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Category:C08K5/3492
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This category has the following 14 subcategories, out of 14 total.
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Pages in category "C08K5/3492"
The following 18 pages are in this category, out of 18 total.
1
- 18402739. RESIN COMPOSITION, POLYIMIDE PREPARATION METHOD AND RELATED PRODUCTS simplified abstract (AAC Technologies (Nanjing) Co., Ltd.)
- 18409377. CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE simplified abstract (Shin-Etsu Chemical Co., Ltd.)
- 18562961. Crosslinking Auxiliary Composition and Crosslinking Composition for Olefin-Based Copolymer, and Additive for Encapsulant Composition for Optical Device simplified abstract (LG CHEM, LTD.)
- 18572864. FLAMEPROOF POLYAMIDE MOLDING COMPOUNDS FOR INSULATING ELECTRIC COMPONENTS simplified abstract (EVONIK OPERATIONS GMBH)
- 18651818. COMPOSITE FLAME RETARDANTS, PREPARATION METHOD THEREOF, ELASTIC SHEET FOR ALL-SOLID-STATE RECHARGEABLE BATTERIES, AND ALL-SOLID-STATE RECHARGEABLE BATTERIES (SAMSUNG SDI CO., LTD.)
- 18682346. POLYAMIDE COMPOSITIONS AND ARTICLE simplified abstract (BASF SE)
- 18683475. POLYESTER RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME (LG CHEM, LTD.)
- 18693113. STABILIZER FORMULATION (BASF SE)
- 18730024. Encapsulant Film Composition and Encapsulant Film Including the Same (LG Chem, Ltd.)
- 18739535. LAYER FORMING COMPOSITION, FILM FORMING METHOD, AND ARTICLE MANUFACTURING METHOD (CANON KABUSHIKI KAISHA)
- 18882091. CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING AGENT, AND SEMICONDUCTOR DEVICE (Shin-Etsu Chemical Co., Ltd.)