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Category:G02B6/42
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Pages in category "G02B6/42"
The following 200 pages are in this category, out of 413 total.
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- 17567497. PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17600337. OPTICAL APPARATUS, LIGHT EMITTING APPARATUS, OPTICAL CABLE, AND METHOD OF CONNECTING OPTICAL APPARATUS simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 17703374. Package Structure Including Photonic Package and Interposer Having Waveguide simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17846173. PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)
- 17849679. THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17850828. Chip-to-Chip Optical Coupling for Photonic Integrated Circuits simplified abstract (Apple Inc.)
- 17877041. 3D High Bandwidth Memory and Optical Connectivity Stacking simplified abstract (GOOGLE LLC)
- 17896089. PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17898427. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17945862. Interference Devices for Wavelength Locking simplified abstract (Apple Inc.)
- 17949747. LIGHT GUIDES simplified abstract (HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17959967. METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAYER SUBSTRATES simplified abstract (Applied Materials, Inc.)
- 17959973. PHOTONIC GLASS LAYER SUBSTRATE WITH EMBEDDED OPTICAL STRUCTURES FOR COMMUNICATING WITH AN ELECTRO OPTICAL INTEGRATED CIRCUIT simplified abstract (Applied Materials, Inc.)
- 17960151. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18007958. OPTICAL DEVICE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059923. PHOTONIC INTEGRATED CIRCUIT (PIC) FIRST PATCH ARCHITECTURE simplified abstract (Intel Corporation)
- 18075302. 3D-TAPERED NANOCAVITIES WITH ON-CHIP OPTICAL AND MOLECULAR CONCENTRATION FOR SINGLE MOLECULE DIAGNOSTICS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18078871. PHOTONIC INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH VERTICAL OPTICAL COUPLERS simplified abstract (Intel Corporation)
- 18080152. INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES simplified abstract (Intel Corporation)
- 18089501. FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS simplified abstract (Intel Corporation)
- 18089871. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18089892. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18089916. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18089934. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18089963. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18090260. ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation)
- 18091034. PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract (Intel Corporation)
- 18091430. PHOTONIC ALIGNMENT DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18149325. LIGHT DEFLECTION STRUCTURE TO INCREASE OPTICAL COUPLING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18153116. Photonic Package and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18164310. PACKAGE DEVICES AND METHODS OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18189911. UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES simplified abstract (Intel Corporation)
- 18213763. RECEIVER, RECEPTION DEVICE, COMMUNICATION DEVICE, AND COMMUNICATION SYSTEM simplified abstract (NEC Corporation)
- 18216494. OPTICAL ISOLATORS FOR MULTI-CHANNEL OPTICAL INTERCONNECTS (Intel Corporation)
- 18217165. ADAPTERS FOR HETEROGENOUS OPTICAL CONNECTORS (Intel Corporation)
- 18229222. CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION EFFECT simplified abstract (DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD)
- 18229339. CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION EFFECT FOR BEING RELIABLY FIXED TO CIRCUIT BOARD simplified abstract (DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD)
- 18232342. OPTICAL COUPLING APPARATUS AND METHODS OF MAKING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18235518. SILICON PHOTONICS PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SWITCH PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18252931. Optical Transmitter simplified abstract (Nippon Telegraph and Telephone Corporation)
- 18258396. Optical Transmitter simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18259451. MOUNTING STRUCTURE OF OPTICAL MODULE AND OPTICAL MOUNTING BOARD simplified abstract (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18262639. Module Integrated with Optical Sensor, Display Panel, and Display Apparatus simplified abstract (Honor Device Co., Ltd.)
- 18279424. ULTRAVIOLET LIGHT IRRADIATION SYSTEM AND ULTRAVIOLET LIGHT IRRADIATION METHOD simplified abstract (Nippon Telegraph and Telephone Corporation)
- 18287876. AN OPTICAL TRANSCEIVER ASSEMBLY, AN OPTICAL TRANSCEIVER AND AN ADAPTOR FOR AN OPTICAL TRANSCEIVER simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
- 18294181. DISPLAY APPARATUS simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
- 18315118. OPTIC MULTIPLEXER OR DEMULTIPLEXER simplified abstract (Cisco Technology, Inc.)
- 18329464. Photonic Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18340733. PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18342422. TECHNOLOGIES FOR A HYBRID OPTICAL CHIP-TO-CHIP COUPLING (Intel Corporation)
- 18343175. STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC INTEGRATED CIRCUIT (Intel Corporation)
- 18343587. METHODS AND APPARATUS TO FACILITATE ALIGNMENT OF OPTICAL COMPONENTS (Intel Corporation)
- 18343793. ARCHITECTURE AND METHOD FOR PASSIVE-ACTIVE OPTICAL ALIGNMENT OF PHOTONIC INTEGRATED CIRCUIT (PIC) AND FIBER ARRAY UNIT (FAU) (Intel Corporation)
- 18345044. ROTATING CIRCULAR WAVEGUIDE CHANNEL FOR FOLDABLE ELECTRONIC DEVICES (Intel Corporation)
- 18345106. TECHNOLOGIES FOR SUBSTRATE FEATURES FOR A PLUGGABLE OPTICAL CONNECTOR (Intel Corporation)
- 18346039. PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVING PROCESS TOLERANCE (Intel Corporation)
- 18346116. PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER (Intel Corporation)
- 18346988. DETECTION OF OPTICAL MODULE MISALIGNMENT USING A LIGHT FREQUENCY REACTIVE AGENT (International Business Machines Corporation)
- 18347452. ELECTRO-OPTICAL CIRCUIT (Cisco Technology, Inc.)
- 18364332. PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18379287. Display Device simplified abstract (Semiconductor Energy Laboratory Co., Ltd.)
- 18388461. TECHNOLOGIES FOR DYNAMICALLY MANAGING RESOURCES IN DISAGGREGATED ACCELERATORS simplified abstract (Intel Corporation)
- 18392354. Imaging Device, an Imaging System and a Method for Wavelength Dependent Imaging simplified abstract (IMEC VZW)
- 18394168. OPTICAL MODULE simplified abstract (Sumitomo Electric Industries, Ltd.)
- 18403531. OPTICAL DEVICE AND METHOD OF MANUFACTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18403911. IMAGE DISPLAY DEVICE, HEAD-UP DISPLAY EQUIPPED WITH IMAGE DISPLAY DEVICE, AND MOVABLE BODY simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18408318. IMAGE SENSING DEVICE simplified abstract (SK hynix Inc.)
- 18416937. ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18440193. Etched Coupling Structures for Bonded Photonic Dies simplified abstract (Apple Inc.)
- 18440297. PHOTONICS INTEGRATED CIRCUIT PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18443255. OPTICAL WAVEGUIDE DEVICE, OPTICAL CHIP, AND COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18455886. OPTICAL DEVICES AND METHODS OF MANUFACTURE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18455892. OPTO-ELECTRONIC ADAPTER AND COMMUNICATION SYSTEM simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18480121. RECEPTION DEVICE, COMMUNICATION DEVICE, AND COMMUNICATION SYSTEM simplified abstract (NEC Corporation)
- 18488074. METHOD AND DEVICE FOR FAST, PASSIVE ALIGNMENT IN PHOTONICS ASSEMBLY simplified abstract (Intel Corporation)
- 18505521. ULTRAHIGH-BANDWIDTH LOW-LATENCY RECONFIGURABLE MEMORY INTERCONNECTS BY WAVELENGTH ROUTING (The Regents of the University of California)
- 18513611. SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517632. VARIABLE LIGHTING APPARATUS (HYUNDAI MOTOR COMPANY)
- 18517632. VARIABLE LIGHTING APPARATUS (KIA CORPORATION)
- 18518756. OPTICAL ENGINE ASSEMBLY, OPTICAL INTERCONNECTION SYSTEM, AND NETWORK DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18519035. Systems and Methods for Wavelength Locking in Optical Sensing Systems simplified abstract (Apple Inc.)
- 18520733. ELECTRIC-WIRE-EQUIPPED CONNECTION MEMBER AND ELECTRIC WIRE CONNECTION STRUCTURE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18536662. IMAGE DISPLAY DEVICE AND HEADUP DISPLAY SYSTEM simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18545038. PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM simplified abstract (NEC Corporation)
- 18562593. OPTICAL WIRING COMPONENT, OPTICAL DEVICE, AND METHOD OF ASSEMBLING OPTICAL DEVICE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18579232. INTEGRATED OPTICAL MODULE simplified abstract (Mitsubishi Electric Corporation)
- 18579938. OPTICAL MODULE, OPTICAL CONNECTOR CABLE, AND METHOD FOR PRODUCING OPTICAL MODULE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18579963. OPTICAL MODULE AND OPTICAL CONNECTOR CABLE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18580069. OPTICAL MODULE AND OPTICAL CONNECTOR CABLE (Sumitomo Electric Industries, Ltd.)
- 18580337. OPTICAL FIBER MODULE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18586919. Photonic Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18587406. MULTI-WAFER INTEGRATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18593421. TRANSISTOR-OUTLINE PACKAGE AND PREPARATION METHOD THEREOF, OPTICAL SUB-ASSEMBLY, OPTICAL MODULE, AND OPTICAL NETWORK SYSTEM simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18596076. Asic Package With Photonics And Vertical Power Delivery simplified abstract (Google LLC)
- 18596600. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18600776. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18605145. DAUGHTER-CARD OPTICAL BACKPLANE CONNECTOR SYSTEM simplified abstract (TE Connectivity Solutions GmbH)
- 18607170. PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
- 18607571. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18611499. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18613360. Optical Module and Optical Communication Device simplified abstract (Huawei Technologies Co., Ltd.)
- 18619037. HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18623399. METHODS FOR FUSING A FIBER TERMINATION simplified abstract (Boston Scientific Scimed, Inc.)
- 18652775. PACKAGE STRUCTURE HAVING GRATING COUPLER AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18663749. EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES simplified abstract (Juniper Networks, Inc.)
- 18664224. OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18665619. METHOD FOR CONNECTING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE CONNECTION STRUCTURE simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)
- 18666633. OPTICAL CONNECTOR MODULE AND METHOD OF MANUFACTURING OPTICAL WAVEGUIDE BOARD simplified abstract (KYOCERA Corporation)
- 18667834. OPTICAL DEVICE simplified abstract (Sumitomo Electric Industries, Ltd.)
- 18668881. MULTIFIBER FIBER OPTIC CONNECTORS, CABLE ASSEMBLIES AND METHODS OF MAKING THE SAME simplified abstract (CORNING RESEARCH & DEVELOPMENT CORPORATION)
- 18669690. PHOTOELECTRIC TRANSCEIVER ASSEMBLY AND MANUFACTURING METHOD THEREOF simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18674407. LIGHT MODULATING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18677392. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18681247. OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE simplified abstract (KYOCERA CORPORATION)
- 18683295. RECEPTION DEVICE AND COMMUNICATION DEVICE simplified abstract (NEC Corporation)
- 18700850. CURVED SEE-THROUGH LIGHTGUIDE WITH INTERMEDIATE FOCUS (GOOGLE LLC)
- 18712343. INTERFACE STRUCTURE, OPTICAL CONNECTOR, TRANSMITTER, RECEIVER, OPTICAL CABLE, AND OPTICAL COMMUNICATION SYSTEM (Sony Group Corporation)
- 18734566. CHIP AND OPTICAL COMMUNICATION DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18735312. OPTICAL MODULE, FERRULE, AND OPTICAL FIBER CONNECTOR simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18736771. INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIVITY AND METHODS OF MAKING THE SAME simplified abstract (CORNING INCORPORATED)
- 18746934. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18747906. SEMICONDUCTOR PACKAGE INCLUDING PHOTONIC INTEGRATED CIRCUIT CHIP (SAMSUNG ELECTRONICS CO., LTD.)
- 18748090. OPTICAL SENSOR AND ELECTRONIC DEVICE COMPRISING SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18748746. POLARIZATION INDEPENDENT OPTOELECTRONIC DEVICE AND METHOD simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED)
- 18757571. SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASED OPTICAL INTERCONNECT simplified abstract (Intel Corporation)
- 18804501. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18815156. METHOD AND APPARATUS FOR HANDLING AN OPTICAL DEVICE, METHOD FOR HANDLING A WAVEGUIDE (Applied Materials, Inc.)
- 18819359. POWER DELIVERY THROUGH AN OPTICAL SYSTEM (Cisco Technology, Inc.)
- 18830967. OPTOELECTRICAL CONNECTOR (Sumitomo Electric Industries, Ltd.)
- 18883663. OPTICAL MODULE ASSEMBLY (Electronics and Telecommunications Research Institute)
- 18885214. EFFICIENCY-LADDERED CROPPED EXIT PUPIL EXPANDER FOR COMPACT DIFRACTIVE WAVEGUIDES (Applied Materials, Inc.)
- 18886389. OPTO-ELECTRICAL CONNECTION SYSTEM, AND OPTO-ELECTRICAL CONNECTOR (Sumitomo Electric Industries, Ltd.)
- 18891046. Apparatus and Methodology for Reshaping a Laser Beam (Boston Scientific Scimed, Inc.)
- 18892996. Display Device (Semiconductor Energy Laboratory Co., Ltd.)
- 18946965. SEMICONDUCTOR PACKAGE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18956990. OPTICAL CIRCUIT, QUANTUM OPERATION DEVICE, AND METHOD FOR MANUFACTURING OPTICAL CIRCUIT (Fujitsu Limited)
- 18969375. VERTICAL GRATING COUPLER (Taiwan Semiconductor Manufacturing Co., Ltd.)
2
- 20240019649. FANOUT MODULE INTEGRATING A PHOTONIC INTEGRATED CIRCUIT simplified abstract (Advanced Micro Devices, Inc.)
- 20240027699. TECHNOLOGIES FOR A BEAM EXPANSION IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 20240027706. PHOTONICS INTEGRATED CIRCUIT DEVICE PACKAGING simplified abstract (Intel Corporation)
- 20240034003. WAVEGUIDE FOR PLASTIC WELDING, ARRANGEMENT FOR PLASTIC WELDING, A WELDING METHOD AS WELL AS A MANUFACTURING METHOD OF A WAVEGUIDE simplified abstract (BRANSON Ultraschall Niederlassung der Emerson Technologies GmbH & Co. OHG)
- 20240077686.Compact Optical Coupler simplified abstract (apple inc.)
- 20240090102.Systems and Methods for Wavelength Locking in Optical Sensing Systems simplified abstract (apple inc.)
3
A
- Apple inc. (20240103238). 3D System and Wafer Reconstitution with Mid-layer Interposer simplified abstract
- Apple inc. (20240103301). Head-Mounted Display Device With Vision Correction simplified abstract
- Apple inc. (20240272380). Fast-Axis Collimator with Hanging Connector simplified abstract
- Apple inc. (20240280767). Etched Coupling Structures for Bonded Photonic Dies simplified abstract
- Apple inc. (20250004598). SYSTEMS AND METHODS TO CONTROL CROSS-TALK OF AN OPTICAL FIBER-BASED SENSING MODULE
- Apple Inc. patent applications on August 15th, 2024
- Apple Inc. patent applications on August 22nd, 2024
- Apple Inc. patent applications on February 13th, 2025
- Apple Inc. patent applications on January 23rd, 2025
- Apple Inc. patent applications on January 2nd, 2025
- Apple Inc. patent applications on March 14th, 2024
- Apple Inc. patent applications on March 28th, 2024
- Applied materials, inc. (20250085494). METHOD AND APPARATUS FOR HANDLING AN OPTICAL DEVICE, METHOD FOR HANDLING A WAVEGUIDE
- Applied Materials, Inc. (20250093660). EFFICIENCY-LADDERED CROPPED EXIT PUPIL EXPANDER FOR COMPACT DIFRACTIVE WAVEGUIDES
- Applied materials, inc. (20250093660). EFFICIENCY-LADDERED CROPPED EXIT PUPIL EXPANDER FOR COMPACT DIFRACTIVE WAVEGUIDES
- Applied Materials, Inc. patent applications on March 13th, 2025
- Applied Materials, Inc. patent applications on March 20th, 2025
- AR/VR/XR patent applications on 21st Mar 2025
- AR/VR/XR patent applications on December 26th, 2024
- AR/VR/XR patent applications on March 20th, 2025
B
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 1st, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on January 25th, 2024
- Blockchain patent applications on March 28th, 2024
- Boston scientific scimed, inc. (20250013060). Apparatus and Methodology for Reshaping a Laser Beam
- Boston Scientific Scimed, Inc. patent applications on January 9th, 2025
C
- Cisco technology, inc. (20240241309). OPTICAL WAFER-SCALE PHOTODIODE BANDWIDTH MEASUREMENT SYSTEM simplified abstract
- Cisco technology, inc. (20240241332). EMBEDDED RADIO FREQUENCY SHIELD BETWEEN INTEGRATED OPTICAL MODULATOR AND SILICON SUBSTRATE simplified abstract
- Cisco technology, inc. (20240264387). DUAL LENS OPTICAL COUPLING TO MULTICORE FIBER simplified abstract
- Cisco technology, inc. (20240427088). COMPOSITE CONNECTOR CARRYING POWER, ELECTRO-OPTICAL DATA, AND FLUID INPUT/OUTPUT
- Cisco technology, inc. (20250012988). ELECTRO-OPTICAL CIRCUIT
- Cisco Technology, Inc. patent applications on August 8th, 2024
- Cisco Technology, Inc. patent applications on December 26th, 2024
- Cisco Technology, Inc. patent applications on January 25th, 2024
- Cisco Technology, Inc. patent applications on January 30th, 2025
- Cisco Technology, Inc. patent applications on January 9th, 2025
- Cisco Technology, Inc. patent applications on July 18th, 2024
E
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (20240427142). EXTENDED REALITY GLASS DEVICE AND DISPLAY APPARATUS THEREOF
- Electronics and telecommunications research institute (20250093599). OPTICAL MODULE ASSEMBLY
- Electronics and Telecommunications Research Institute patent applications on March 20th, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE patent applications on March 6th, 2025
F
G
- Google llc (20240213215). Asic Package With Photonics And Vertical Power Delivery simplified abstract
- Google llc (20240418994). CURVED SEE-THROUGH LIGHTGUIDE WITH INTERMEDIATE FOCUS
- GOOGLE LLC patent applications on December 19th, 2024
- GOOGLE LLC patent applications on February 1st, 2024
- Google LLC patent applications on June 27th, 2024