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Category:H01F41/00
Subcategories
This category has the following 2 subcategories, out of 2 total.
A
B
Pages in category "H01F41/00"
The following 16 pages are in this category, out of 16 total.
1
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 18027920. INDUCTOR AND MANUFACTURING METHOD THEREOF, FILTER AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18516402. PHOTOSENSITIVE CONDUCTIVE PASTE, METHOD FOR PRODUCING MULTILAYER ELECTRONIC COMPONENT, AND MULTILAYER ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)
- 18897901. MULTILAYER INDUCTOR AND MANUFACTURING METHOD THEREOF (Murata Manufacturing Co., Ltd.)
- 18909609. COIL ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
I
- Intel corporation (20240114623). HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 4th, 2024