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Category:H01L23/522
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Pages in category "H01L23/522"
The following 200 pages are in this category, out of 1,743 total.
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- 17383690. SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17386278. SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES simplified abstract (QUALCOMM Incorporated)
- 17412622. DOUBLE-SIDED STACKED DTC STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17446405. RESISTOR WITHIN A VIA simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17453670. ELECTRONIC FUSE STRUCTURE EMBEDDED IN TOP VIA simplified abstract (International Business Machines Corporation)
- 17454378. DAMASCENE INTERCONNECT SPACER TO FACILITATE GAP FILL simplified abstract (International Business Machines Corporation)
- 17457444. TOP VIA WITH PROTECTIVE LINER simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17457565. TOP ELECTRODE TO METAL LINE CONNECTION FOR MAGNETO-RESISTIVE RANDOM-ACCESS MEMORY STACK HEIGHT REDUCTION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17458884. SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17459799. CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17460764. Forming Interconnect Structures in Semiconductor Devices simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461231. STRUCTURE AND METHOD FOR MULTIPLE BEOL K-VALUE DIELECTRIC simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17461952. SEMICONDUCTOR DIE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17478539. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)
- 17494009. LOW VERTICAL RESISTANCE SINGLE DAMASCENE INTERCONNECT simplified abstract (International Business Machines Corporation)
- 17523086. MASKLESS ALIGNMENT SCHEME FOR BEOL MEMORY ARRAY MANUFACTURING simplified abstract (International Business Machines Corporation)
- 17524107. INTERCONNECTS FORMED USING INTEGRATED DAMASCENE AND SUBTRACTIVE ETCH PROCESSING simplified abstract (International Business Machines Corporation)
- 17532310. PARTIAL SUBTRACTIVE SUPERVIA ENABLING HYPER-SCALING simplified abstract (International Business Machines Corporation)
- 17534485. MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLYING DIELECTRIC LAYER simplified abstract (International Business Machines Corporation)
- 17543964. BEOL INTERCONNECT SUBTRACTIVE ETCH SUPER VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17544136. SUBTRACTIVE LINE WITH DAMASCENE TOP VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17544337. Etch Back and Film Profile Shaping of Selective Dielectric Deposition simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17546682. BARRIER LINER FREE INTERFACE FOR METAL VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17547093. METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE FOR LAYER COUNT REDUCTION AND LOWER CAPACITANCE VARIATION simplified abstract (QUALCOMM Incorporated)
- 17547669. DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17551541. DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17551998. VIA ALIGNMENT IN SINGLE DAMASCENE STRUCTURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17589575. METHOD OF OVERLAY MEASUREMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17592629. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17643202. LINER-LESS VIA CONTACT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17643395. ADVANCED METAL INTERCONNECT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17643408. ACCURATE METAL LINE AND VIA HEIGHT CONTROL FOR TOP VIA PROCESS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17643434. TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17644349. MODIFIED TOP ELECTRODE CONTACT FOR MRAM EMBEDDING IN ADVANCED LOGIC NODES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17651347. Dual Damascene Structure in Forming Source/Drain Contacts simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17651990. Forming Dielectric Film With High Resistance to Tilting simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17662301. SEMICONDUCTOR DEVICE INCLUDING MULTI-CAPPING LAYER AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17672033. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17674459. Semiconductor Device with Integrated Metal-Insulator-Metal Capacitors simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17676866. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17679234. INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17680507. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17698476. METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING POROUS DIELECTRIC LAYER AND SEMICONDUCTOR DEVICE FABRICATED THEREBY simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17699496. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17702137. SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17703668. SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17704177. SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17714202. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17725300. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17727338. INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17731464. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17781013. METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17806280. VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17808116. POWER PLANES AND PASS-THROUGH VIAS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17808186. SEMICONDUCTOR DEVICE WITH POWER VIA simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17808316. INTERCONNECT WITH TWO-DIMENSIONAL FREE ZERO LINE END ENCLOSURE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17809030. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17814836. FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17815098. SEMICONDUCTOR DEVICE HAVING SHIELD PATTERNS simplified abstract (Micron Technology, Inc.)
- 17819330. SEMICONDUCTOR MEMORY DEVICES, ELECTRONIC SYSTEMS INCLUDING THE SAME AND FABRICATING METHODS OF THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17834992. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 17836781. SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17837664. GRAPHENE-CLAD METAL INTERCONNECT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17837732. TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS simplified abstract (Intel Corporation)
- 17839447. SEMICONDUCTOR DEVICE INCLUDING DIELECTRICS MADE OF POROUS ORGANIC FRAMEWORKS, AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17846086. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846109. PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES AND MULTI-SIDE ROUTING simplified abstract (Intel Corporation)
- 17846129. PACKAGE ARCHITECTURE WITH VERTICALLY STACKED BRIDGE DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17846423. ENHANCED POWER AND SIGNAL FOR STACKED-FETS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17847863. METHOD FOR FORMING A CONTACT PLUG WITH IMPROVED CONTACT METAL SEALING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17849207. MICROELECTRONIC DIE WITH TWO DIMENSIONAL (2D) COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICES IN AN INTERCONNECT STACK THEREOF simplified abstract (Intel Corporation)
- 17849345. INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CIRCUIT BLOCKS IN INTEGRATED CIRCUIT simplified abstract (Samsung Electronics Co., Ltd.)
- 17849930. MIM CAPACITOR AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17850779. INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDARY VIA simplified abstract (Intel Corporation)
- 17851967. INTEGRATED CIRCUIT STRUCTURES HAVING MEMORY WITH BACKSIDE DRAM AND POWER DELIVERY simplified abstract (Intel Corporation)
- 17852028. SELECTIVE BOTTOMLESS GRAPHENE LINED INTERCONNECTS simplified abstract (Intel Corporation)
- 17864716. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17866917. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17873180. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17876036. METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH MATERIAL IN MONOCRYSTALLINE PHASE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17877350. INTERCONNECT LAYER AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17878758. PACKAGE WITH A SUBSTRATE COMPRISING EMBEDDED STACKED TRENCH CAPACITOR DEVICES simplified abstract (QUALCOMM Incorporated)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17887194. DEEP TRENCH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887533. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17888369. LAYOUT DESIGN OF CUSTOM STACK CAPACITOR TO PROCURE HIGH CAPACITANCE simplified abstract (QUALCOMM Incorporated)
- 17893718. FOLDED STAIRCASE VIA ROUTING FOR MEMORY simplified abstract (Micron Technology, Inc.)
- 17893966. SEMICONDUCTOR MEMORIES INCLUDING EDGE MATS HAVING FOLDED DIGIT LINES simplified abstract (Micron Technology, Inc.)
- 17895286. Conductive Via With Improved Gap Filling Performance simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896241. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 17896775. Memory Circuitry And Method Used In Forming Memory Circuitry simplified abstract (Micron Technology, Inc.)
- 17897876. SKIP VIA WITH LOCALIZED SPACER simplified abstract (International Business Machines Corporation)
- 17898107. METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17930801. FULL WAFER DEVICE WITH BACK SIDE PASSIVE ELECTRONIC COMPONENTS simplified abstract (Intel Corporation)
- 17930825. FULL WAFER DEVICE WITH FRONT SIDE PASSIVE ELECTRONIC COMPONENTS simplified abstract (Intel Corporation)
- 17930841. FULL WAFER DEVICE WITH BACK SIDE INTERCONNECTS AND WAFER-SCALE INTEGRATION simplified abstract (Intel Corporation)
- 17931145. A SINGLE BACKSIDE POWER PLANE FOR IMPROVED POWER DELIVERY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17932182. Structure and Method of Fabrication for High Performance Integrated Passive Device simplified abstract (Apple Inc.)
- 17932327. POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT simplified abstract (International Business Machines Corporation)
- 17933000. INTEGRATED CIRCUIT (IC) DEVICE WITH HYBRID METAL LAYER simplified abstract (Intel Corporation)
- 17933078. NON-PLANAR METAL-INSULATOR-METAL STRUCTURE simplified abstract (International Business Machines Corporation)
- 17933874. HYBRID DAMASCENE INTERCONNECT STRUCTURE FOR SIGNAL AND POWER VIA CONNECTIONS simplified abstract (International Business Machines Corporation)
- 17934195. SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT simplified abstract (International Business Machines Corporation)
- 17937212. FORMING METAL GATE CUTS USING MULTIPLE PASSES FOR DEPTH CONTROL simplified abstract (Intel Corporation)
- 17937360. METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17940911. DECOUPLING CAPACITOR ARCHITECTURE simplified abstract (QUALCOMM Incorporated)
- 17941248. CONTACT JUMPER FOR NON-SELF ALIGNED CONTACT DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17943564. Large Surface VBPR for Robust Alignment in Advanced Technology Nodes simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17943799. LINE EXTENSION FOR SKIP-LEVEL VIA LANDING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17944437. BACKSIDE CONTACT WITH FULL WRAP-AROUND CONTACT simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17945498. VTFET CIRCUIT WITH OPTIMIZED OUTPUT simplified abstract (International Business Machines Corporation)
- 17948664. FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract (International Business Machines Corporation)
- 17951337. SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17956114. SEMICONDUCTOR STRUCTURES WITH STACKED INTERCONNECTS simplified abstract (International Business Machines Corporation)
- 17956775. SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 17958202. SELF-ALIGNED PATTERNING OF PLATE LINES IN THREE-DIMENSIONAL FERROELECTRIC CAPACITORS simplified abstract (Intel Corporation)
- 17958284. INCORPORATION OF SUPERLATTICE SEMI-METALS FOR SCALED INTERCONNECTS simplified abstract (Intel Corporation)
- 17963062. SEMICONDUCTOR DEVICES simplified abstract (Samsung Electronics Co., Ltd.)
- 17963281. SKIP VIA WITH LATERAL LINE CONNECTION simplified abstract (International Business Machines Corporation)
- 17964583. REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIPS AND SYSTEM-ON-CHIP DEVICE PACKAGES simplified abstract (NVIDIA Corporation)
- 17969260. Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17969773. SELF-ALIGNED ZERO TRACK SKIP simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17971443. Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells simplified abstract (Micron Technology, Inc.)
- 17972975. INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (Intel Corporation)
- 17983520. SEMICONDUCTOR DEVICE INCLUDING STACK STRUCTURE AND TRENCHES simplified abstract (Samsung Electronics Co., Ltd.)
- 18047270. NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18047412. Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18048858. DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18052412. MEMORY CELL ARRAY INCLUDING PARTITIONED DUAL LINE STRUCTURE AND DESIGN METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18054187. METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18059398. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18060168. ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18062502. METHOD OF FORMING LOW-RESISTIVITY RU ALD THROUGH A BI-LAYER PROCESS AND RELATED STRUCTURES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18062624. POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN simplified abstract (International Business Machines Corporation)
- 18064362. MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW simplified abstract (Intel Corporation)
- 18065120. SUPER VIA WITH SIDEWALL SPACER simplified abstract (International Business Machines Corporation)
- 18065747. SKIP VIA WITH DISCONTINUOUS DIELECTRIC CAP simplified abstract (International Business Machines Corporation)
- 18065965. SELF-ALIGNED BACKSIDE GATE CONTACTS simplified abstract (International Business Machines Corporation)
- 18067127. LOW-RESISTANCE VIA TO BACKSIDE POWER RAIL simplified abstract (International Business Machines Corporation)
- 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)
- 18067557. DEVICE HAVING AN IN-SUBSTRATE INDUCTOR AND METHOD FOR MAKING THE INDUCTOR simplified abstract (QUALCOMM Incorporated)
- 18069213. DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH simplified abstract (International Business Machines Corporation)
- 18074134. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18077570. WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18078454. SEMICONDUCTOR STRUCTURE WITH BACKSIDE METALLIZATION LAYERS simplified abstract (International Business Machines Corporation)
- 18079440. Interconnects with Sidewall Barrier Layer Divot Fill simplified abstract (International Business Machines Corporation)
- 18081589. INTEGRATED CIRCUIT BUMP INTEGRATED WITH TCOIL simplified abstract (QUALCOMM Incorporated)
- 18083818. FLEXIBLE MOL AND/OR BEOL STRUCTURE simplified abstract (International Business Machines Corporation)
- 18085871. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18088541. INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH simplified abstract (Intel Corporation)
- 18088552. INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS simplified abstract (Intel Corporation)
- 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18089886. INTEGRATED CIRCUIT STRUCTURES HAVING TWO-TRANSISTOR GAIN CELL simplified abstract (Intel Corporation)
- 18089931. DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER simplified abstract (Intel Corporation)
- 18090216. PROGRAMMABLE HYBRID MEMORY AND CAPACITIVE DEVICE IN A DRAM PROCESS simplified abstract (XILINX, INC.)
- 18090838. DOUBLE INTERCONNECTS FOR STITCHED DIES simplified abstract (Intel Corporation)
- 18093713. VIA STRUCTURE WITHOUT LINER INTERFACE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18093948. INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18094507. SEMICONDUCTOR DEVICE STRUCTURE WITH LINER LAYER HAVING TAPERED SIDEWALL AND METHOD FOR PREPARING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18095080. SEMICONDUCTOR DEVICES INCLUDING CONDUCTIVE STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.)
- 18095336. THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18097265. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18097418. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18099952. SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18103201. INTEGRATION SCHEME FOR FABRICATING HIGH PRECISION, LOW CAPACITOR WITH UNLANDED VIA simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18105945. REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18106540. INTEGRATED CIRCUIT DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18112853. CARRIER STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18118776. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE, ELECTRONIC SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18120367. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18120904. REFLECTIVE INORGANIC THIN FILM FOR HIGH-DENSITY PANEL-SCALE RE-DISTRIBUTION LAYER (RDL) simplified abstract (Intel Corporation)
- 18124913. SPIN-ORBIT TORQUE MEMORY DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18128490. MIM FLUX CAPACITOR WITH THIN AND THICK METAL LEVELS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18133443. HETEROGENEOUSLY INTEGRATED LIQUID ELECTROLYTE POWERED PROCESSOR simplified abstract (Microsoft Technology Licensing, LLC)
- 18135541. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18142795. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18142872. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18145003. FORK SHEET DEVICE WITH WRAPPED SOURCE AND DRAIN CONTACT TO PREVENT NFET TO PFET CONTACT SHORTAGE IN A TIGHT SPACE simplified abstract (International Business Machines Corporation)
- 18145840. DECOUPLING MIM CAPACITOR simplified abstract (International Business Machines Corporation)
- 18147820. HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES simplified abstract (Intel Corporation)
- 18148231. METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH VOLTAGE ELECTRIC FIELD REQUIREMENTS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18148528. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation)
- 18148543. PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (Intel Corporation)
- 18149284. EXTENDED VIA CONNECT FOR PIXEL ARRAY simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18149477. Interconnect Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18149734. VERTICALLY STACKED FeFETS WITH COMMON CHANNEL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18150021. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150256. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18150289. FERROELECTRIC MEMORY DEVICE WITH BLOCKING LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150617. SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELECTRICAL BREAKDOWN PERFORMANCE, AND METHOD FOR MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152007. INTEGRATED CIRCUIT HAVING TRANSISTORS WITH DIFFERENT WIDTH SOURCE AND DRAIN TERMINALS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152154. INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18153335. SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18153663. CAVITY-EMBEDDED TUNABLE FILTER simplified abstract (QUALCOMM Incorporated)
- 18153831. CAPACITOR AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18153832. Wet Cleaning with Tunable Metal Recess for Via Plugs simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18153912. LOW-STRESS PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
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