There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01G4/012
Jump to navigation
Jump to search
Subcategories
This category has the following 24 subcategories, out of 24 total.
A
H
J
K
M
N
R
S
T
Y
Pages in category "H01G4/012"
The following 175 pages are in this category, out of 175 total.
1
- 17948586. THIN FILM CAPACITORS simplified abstract (Intel Corporation)
- 18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation)
- 18114394. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18127808. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18136418. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18139444. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18198533. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18213473. WIRE STRUCTURE, WIRE CAPACITOR INCLUDING WIRE STRUCTURE, AND ELECTRONIC DEVICE INCLUDING WIRE CAPACITOR simplified abstract (Samsung Electronics Co., Ltd.)
- 18224670. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18231324. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235065. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235067. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18235531. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD OF THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18243928. COMPOSITE ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation)
- 18346125. EXTREMELY HIGH DENSITY SILICON CAPACITOR (International Business Machines Corporation)
- 18367915. CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18368771. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18372870. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18372871. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18374313. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18383565. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18387139. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18390621. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18394032. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18400411. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18406839. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18411092. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18415009. MULTILAYER CERAMIC CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18429623. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18432669. MULTILAYER CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18435335. MULTILAYER ELECTRONIC COMPONENT HAVING IMPROVED HIGH TEMPERATURE LOAD LIFE AND MOISTURE RESISTANCE RELIABILITY simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18436162. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18444758. SEMICONDUCTOR STRUCTURE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18487058. LAMINATED CERAMIC COMPONENT simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18493893. ELECTRONIC COMPONENT simplified abstract (TDK CORPORATION)
- 18498188. PASSIVE COMPONENT MODULE simplified abstract (Texas Instruments Incorporated)
- 18498794. MULTILAYER ELECTRONIC DEVICE simplified abstract (TDK CORPORATION)
- 18515090. MULTILAYER ELECTRONIC COMPONENT FOR ENHANCED MOISTURE RESISTANCE AND BENDING STRENGTH simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18519368. MULTI-LAYERED CERAMIC CAPACITOR simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526361. MULTILAYER CAPACITOR AND SUBSTRATE INCLUDING THE SAME MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526367. CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526389. MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING MULTILAYER ELECTRONIC COMPONENT MOUNTED THEREON simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18526963. BUS CAPACITOR AND AUTOMOBILE simplified abstract (BYD COMPANY LIMITED)
- 18527439. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18527814. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18530856. ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18540134. MULTILAYER ELECTRONIC COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18540138. MULTILAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18541776. MULTILAYER ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18544505. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18583094. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18584412. MULTILAYER ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18585603. MULTILAYER CERAMIC CAPACITOR simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18592268. ELECTRONIC COMPONENT simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18593693. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18598294. ELECTRONIC COMPONENT AND MOUNTING METHOD AND MOUNTING STRUCTURE THEREOF simplified abstract (Murata Manufacturing Co., Ltd.)
- 18606126. CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608994. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18608996. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609020. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18609537. ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT STRUCTURE simplified abstract (TDK CORPORATION)
- 18609964. CAPACITOR COMPONENT INCLUDING INDIUM AND TIN, AND METHOD OF MANUFACTURING THE CAPACITOR COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18612190. ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18616240. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18619245. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18624446. MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18641986. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18650285. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18661768. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18665821. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667273. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18667780. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18672063. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18673499. METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18675193. MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR-MOUNTED STRUCTURE simplified abstract (Murata Manufacturing Co., Ltd.)
- 18675491. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18677976. MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18678525. CERAMIC ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18733322. ELECTRONIC COMPONENT simplified abstract (TDK CORPORATION)
- 18735609. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract (Murata Manufacturing Co., Ltd.)
- 18742308. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18746113. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18775472. ELECTRONIC COMPONENT (TDK CORPORATION)
- 18789751. MUTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18796371. MUTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18805970. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18814857. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18814950. CERAMIC ELECTRONIC COMPONENT INCLUDING BONDING LAYER BETWEEN BODY AND SINTERED EXTERNAL ELECTRODE (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18817544. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18818715. MULTILAYER CERAMIC ELECTRONIC COMPONENT (Murata Manufacturing Co., Ltd.)
- 18937221. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18943050. THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18966314. MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
- 18971341. MULTILAYER CERAMIC CAPACITOR AND MOUNTING STRUCTURE OF MULTILAYER CERAMIC CAPACITOR (Murata Manufacturing Co., Ltd.)
B
I
- Intel corporation (20240222035). PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract
- Intel corporation (20250006781). CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 4th, 2024
- International business machines corporation (20250006780). EXTREMELY HIGH DENSITY SILICON CAPACITOR
- International Business Machines Corporation patent applications on January 2nd, 2025
M
- Murata manufacturing co., ltd. (20240186068). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240242889). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240242890). MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240249881). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240249885). MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240249889). MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240266110). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240266111). MULTILAYER CERAMIC CAPACITOR INCLUDING RAISED PORTIONS THICKER FROM MIDDLE PORTION TOWARDS OUTER PERIPHERY simplified abstract
- Murata manufacturing co., ltd. (20240266118). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240282522). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240282532). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240296995). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240304363). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240304387). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240304388). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240312709). MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR-MOUNTED STRUCTURE simplified abstract
- Murata manufacturing co., ltd. (20240312710). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240312712). ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240312722). MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240312723). METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240321516). CERAMIC ELECTRONIC COMPONENT simplified abstract
- Murata manufacturing co., ltd. (20240321519). MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR simplified abstract
- Murata manufacturing co., ltd. (20240420890). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240420891). MUTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240420892). MUTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240420893). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240420894). MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Murata manufacturing co., ltd. (20240420896). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20240428992). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250006429). MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Murata manufacturing co., ltd. (20250014820). MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250069807). THREE-TERMINAL MULTILAYER CERAMIC CAPACITOR
- Murata manufacturing co., ltd. (20250069811). MULTILAYER CERAMIC CAPACITOR
- Murata Manufacturing Co., Ltd. patent applications on August 22nd, 2024
- Murata Manufacturing Co., Ltd. patent applications on August 8th, 2024
- Murata Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Murata Manufacturing Co., Ltd. patent applications on December 26th, 2024
- Murata Manufacturing Co., Ltd. patent applications on February 13th, 2025
- Murata Manufacturing Co., Ltd. patent applications on February 20th, 2025
- Murata Manufacturing Co., Ltd. patent applications on February 27th, 2025
- Murata Manufacturing Co., Ltd. patent applications on January 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on January 23rd, 2025
- MURATA MANUFACTURING CO., LTD. patent applications on January 2nd, 2025
- Murata Manufacturing Co., Ltd. patent applications on January 9th, 2025
- Murata Manufacturing Co., Ltd. patent applications on July 18th, 2024
- Murata Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Murata Manufacturing Co., Ltd. patent applications on June 6th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 12th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 19th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 26th, 2024
- Murata Manufacturing Co., Ltd. patent applications on September 5th, 2024
S
- Samsung electro-mechanics co., ltd. (20240212933). MULTILAYER ELECTRONIC COMPONENT simplified abstract
- Samsung electro-mechanics co., ltd. (20240212939). COMPOSITE ELECTRONIC COMPONENT simplified abstract
- Samsung electro-mechanics co., ltd. (20240212941). MULTILAYER ELECTRONIC COMPONENT simplified abstract
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on March 6th, 2025
- Samsung electronics co., ltd. (20240162278). CAPACITOR STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING SAME simplified abstract
- Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on May 16th, 2024
T
- Taiwan semiconductor manufacturing company, ltd. (20240290541). INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELECTRIC METAL-INSULATOR-METAL DEVICE simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- Texas instruments incorporated (20240297112). PASSIVE COMPONENT MODULE simplified abstract
- Texas Instruments Incorporated patent applications on September 5th, 2024
U
- US Patent Application 17969189. MULTILAYER ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18065188. A METHOD FOR MANUFACTURING AN ELECTRICAL DEVICE WITH AN ANODIC POROUS OXIDE REGION DELIMITED BY PLANARIZING A STACK OF MATERIALS simplified abstract
- US Patent Application 18125868. MULTILAYER ELECTRONIC COMPONENT simplified abstract
- US Patent Application 18228050. DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COMPRISING SAME simplified abstract
- US Patent Application 18233407. MULTILAYER CERAMIC CAPACITOR simplified abstract
- US Patent Application 18303703. ELECTRONIC DEVICE simplified abstract
- US Patent Application 18315563. DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT simplified abstract
