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Category:CPC H01L23/49541
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Pages in category "CPC H01L23/49541"
The following 37 pages are in this category, out of 37 total.
1
- 18098827. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18297088. MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME simplified abstract (Texas Instruments Incorporated)
- 18468773. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
- 18650970. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18651064. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2024
- STMicroelectronics International N.V. Patent Application Trends in 2025
- SUMITOMO ELECTRIC INDUSTRIES, LTD. Patent Application Trends in 2024
- Sumitomo Electric Industries, Ltd. Patent Application Trends in 2024
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- Telefonaktiebolaget LM Ericsson (PUBL) Patent Application Trends in 2024
- Texas instruments incorporated (20240258210). SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOPSIDE AND SIDEWALL simplified abstract
- Texas instruments incorporated (20240339382). MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME simplified abstract
- Texas instruments incorporated (20240347425). INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE INTERCONNECTS simplified abstract
- Texas instruments incorporated (20240413058). CUSTOM LEADFRAME FROM STANDARD PLUS PRINTED LEADFRAME PORTION
- Texas Instruments Incorporated patent applications on August 1st, 2024
- Texas Instruments Incorporated patent applications on December 12th, 2024
- Texas Instruments Incorporated patent applications on February 6th, 2025
- Texas Instruments Incorporated patent applications on October 10th, 2024
- TEXAS INSTRUMENTS INCORPORATED patent applications on October 17th, 2024
