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Category:H01L23/31
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Pages in category "H01L23/31"
The following 200 pages are in this category, out of 1,815 total.
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- 17383449. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17412622. DOUBLE-SIDED STACKED DTC STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17543072. UNDERFILL VACUUM PROCESS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17568361. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17669914. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17680410. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17680877. SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17699931. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17700818. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17703668. SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17712358. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17714490. SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17717619. SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17720064. SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17725163. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17746822. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17746990. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17768374. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 17804742. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17814003. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17814828. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17814836. FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17814997. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17816619. SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17818722. ELECTRIC DEVICE, ITS CIRCUIT BOARD AND METHOD OF MANUFACTURING THE ELECTRIC DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17822470. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17822476. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17822879. Adaptive Interconnect Structure for Semiconductor Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)
- 17823856. MULTI-DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17836142. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 17836711. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17837260. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17840322. SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS simplified abstract (Western Digital Technologies, Inc.)
- 17840362. Molding Structures for Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17840744. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17842262. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17843967. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17844802. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)
- 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- 17849300. SEMICONDUCTOR PACKAGING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17850488. SEMICONDUCTOR PACKAGE INCLUDING SUB-PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17851245. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17852614. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17858536. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17859411. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17862469. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17873170. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17876558. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17876813. Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
- 17886461. PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17886466. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887499. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17889053. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17891629. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17894057. PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORTIONS simplified abstract (QUALCOMM Incorporated)
- 17894095. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895047. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896097. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896797. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17897196. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17899574. SEMICONDUCTOR DEVICE WITH A POLYMER LAYER simplified abstract (Micron Technology, Inc.)
- 17899586. SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTURES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 17929159. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17934023. CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE simplified abstract (QUALCOMM Incorporated)
- 17936937. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956753. DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract (Intel Corporation)
- 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
- 17957926. INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
- 17961371. SEMICONDUCTOR PACKAGE AND COOLING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 17966864. SEMICONDUCTOR DEVICE HAVING VIA PROTECTIVE LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17977100. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17979233. SEMICONDUCTOR PACKAGES HAVING UPPER CONDUCTIVE PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 18047670. SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18048972. SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18049901. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18054225. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18059465. SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR simplified abstract (NXP USA, Inc.)
- 18060239. LEAD FRAME APPARATUS, SEMICONDUCTOR DEVICE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18060853. Semiconductor Package with Multiple Redistribution Substrates simplified abstract (Samsung Electronics Co., Ltd.)
- 18061763. Semiconductor package with an antenna substrate simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18063384. METAL POCKET FANOUT PACKAGE simplified abstract (QUALCOMM Incorporated)
- 18064241. SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18067703. STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18070523. OPEN CAVITY INTEGRATED CIRCUIT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18070530. LEADFRAME BASED POWER MODULE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18070825. INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18071237. GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract (Intel Corporation)
- 18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18072026. Slot Bow-Tie Antenna On Package simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18074007. SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18080034. WAFER DIES WITH THERMALLY CONDUCTING PERIMETER REGIONS simplified abstract (International Business Machines Corporation)
- 18080612. LOW Z-HEIGHT, GLASS-REINFORCED PACKAGE WITH EMBEDDED BRIDGE simplified abstract (Intel Corporation)
- 18085859. FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18089494. DIRECT ELECTROPLATING ON MODIFIED POLYMER-GRAPHENE COMPOSITES simplified abstract (Intel Corporation)
- 18090273. DUAL DOWN-SET CONDUCTIVE TERMINALS FOR EXTERNALLY MOUNTED PASSIVE COMPONENTS simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18090317. MULTI-TOOL AND MULTI-DIRECTIONAL PACKAGE SINGULATION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18090707. DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (Intel Corporation)
- 18090883. PACKAGE ARCHITECTURES WITH HETEROGENEOUS INTEGRATION OF VARIOUS DEVICE THICKNESSES simplified abstract (Intel Corporation)
- 18091034. PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract (Intel Corporation)
- 18091228. ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091265. DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (Intel Corporation)
- 18091279. PASSIVATION OF CRYSTALLINE SUBSTRATE FOR METAL CHALCOGEN MATERIAL SYNTHESIS simplified abstract (Intel Corporation)
- 18091943. EMBEDDED SILICON-BASED DEVICE COMPONENTS IN A THICK CORE SUBSTRATE OF AN INTEGRATED CIRCUIT PACKAGE simplified abstract (NVIDIA Corporation)
- 18097970. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18098158. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18098803. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18098979. SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE simplified abstract (Infineon Technologies AG)
- 18099056. SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18099663. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18099697. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18099715. METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18100570. ELECTRONIC DEVICE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18104554. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18104554. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18105945. REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18112107. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18112323. METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18112616. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18113163. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18117818. INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE HUMIDITY RELIABILITY ISSUE OF LIQUID METAL INTERCONNECT simplified abstract (Intel Corporation)
- 18119327. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18119953. SEMICONDUCTOR DEVICE WITH CAPPING LAYER simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18121272. SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18121374. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18121429. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18122285. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18122895. Embedded Package with Shielding Pad simplified abstract (Infineon Technologies AG)
- 18125348. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18125928. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18130197. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18132171. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18133105. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18133178. SEMICONDUCTOR PACKAGE AND METHOD OF PROVIDING SURFACE TEMPERATURE OF SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18134966. POWER MODULE simplified abstract (Hyundai Motor Company)
- 18134966. POWER MODULE simplified abstract (Kia Corporation)
- 18135541. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18136499. SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18140343. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18144350. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18146591. WIRE BONDS FOR GALVANIC ISOLATION DEVICE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18146886. SYSTEM, ELECTRONIC DEVICE AND PACKAGE WITH VERTICAL TO HORIZONTAL SUBSTRATE INTEGRATED WAVEGUIDE TRANSITION AND HORIZONTAL GROUNDED COPLANAR WAVEGUIDE TRANSITION simplified abstract (Texas Instruments Incorporated)
- 18147535. METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract (Intel Corporation)
- 18149509. 3D Package Structure and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18149793. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18150510. CONDUCTIVE MEMBER WITH METAL CORE FOR SUBSTRATE CONNECTIONS simplified abstract (Texas Instruments Incorporated)
- 18150552. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18150853. Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18151071. Package Formation Using UBM-First Approach and the Corresponding Packages simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151517. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151556. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18151643. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151731. FAN-OUT SEMICONDUCTOR PACKAGES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18152153. CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152176. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18152502. INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152539. Fan-Out Stacked Package and Methods of Making the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152615. Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152665. Integrated Circuit Package With Improved Heat Dissipation Efficiency and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18152777. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18154261. SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18154919. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18155713. SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18156449. INTEGRATED POWER MODULE PACKAGE OPENING WITH EXPOSED COMPONENT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18156960. MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18157509. PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18158090. Selectively Dispensed Underfill and Edge Bond Patterns simplified abstract (Apple Inc.)
- 18159244. SENSOR HAVING TUBULAR WALLED SENSING CAVITY simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18161066. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18162878. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18163412. STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HYBRID INTERCONNECTION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18165419. SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18165921. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18166391. HYBRID GATE FIELD EFFECT TRANSISTOR, METHOD FOR PREPARING HYBRID GATE FIELD EFFECT TRANSISTOR, AND SWITCH CIRCUIT simplified abstract (Huawei Technologies Co., Ltd.)
- 18166450. INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18167369. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18168899. SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY simplified abstract (CHANGXIN MEMORY TECHNOLOGIES, INC.)
- 18169177. PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169579. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18169998. INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER simplified abstract (International Business Machines Corporation)
- 18173027. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)