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Category:CPC H05K1/0215
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Pages in category "CPC H05K1/0215"
The following 22 pages are in this category, out of 22 total.
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- MEIDENSHA CORPORATION Patent Application Trends in 2024
- Meta platforms technologies, llc (20240251499). APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW HOLES IN CIRCUIT PACKAGING FOR MOBILE DEVICES simplified abstract
- Meta Platforms Technologies, LLC patent applications on July 25th, 2024
- Micron Technology, Inc. Patent Application Trends in 2024
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240431018). ELECTRONIC DEVICE COMPRISING GROUND STRUCTURE USING SPEAKER ASSEMBLY
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
- SKYWORKS SOLUTIONS, INC. Patent Application Trends in 2025
- Sony Interactive Entertainment Inc. Patent Application Trends in 2024