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Category:F28D15/04
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This category has the following 20 subcategories, out of 20 total.
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Pages in category "F28D15/04"
The following 49 pages are in this category, out of 49 total.
1
- 18345597. VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTACHMENT AND IMPROVED THERMAL MANAGEMENT (Intel Corporation)
- 18347639. HEATPIPE WITH GRADUATED CONDENSER PORTION AND CONSTANT RATIO BETWEEN WICK THICKNESS AND CROSS-SECTION AREA (DELL PRODUCTS L.P.)
- 18355528. VAPOR CHAMBER AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
- 18395919. VARIABLE DIMENSION HEAT PIPE simplified abstract (Intel Corporation)
- 18603274. EVAPORATIVE COOLING SYSTEM FOR ABLUTION BAY simplified abstract (KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS)
- 18673662. VAPOR CHAMBER WITH MICROSTRUCTURE LAYER simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18737095. Thermally Conductive Structure and Manufacturing Method Thereof, Heat Sink, and Electronic Device Including Heat Sink simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18944213. WICK AND HEAT TRANSPORT DEVICE (Murata Manufacturing Co., Ltd.)
- 18973801. Vapor Chamber and Electronic Device (HUAWEI TECHNOLOGIES CO., LTD.)
2
- 20240011717. HEAT DIFFUSION DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
- 20240011718. THERMAL DIFFUSION DEVICE AND ELECTRONIC APPARATUS simplified abstract (Murata Manufacturing Co., Ltd.)
- 20240021327. HEAT PIPE FUEL ELEMENT AND FISSION REACTOR INCORPORATING SAME, PARTICULARLY HAVING PHYLLOTAXIS SPACING PATTERN OF HEAT PIPE FUEL ELEMENTS, AND METHOD OF MANUFACTURE simplified abstract (BWXT Advanced Technologies LLC)
3
B
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 22nd, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on March 7th, 2024
- Blockchain patent applications on May 16th, 2024
C
- California Institute of Technology (20240302104). Systems and Methods for Thermal Management Using Separable Heat Pipes and Methods of Manufacture Thereof simplified abstract
- Cisco technology, inc. (20240240874). MULTIPLE WICK SECTION HEATPIPE FOR EFFECTIVE HEAT TRANSFER simplified abstract
- Cisco Technology, Inc. patent applications on July 18th, 2024
H
- Huawei technologies co., ltd. (20240318921). VAPOR CHAMBER WITH MICROSTRUCTURE LAYER simplified abstract
- Huawei technologies co., ltd. (20240318922). Thermally Conductive Structure and Manufacturing Method Thereof, Heat Sink, and Electronic Device Including Heat Sink simplified abstract
- Huawei technologies co., ltd. (20240410658). Heat Pipe for Preventing Icing Expansion
- Huawei technologies co., ltd. (20250102234). Vapor Chamber and Electronic Device
- Huawei Technologies Co., Ltd. patent applications on December 12th, 2024
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on March 27th, 2025
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
I
- Intel corporation (20240175640). VARIABLE DIMENSION HEAT PIPE simplified abstract
- Intel corporation (20250003695). VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTACHMENT AND IMPROVED THERMAL MANAGEMENT
- Intel Corporation patent applications on February 13th, 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on May 30th, 2024
- International business machines corporation (20240426558). DYNAMICALLY ENHANCING HEAT TRANSFER THROUGH HEAT PIPES
- International Business Machines Corporation patent applications on December 26th, 2024
