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Category:C09D165/00
Pages in category "C09D165/00"
The following 11 pages are in this category, out of 11 total.
1
- 18419879. HARDMASK COMPOSITION, HARDMASK LAYER AND METHOD OF FORMING PATTERNS simplified abstract (Samsung SDI Co., Ltd.)
- 18538042. CONDUCTIVE COMPOSITIONS OF CONDUCTIVE POLYMER AND METAL COATED FIBER simplified abstract (The Boeing Company)
- 18588447. Resist Underlayer Film Material, Pattern Forming Method, And Method Of Forming Resist Underlayer Film simplified abstract (SHIN-ETSU CHEMICAL CO., LTD.)
- 18743005. THICK FILM-FORMING COMPOSITION AND METHOD FOR MANUFACTURING CURED FILM USING THE SAME simplified abstract (Merck Patent GmbH)
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- Samsung sdi co., ltd. (20240343938). HARDMASK COMPOSITION, HARDMASK LAYER, AND METHOD OF FORMING PATTERNS simplified abstract
- Samsung SDI Co., Ltd. patent applications on October 17th, 2024
- Shin-etsu chemical co., ltd. (20240337944). Resist Underlayer Film Material, Pattern Forming Method, And Method Of Forming Resist Underlayer Film simplified abstract
- SHIN-ETSU CHEMICAL CO., LTD. patent applications on October 10th, 2024