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Category:H01L21/78
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Pages in category "H01L21/78"
The following 200 pages are in this category, out of 280 total.
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- 17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17656011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)
- 17814997. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17838491. Semiconductor Wafer Dicing Method simplified abstract (Western Digital Technologies, Inc.)
- 17839946. Wafer Level Multi-Die Structure Formation simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17850714. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17876558. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17938344. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18049328. DICING METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18060305. LASER DICING TO CONTROL SPLASH simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18060853. Semiconductor Package with Multiple Redistribution Substrates simplified abstract (Samsung Electronics Co., Ltd.)
- 18089732. Structures and Processes for Void-Free Hybrid Bonding simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18103676. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18112616. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18123613. BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18140523. SINGULATED SEMICONDUCTOR DEVICES AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
- 18147858. METHOD OF FORMING A DIE STRUCTURE INCLUDING A CONTROLLED THICKNESS LAYER AND AN APPARATUS FOR PERFORMING THE METHOD simplified abstract (CANON KABUSHIKI KAISHA)
- 18150256. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18151609. 3DIC Package and Method Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18152453. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18156960. MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18181731. SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18184085. Vertical Transistors Occupying Reduced Chip Area and the Methods Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18184968. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18237378. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18237378. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18243664. THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY simplified abstract (MICRON TECHNOLOGY, INC.)
- 18326316. Bonding Semiconductor Dies Through Wafer Bonding Processes simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18341406. WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY USING THE WAFER DICING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18360322. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18367807. Dicing Street Design for Hybrid Bonding (International Business Machines Corporation)
- 18380937. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18387682. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18390439. ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18392481. SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD (SAMSUNG ELECTRONICS CO., LTD.)
- 18397898. METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract (Intel Corporation)
- 18399189. NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract (Intel Corporation)
- 18407011. METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR ELEMENT simplified abstract (NICHIA CORPORATION)
- 18426271. STACKED SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 18426703. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)
- 18447581. DICING METHOD FOR STACKED SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18451799. APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18462010. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18468904. STAIR-STEP CONFIGURATION FOR A SEMICONDUCTOR DIE OF AN INTEGRATED CIRCUIT (Western Digital Technologies, Inc.)
- 18469946. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18481975. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485291. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18485709. Structure and Method for Sealing a Silicon IC simplified abstract (Apple Inc.)
- 18493187. SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18501124. ELEMENT CHIP MANUFACTURING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18504136. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510091. METHOD OF FORMING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513015. PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING simplified abstract (Intel Corporation)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515274. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515398. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18515398. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18519501. WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18532810. SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER simplified abstract (Robert Bosch GmbH)
- 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18586425. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
- 18590718. SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18591438. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KIOXIA CORPORATION)
- 18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
- 18596484. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
- 18602117. ELEMENT CHIP MANUFACTURING METHOD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18602230. METHOD FOR DICING A SEMICONDUCTOR WAFER simplified abstract (STMicroelectronics International N.V.)
- 18602718. Package-On-Package Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18605947. Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18611841. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18614755. STACKED VIA STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18622040. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18624686. PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624811. SEMICONDUCTOR DIES WITH ROUNDED OR CHAMFERED EDGES simplified abstract (Micron Technology, Inc.)
- 18637539. BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18637664. PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18641449. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18648971. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND DYNAMIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (Yangtze Memory Technologies Co., LTD.)
- 18651321. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18651718. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18652969. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18662916. METHODS OF FABRICATING PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668887. SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE simplified abstract (Micron Technology, Inc.)
- 18674904. METHOD FOR FABRICATING HYBRID BONDED STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18676639. PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18706228. Process for the Pulsed Laser Ejection of Multiple Epitaxial Structures from one Thin Film Growth (The Board of Trustees of the Leland Stanford Junior University)
- 18735185. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18736766. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18751859. METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES (Tokyo Electron Limited)
- 18755306. METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract (Intel Corporation)
- 18764401. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (Samsung Electronics Co., Ltd.)
- 18788846. SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTOR DICING (Micron Technology, Inc.)
- 18806049. SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE (Kioxia Corporation)
- 18808098. SEMICONDUCTOR BONDED STRUCTURE AND FABRICATING METHOD THEREOF (Macronix International Co., Ltd.)
- 18820840. MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC (Micron Technology, Inc.)
- 18893435. SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS (Micron Technology, Inc.)
- 18948999. WAFER LEVEL DICING METHOD AND SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18963704. THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18966367. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
2
A
- Apple Inc. patent applications on February 1st, 2024
- Apple Inc. patent applications on January 23rd, 2025
- Apple Inc. patent applications on January 25th, 2024
- Applied materials, inc. (20240266220). INTEGRATED LASER AND PLASMA ETCH DICING simplified abstract
- Applied Materials, Inc. patent applications on August 8th, 2024
B
- Blockchain patent applications on April 18th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on May 16th, 2024
C
I
- Intel corporation (20240128202). METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD simplified abstract
- Intel corporation (20240136326). NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE ARCHITECTURES simplified abstract
- Intel corporation (20240332353). METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY simplified abstract
- Intel corporation (20240347590). METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20240355697). PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER TO AN INTEGRATED ROUTING LAYER simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 25th, 2024
- Intel Corporation patent applications on March 14th, 2024
- Intel Corporation patent applications on October 17th, 2024
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on October 3rd, 2024
- International business machines corporation (20240222313). Structures and Processes for Void-Free Hybrid Bonding simplified abstract
- International business machines corporation (20240321747). BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS simplified abstract
- International business machines corporation (20250087629). Dicing Street Design for Hybrid Bonding
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on July 4th, 2024
- International Business Machines Corporation patent applications on March 13th, 2025
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on September 26th, 2024
K
- Kabushiki kaisha toshiba (20240321638). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- KABUSHIKI KAISHA TOSHIBA patent applications on March 6th, 2025
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
- Kioxia corporation (20240297045). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kioxia corporation (20240297078). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARATING SUBSTRATE simplified abstract
- Kioxia corporation (20240321830). MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract
- Kioxia Corporation patent applications on September 26th, 2024
- KIOXIA CORPORATION patent applications on September 5th, 2024
M
- Micron technology, inc. (20240128426). VERTICAL SOLID-STATE TRANSDUCERS AND HIGH VOLTAGE SOLID-STATE TRANSDUCERS HAVING BURIED CONTACTS AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron technology, inc. (20240297149). STACKED SEMICONDUCTOR DEVICE simplified abstract
- Micron technology, inc. (20240304465). SEMICONDUCTOR DEVICES WITH FLEXIBLE REINFORCEMENT STRUCTURE simplified abstract
- Micron technology, inc. (20240413021). METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING BONDING VOIDS
- Micron technology, inc. (20240420757). MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Micron technology, inc. (20250006251). SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPERATIONS
- Micron technology, inc. (20250015000). SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED SYSTEMS AND METHODS
- Micron technology, inc. (20250069952). SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTOR DICING
- Micron Technology, Inc. patent applications on April 18th, 2024
- Micron Technology, Inc. patent applications on December 12th, 2024
- Micron Technology, Inc. patent applications on December 19th, 2024
- Micron Technology, Inc. patent applications on February 13th, 2025
- Micron Technology, Inc. patent applications on February 27th, 2025
- Micron Technology, Inc. patent applications on February 6th, 2025
- Micron Technology, Inc. patent applications on February 8th, 2024
- Micron Technology, Inc. patent applications on January 23rd, 2025
- Micron Technology, Inc. patent applications on January 2nd, 2025
- Micron Technology, Inc. patent applications on January 9th, 2025
- Micron Technology, Inc. patent applications on October 10th, 2024
- Micron Technology, Inc. patent applications on September 12th, 2024
- Micron Technology, Inc. patent applications on September 5th, 2024
- Mitsubishi Electric Corporation patent applications on February 13th, 2025
P
- Panasonic intellectual property management co., ltd. (20240312841). ELEMENT CHIP MANUFACTURING METHOD simplified abstract
- Panasonic intellectual property management co., ltd. (20240413013). MANUFACTURING METHOD FOR ELEMENT CHIP AND MANUFACTURING METHOD FOR BONDED BODY
- Panasonic Intellectual Property Management Co., Ltd. patent applications on December 12th, 2024
- Panasonic Intellectual Property Management Co., Ltd. patent applications on September 19th, 2024
R
- Robert bosch gmbh (20240194743). SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING A SEMICONDUCTOR WAFER simplified abstract
- Robert bosch gmbh (20240243170). MEMBRANE SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME simplified abstract
- Robert Bosch GmbH patent applications on July 18th, 2024
- Robert Bosch GmbH patent applications on June 13th, 2024
- Robert Bosch GmbH patent applications on March 6th, 2025
- Rohm co., ltd. (20240282593). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
- Rohm co., ltd. (20240282634). MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract
- ROHM CO., LTD. patent applications on August 22nd, 2024
S
- Samsung electronics co., ltd. (20240096703). WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES BY USING THE WAFER DICING METHOD simplified abstract
- Samsung electronics co., ltd. (20240162104). SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract
- Samsung electronics co., ltd. (20240178000). WAFER DICING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203903). SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract
- Samsung electronics co., ltd. (20240290658). METHOD OF WAFER DICING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICES USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240304599). SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312826). PROCESSING TAPE AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321667). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240321766). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321857). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240355678). METHODS OF DICING WAFERS HAVING ARRAYS OF SEMICONDUCTOR CHIPS THEREIN AND SEMICONDUCTOR CHIPS FORMED THEREBY simplified abstract
- Samsung electronics co., ltd. (20240379478). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240421000). SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND SUBSTRATE DICING METHOD
- Samsung electronics co., ltd. (20250014953). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20250070079). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250096158). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025