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Category:CPC H01L23/3135
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Pages in category "CPC H01L23/3135"
The following 76 pages are in this category, out of 76 total.
1
- 18091034. PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract (Intel Corporation)
- 18206858. SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND MEMORY SYSTEM simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18243627. SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE simplified abstract (Kabushiki Kaisha Toshiba)
- 18243627. SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE simplified abstract (Toshiba Electronic Devices & Storage Corporation)
- 18374123. SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18398926. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18463819. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18635862. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (KABUSHIKI KAISHA TOSHIBA)
- 18635862. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18651815. SEMICONDUCTOR MODULE simplified abstract (ROHM CO., LTD.)
- 18660967. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
A
I
- Illumina, Inc. Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240222216). PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING simplified abstract
- Intel corporation (20240413031). ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on July 4th, 2024
K
- Kabushiki kaisha toshiba (20240249987). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Kabushiki kaisha toshiba (20240321665). SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE simplified abstract
- Kabushiki kaisha toshiba (20250105078). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- KABUSHIKI KAISHA TOSHIBA Patent Application Trends in 2024
- Kabushiki Kaisha Toshiba Patent Application Trends in 2025
- KABUSHIKI KAISHA TOSHIBA patent applications on July 25th, 2024
- KABUSHIKI KAISHA TOSHIBA patent applications on March 27th, 2025
- Kabushiki Kaisha Toshiba patent applications on September 26th, 2024
- Kioxia Corporation Patent Application Trends in 2024
M
- MEDIATEK Inc. Patent Application Trends in 2024
- MEDIATEK INC. Patent Application Trends in 2024
- Micron Technology, Inc. Patent Application Trends in 2024
- Mitsubishi electric corporation (20240258188). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation Patent Application Trends in 2024
- MITSUBISHI ELECTRIC CORPORATION Patent Application Trends in 2024
- Mitsubishi Electric Corporation patent applications on August 1st, 2024
Q
R
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240194553). SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240312858). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240379481). SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY STACKED ON A PACKAGE SUBSTRATE BY AN ADHESIVE FILM AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20250079249). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250079250). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on November 14th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
- SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2024
- SiPLP Microelectronics (Chongqing) Limited Patent Application Trends in 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION Patent Application Trends in 2025
- Sony Semiconductor Solutions Corporation Patent Application Trends in 2025
- STMicroelectronics International N.V. Patent Application Trends in 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Tesla, Inc. Patent Application Trends in 2025