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Category:H01L21/18
Pages in category "H01L21/18"
The following 24 pages are in this category, out of 24 total.
1
- 18078302. APPARATUS AND METHODS FOR PROCESSING BONDING SEMICONDUCTOR WAFERS simplified abstract (Tokyo Electron Limited)
- 18089919. TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS simplified abstract (Intel Corporation)
- 18319850. PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFER TO WAFER BONDING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18519872. SEMICONDUCTOR MEMORY DEVICE simplified abstract (Kioxia Corporation)
- 18533354. TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (DENSO CORPORATION)
- 18533354. TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18596655. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Kioxia Corporation)
- 18753610. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
- 18761685. PROCESSING METHOD OF WAFER (DISCO CORPORATION)
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- Kioxia corporation (20240099013). SEMICONDUCTOR MEMORY DEVICE simplified abstract
- Kioxia corporation (20240304494). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS simplified abstract
- Kioxia Corporation patent applications on March 21st, 2024
- Kioxia Corporation patent applications on September 12th, 2024
M
- Micron technology, inc. (20240186298). DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract
- Micron technology, inc. (20240203804). ENGINEERED SEMICONDUCTOR SUBSTRATE simplified abstract
- Micron Technology, Inc. patent applications on June 20th, 2024
- Micron Technology, Inc. patent applications on June 6th, 2024