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Category:CPC H01L23/49575
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Pages in category "CPC H01L23/49575"
The following 41 pages are in this category, out of 41 total.
1
- 18181950. DISCRETE DUAL PADS FOR A CIRCUIT simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18425703. POWER CONVERTER APPARATUS simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18430414. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
- 18518096. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18522852. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18603047. ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18610280. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18650794. SEMICONDUCTOR PACKAGE simplified abstract (ROHM CO., LTD.)
- 18747095. PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION ELEMENT EXTENDING ALONG MOUNTING BASE (Infineon Technologies AG)
- 18946486. SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
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- Micron Technology, Inc. Patent Application Trends in 2024
- Mitsubishi electric corporation (20240266263). SEMICONDUCTOR APPARATUS simplified abstract
- Mitsubishi electric corporation (20240347430). POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on August 8th, 2024
- Mitsubishi Electric Corporation patent applications on October 17th, 2024
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- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Texas instruments incorporated (20240258215). WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract
- Texas Instruments Incorporated patent applications on August 1st, 2024
- TEXAS INSTRUMENTS INCORPORATED patent applications on March 6th, 2025