Products L.P.)
- 18396587. DISPLAY DEVICE AND APPARATUS AND METHOD FOR MANUFACTURING THE DISPLAY DEVICE simplified abstract (Samsung Display Co., LTD.)
- 18396921. PICTURE GENERATING UNIT FOR A HEAD-UP DISPLAY simplified abstract (HYUNDAI MOBIS CO., LTD.)
- 18399565. TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS simplified abstract (Intel Corporation)
- 18400022. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18400347. ELECTRONIC APPARATUS simplified abstract (Samsung Display Co., LTD.)
- 18401876. ELECTRONIC DEVICE COMPRISING ANTENNA MODULE WITH CONNECTOR FOR COAXIAL CABLE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18416591. WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18416937. ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18417033. CIRCUIT, CIRCUIT BOARD, AND HEAT SINK ASSEMBLY FOR RETROFITTING A LIGHTING SYSTEM WITH LED LIGHTS simplified abstract (Musco Corporation)
- 18418513. RADIO FREQUENCY FRONT-END STRUCTURES simplified abstract (Intel Corporation)
- 18419212. NON-UNIFORM SURFACE MOUNT PADS simplified abstract (Dell Products L.P.)
- 18420769. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJIFILM Corporation)
- 18432920. ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FOR REDUCING DEFORMATION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18433228. METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT simplified abstract (SKYWORKS SOLUTIONS, INC.)
- 18435032. STRETCHABLE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18436892. SOLDER MASK FAULT FIBER OPTICS SENSOR simplified abstract (Micron Technology, Inc.)
- 18441422. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18442812. METHOD OF HUB COMMUNICATION, PROCESSING, STORAGE AND DISPLAY simplified abstract (Cilag GmbH International)
- 18443553. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18443913. WEARABLE ELECTRONIC DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18448656. THERMAL MANAGEMENT IN DATA STORAGE DEVICE simplified abstract (Western Digital Technologies, Inc.)
- 18449483. HEAT HARVESTING IN DATA STORAGE DEVICES (Western Digital Technologies, Inc.)
- 18453020. FLEXIBLE PRINTED CIRCUIT AND ELECTRONIC DEVICE simplified abstract (Lenovo (Beijing) Limited)
- 18463397. GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS (International Business Machines Corporation)
- 18465803. LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AND METHOD OF MANUFACTURING LIGHT-EMITTING MODULE simplified abstract (NICHIA CORPORATION)
- 18467060. TAMPER-RESPONDENT ASSEMBLIES WITH INDIVIDUALIZED CHEMICAL MIXTURES FOR SECURITY (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18469606. TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED TAMPER-DETECT CIRCUITRY (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470805. DISPLAY MODULE ACCOUNTING FOR ESD PHENOMENON, AND ELECTRONIC DEVICE COMPRISING DISPLAY MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18472241. STRETCHABLE DEVICE simplified abstract (Japan Display Inc.)
- 18479767. SYSTEMS, METHODS, AND DEVICES FOR PRODUCING INTERCONNECTS ON DEFORMABLE SUBSTRATES OF ELECTRONIC DEVICES simplified abstract (Meta Platforms Technologies, LLC)
- 18480343. WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18480507. STRETCHABLE DEVICE simplified abstract (Japan Display Inc.)
- 18481931. SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM simplified abstract (Apple Inc.)
- 18483870. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18483929. CIRCUIT MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18484580. HEAT CONDUCTING MEMBER, OPTICAL MODULE, HEAT SINK, AND METHOD FOR PREPARING HEAT CONDUCTING MEMBER simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18487603. RECHARGEABLE BATTERY PACK simplified abstract (SAMSUNG SDI CO., LTD.)
- 18490597. FLEXIBLE WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18491585. ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18492251. COMPUTER HOUSING simplified abstract (Apple Inc.)
- 18495735. VEHICLE-MOUNTABLE DEVICE AND VEHICLE simplified abstract (Huawei Technologies Co., Ltd.)
- 18501089. ELECTRONIC APPARATUS AND IMAGE PICKUP APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
- 18510822. PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18512344. HEAT DISSIPATION APPARATUS AND IN-VEHICLE MODULE simplified abstract (Huawei Technologies Co., Ltd.)
- 18512862. BATTERY INCLUDING FLEXIBLE CIRCUIT BOARD CONNECTED FROM SIDE OF PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE INCLUDING THE BATTERY simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18514628. EXTERNAL CONNECTION TERMINAL simplified abstract (FUJIFILM Corporation)
- 18515661. ELECTRONIC MODULE AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18520642. CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE simplified abstract (AGC Inc.)
- 18521235. BRUSHLESS DIRECT CURRENT MOTOR FOR POWER TOOLS simplified abstract (Milwaukee Electric Tool Corporation)
- 18523058. TERMINAL STRUCTURE AND ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18524031. MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18525081. POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
- 18525528. Electronic Device With Near-Field Antenna Operating Through Display simplified abstract (Apple Inc.)
- 18525735. Flexible Connector with Permeability Shield to Reduce Antenna Loss simplified abstract (Google LLC)
- 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)
- 18530179. MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18534734. ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18542619. COUPLER AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18546796. CIRCUIT BOARD HAVING COMPOSITE MAGNETIC COMPONENTS MOUNTED THEREON simplified abstract (LG INNOTEK CO., LTD.)
- 18547742. ELECTRONIC DEVICE simplified abstract (HITACHI ASTEMO, LTD.)
- 18548098. CIRCUIT DEVICE AND DISPLAY APPARATUS (BOE TECHNOLOGY GROUP CO., LTD.)
- 18548098. CIRCUIT DEVICE AND DISPLAY APPARATUS (CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 18548216. FLEXIBLE PRINTED BOARD simplified abstract (Mitsubishi Electric Corporation)