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Category:CPC H01L23/15
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Pages in category "CPC H01L23/15"
The following 69 pages are in this category, out of 69 total.
1
- 18021813. Substrate and Preparation Method thereof, Integrated Passive Device, and Electronic Apparatus simplified abstract (BOE Technology Group Co., Ltd.)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18091548. GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract (Intel Corporation)
- 18121331. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18126134. GLASS CORE SUBSTRATE WITH LGA NOTCH simplified abstract (Intel Corporation)
- 18189782. PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (Intel Corporation)
- 18469674. LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES (Intel Corporation)
- 18470645. MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (Intel Corporation)
- 18611534. GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS simplified abstract (Intel Corporation)
- 18830590. WIRING SUBSTRATE, COMPOSITE SUBSTRATE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE (NICHIA CORPORATION)
- 18883759. METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION (Intel Corporation)
- 18883851. GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS (Intel Corporation)
- 18883861. METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FILM CAPACITORS (Intel Corporation)
- 18977572. GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS (Intel Corporation)
- 18977706. CERAMIC SUBSTRATE, CERAMIC CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DEVICE (KABUSHIKI KAISHA TOSHIBA)
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- Illumina, Inc. Patent Application Trends in 2025
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Intel corporation (20240194548). APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract
- Intel corporation (20240203805). EMBEDDED MEMORY FOR GLASS CORE PACKAGES simplified abstract
- Intel corporation (20240203806). GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA simplified abstract
- Intel corporation (20240222210). GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract
- Intel corporation (20240234225). GLASS CORE PATCH WITH IN SITU FABRICATED FAN-OUT LAYER TO ENABLE DIE TILING APPLICATIONS simplified abstract
- Intel corporation (20240312853). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240321656). GLASS CORE SUBSTRATE WITH LGA NOTCH simplified abstract
- Intel corporation (20240321657). PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Intel corporation (20240332100). GLASS-INTEGRATED INDUCTORS IN INTEGRATED CIRCUIT PACKAGES simplified abstract
- Intel corporation (20250006569). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006570). GLASS CORES INCLUDING MULTIPLE LAYERS AND RELATED METHODS
- Intel corporation (20250006571). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FILM CAPACITORS
- Intel corporation (20250096052). LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES
- Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH
- Intel corporation (20250105074). GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED METHODS
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation patent applications on February 13th, 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 11th, 2024
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 13th, 2024
- Intel Corporation patent applications on June 20th, 2024
- INTEL CORPORATION patent applications on June 20th, 2024
- Intel Corporation patent applications on March 20th, 2025
- Intel Corporation patent applications on March 27th, 2025
- Intel Corporation patent applications on October 3rd, 2024
- Intel Corporation patent applications on September 19th, 2024
- Intel Corporation patent applications on September 26th, 2024
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- Skyworks Solutions, Inc. Patent Application Trends in 2025
