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Category:H01L23/538
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Pages in category "H01L23/538"
The following 200 pages are in this category, out of 1,257 total.
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- 17528910. Bridge Chip with Through Via simplified abstract (International Business Machines Corporation)
- 17535664. MULTIPLE DIE ASSEMBLY simplified abstract (International Business Machines Corporation)
- 17570710. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17669914. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17682465. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17700818. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17703668. SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17703700. METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17746822. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17789848. BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE, AND DISPLAY APPARATUS simplified abstract (BOE Technology Group Co., Ltd.)
- 17804742. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17806660. 3D Embedded Redistribution Layers for IC Substrate Packaging simplified abstract (APPLE INC.)
- 17806985. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17814836. FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17816619. SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17822470. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17840362. Molding Structures for Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17840744. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17847257. PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)
- 17848246. MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCONNECTS simplified abstract (Intel Corporation)
- 17850187. SEMICONDUCTOR DEVICE WITH MULTIPLE DIES simplified abstract (Texas Instruments Incorporated)
- 17851245. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)
- 17852614. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17862469. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17862482. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17872473. CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY simplified abstract (Huawei Technologies Co., Ltd.)
- 17877156. PACKAGE COMPRISING INTEGRATED DEVICES simplified abstract (QUALCOMM Incorporated)
- 17879106. REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17887150. Bridge Die Having Different Surface Orientation Than Ic Dies Interconnected By The Bridge Die simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17894043. PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
- 17894057. PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORTIONS simplified abstract (QUALCOMM Incorporated)
- 17894095. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895047. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896097. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17897196. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17897648. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17900785. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17901386. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17937764. TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (International Business Machines Corporation)
- 17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17951474. INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17956134. DISPLAY MODULE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17956753. DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract (Intel Corporation)
- 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
- 17957403. HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRATED CIRCUIT DEVICES simplified abstract (Intel Corporation)
- 17957637. POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract (Intel Corporation)
- 17957783. MULTICHIP IC DEVICES IN GLASS MEDIUM & INCLUDING AN INTERCONNECT BRIDGE DIE simplified abstract (Intel Corporation)
- 17961954. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17979233. SEMICONDUCTOR PACKAGES HAVING UPPER CONDUCTIVE PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17988642. PACKAGE SUBSTRATE AND/OR A BOARD WITH A SHARED POWER DISTRIBUTION NETWORK simplified abstract (QUALCOMM Incorporated)
- 17993240. Socket To Support High Performance Multi-die ASICs simplified abstract (Google LLC)
- 18026083. WIRING SUBSTRATE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18028340. WIRING SUBSTRATE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation)
- 18048972. SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060853. Semiconductor Package with Multiple Redistribution Substrates simplified abstract (Samsung Electronics Co., Ltd.)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18066448. INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18069507. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL INTEGRATED CIRCUIT PACKAGES HAVING GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18070602. ELECTRONIC MODULE AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
- 18071961. PERMANENT LAYER FOR BUMP CHIP ATTACH simplified abstract (Intel Corporation)
- 18080612. LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE simplified abstract (Intel Corporation)
- 18081900. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation)
- 18086575. CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract (International Business Machines Corporation)
- 18087384. HETEROGENEOUS INTEGRATION STRUCTURE WITH VOLTAGE REGULATION simplified abstract (International Business Machines Corporation)
- 18087517. UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract (Intel Corporation)
- 18089417. INTERCONNECT DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- 18089632. EFFICIENT AUTOCATALYTIC METALLIZATION OF POLYMERIC SURFACES simplified abstract (Applied Materials, Inc.)
- 18089801. GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (Intel Corporation)
- 18090254. BACKSIDE INTERFACE FOR CHIPLET ARCHITECTURE MIXING simplified abstract (Advanced Micro Devices, Inc.)
- 18090707. DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (Intel Corporation)
- 18090883. PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (Intel Corporation)
- 18091014. HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18091150. ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18091265. DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091270. IC DIE PACKAGES WITH LOW CTE DIELECTRIC MATERIALS simplified abstract (Intel Corporation)
- 18091560. TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 18091583. TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract (Intel Corporation)
- 18098158. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18098803. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18098987. SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099056. SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18099663. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18109392. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18112107. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18112616. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18119270. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18119272. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18120826. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18120910. INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS simplified abstract (Intel Corporation)
- 18121374. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18122895. Embedded Package with Shielding Pad simplified abstract (Infineon Technologies AG)
- 18123402. DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18124752. REINFORCEMENT STRUCTURES FOR CHIP-INTERPOSER AND INTERPOSER-SUBSTRATE BONDING AND METHODS OF MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18125928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18130584. EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract (Intel Corporation)
- 18134314. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18134437. POWER MODULE simplified abstract (Hyundai Motor Company)
- 18134437. POWER MODULE simplified abstract (Kia Corporation)
- 18134933. POWER MODULE simplified abstract (Hyundai Motor Company)
- 18134933. POWER MODULE simplified abstract (Kia Corporation)
- 18136499. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18138363. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18142876. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18147487. METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract (Intel Corporation)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation)
- 18148148. METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract (Intel Corporation)
- 18148945. PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES simplified abstract (Intel Corporation)
- 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150256. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151071. Package Formation Using UBM-First Approach and the Corresponding Packages simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151517. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152141. SEMICONDUCTOR STRUCTURE, STACKED STRUCTURE, AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152153. CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152539. Fan-Out Stacked Package and Methods of Making the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152777. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155398. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A RE-DISTRIBUTION LAYER (RDL) SUBSTRATE(S) WITH PHOTOSENSITIVE DIELECTRIC LAYER(S) FOR INCREASED PACKAGE RIGIDITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155713. SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156287. HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION simplified abstract (Apple Inc.)
- 18156449. INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18161066. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18162679. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18163378. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18167095. PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18167369. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18173027. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18173039. PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18182080. COUPLED INDUCTORS THROUGH SUBSTRATE-ASSEMBLY PROCESS AND/OR WAFER-LEVEL PROCESS simplified abstract (QUALCOMM Incorporated)
- 18184968. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18185248. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18186209. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18187155. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES simplified abstract (Intel Corporation)
- 18187660. INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18188627. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18189299. DEFORMATION-RESISTANT INTERPOSER FOR A LOCAL SILICON INTERCONNECT AND METHODS FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
- 18189991. PACKAGE SUBSTRATE COMPRISING AT LEAST TWO CORE LAYERS simplified abstract (QUALCOMM Incorporated)
- 18190019. PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18191212. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18195536. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18199553. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18204970. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18206840. Systems And Methods For Coupling Integrated Circuit Dies simplified abstract (Intel Corporation)
- 18212461. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18214341. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216525. THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES (Intel Corporation)
- 18216749. ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY (International Business Machines Corporation)
- 18217049. METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES (Intel Corporation)
- 18217655. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18218589. SUBSTRATE-FREE SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTIPLE SEMICONDUCTOR DEVICES AND METHODS FOR MAKING THE SAME (Micron Technology, Inc.)
- 18219394. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18220053. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18228278. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18231102. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18232617. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18234092. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18235643. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18238099. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18239846. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18244350. INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18244546. SEMICONDUCTOR PACKAGE INCLUDING A THREE-DIMENSIONAL STACKED MEMORY MODULE simplified abstract (Samsung Electronics Co., Ltd.)
- 18244689. PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES simplified abstract (Intel Corporation)
- 18253954. DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM simplified abstract (Intel Corporation)
- 18260810. INTEGRATED CIRCUIT SUPPORTS WITH MICROSTRIPS simplified abstract (Intel Corporation)
- 18290289. ENHANCED I/O SEMICONDUCTOR CHIP PACKAGE AND COOLING ASSEMBLY HAVING SIDE I/OS (Intel Corporation)
- 18296786. TRANSISTOR WITH SOURCE MANIFOLD IN NON-ACTIVE DIE REGION simplified abstract (NXP USA, Inc.)
- 18296843. HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS simplified abstract (QUALCOMM Incorporated)