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Category:CPC H01L24/81
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Pages in category "CPC H01L24/81"
The following 84 pages are in this category, out of 84 total.
1
- 18269172. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR simplified abstract (LG INNOTEK CO., LTD.)
- 18336331. FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS (QUALCOMM Incorporated)
- 18345695. COMPLIANT INSERTS FOR PIN DIPPING PROCESSES (Intel Corporation)
- 18599734. EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18613954. BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18749542. JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18751869. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME (Samsung Electronics Co., Ltd.)
- 18965717. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
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- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20250006691). COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
- Intel corporation (20250096194). MICROELECTRONIC ASSEMBLIES
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on March 20th, 2025
- International Business Machines Corporation Patent Application Trends in 2025
- IQM FINLAND OY Patent Application Trends in 2024
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- Qualcomm incorporated (20240421119). FLEXIBLE UNDER-BUMP METALLIZATION (UBM) SIZES AND PATTERNING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
- Qualcomm Incorporated Patent Application Trends in 2024
- QUALCOMM INCORPORATED Patent Application Trends in 2024
- Qualcomm Incorporated Patent Application Trends in 2025
- QUALCOMM Incorporated patent applications on December 19th, 2024
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- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250015042). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- SAMSUNG ELECTRONICS CO.,LTD Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO.,LTD. Patent Application Trends in 2024
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
- SILICONWARE PRECISION INDUSTRIES CO., LTD. Patent Application Trends in 2024
- SONOVA AG Patent Application Trends in 2024
- STMicroelectronics (Tours) SAS Patent Application Trends in 2024
- Stroke Precision Advanced Engineering Co., Ltd. Patent Application Trends in 2024
- Stroke Precision Advanced Engineering Co., Ltd. Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240213213). EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240234365). BONDING THROUGH MULTI-SHOT LASER REFLOW simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258266). SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240339432). JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 27th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- Telefonaktiebolaget LM Ericsson (publ) Patent Application Trends in 2025
- The Boeing Company Patent Application Trends in 2024
- The University of Hong Kong Patent Application Trends in 2024
- Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd. Patent Application Trends in 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
