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Category:CPC H01L23/49562
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Pages in category "CPC H01L23/49562"
The following 44 pages are in this category, out of 44 total.
1
- 18288999. SEMICONDUCTOR DEVICE AND POWER CONVERTER simplified abstract (Mitsubishi Electric Corporation)
- 18369443. INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT (Infineon Technologies AG)
- 18458899. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18458899. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18496383. SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18596794. SEMICONDUCTOR DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18596794. SEMICONDUCTOR DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18652417. SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MOUNTING BODY simplified abstract (ROHM CO., LTD.)
- 18794460. SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR DIE SANDWICHED BETWEEN TWO LEADFRAMES AND A METHOD FOR FABRICATING THE SAME (Infineon Technologies AG)
- 18816403. SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
- 18820361. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE (ROHM CO., LTD.)
- 18945218. SEMICONDUCTOR DEVICE (ROHM CO., LTD.)
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- Rohm co., ltd. (20240282681). SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MOUNTING BODY simplified abstract
- Rohm co., ltd. (20240421048). SEMICONDUCTOR DEVICE
- Rohm co., ltd. (20240421049). SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Rohm Co., Ltd. Patent Application Trends in 2024
- ROHM CO., LTD. patent applications on August 22nd, 2024
- ROHM CO., LTD. patent applications on December 19th, 2024
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- Semtech Corporation Patent Application Trends in 2024
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- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Tesla, inc. (20250006600). SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE
- Tesla, Inc. Patent Application Trends in 2025
- Tesla, Inc. patent applications on January 2nd, 2025
- Texas instruments incorporated (20240258212). SUBSTRATE-ON-DIE PACKAGE ARCHITECTURE simplified abstract
- Texas Instruments Incorporated patent applications on August 1st, 2024
