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Category:C22C38/48
Subcategories
This category has the following 13 subcategories, out of 13 total.
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Pages in category "C22C38/48"
The following 25 pages are in this category, out of 25 total.
1
- 18364840. HOT DIP GALVANIZED ULTRA-HIGH STRENGTH STEEL SHEETS WITH HIGH FLATNESS simplified abstract (GM Global Technology Operations LLC)
- 18396165. STEEL FOR GEAR AND METHOD FOR MANUFACTURING GEAR USING THE SAME simplified abstract (Hyundai Motor Company)
- 18396165. STEEL FOR GEAR AND METHOD FOR MANUFACTURING GEAR USING THE SAME simplified abstract (Kia Corporation)
- 18477742. SINTERING METAL POWDER AND SINTERED METAL BODY simplified abstract (SEIKO EPSON CORPORATION)
- 18547693. METHOD OF MANUFACTURING GRAIN-ORIENTED ELECTRICAL STEEL SHEET simplified abstract (JFE STEEL CORPORATION)
- 18562583. FERRITIC STAINLESS STEEL simplified abstract (JFE STEEL CORPORATION)
- 18587723. STEEL, STEEL STRUCTURAL PART, ELECTRONIC DEVICE, AND STEEL STRUCTURAL PART PREPARATION METHOD simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18688357. PRESSURE VESSEL FOR HIGH-PRESSURE HYDROGEN GAS (JFE STEEL CORPORATION)
- 18689942. DUPLEX STAINLESS STEEL MATERIAL (NIPPON STEEL CORPORATION)
- 18836837. AUSTENITIC STAINLESS STEEL AND METHOD OF MANUFACTURING AUSTENITIC STAINLESS STEEL (NIPPON STEEL CORPORATION)
- 18837961. MARTENSITIC STAINLESS STEEL MATERIAL (NIPPON STEEL CORPORATION)
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- Huawei technologies co., ltd. (20240200178). STEEL, STEEL STRUCTURAL PART, ELECTRONIC DEVICE, AND STEEL STRUCTURAL PART PREPARATION METHOD simplified abstract
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on June 20th, 2024
- Hyundai motor company (20240124962). STEEL FOR GEAR AND METHOD FOR MANUFACTURING GEAR USING THE SAME simplified abstract
- Hyundai Motor Company patent applications on April 18th, 2024
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- Sanyo Special Steel Co., Ltd. (20250018467). Alloy Powder Material for Additive Manufacturing, Including Oxide Nanoparticles, and Additively Manufactured Article
- Seiko epson corporation (20240110266). SINTERING METAL POWDER AND SINTERED METAL BODY simplified abstract
- SEIKO EPSON CORPORATION patent applications on April 4th, 2024