View source for Nvidia corporation (20250003694). WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME

=WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME=


==Organization Name==

[[:Category:nvidia corporation|nvidia corporation]]


[[Category:nvidia corporation]]

==Inventor(s)==

[[:Category:Ron Chao of San Diego CA (US)|Ron Chao of San Diego CA (US)]][[Category:Ron Chao of San Diego CA (US)]]

[[:Category:Elad Mentovich of Tel Aviv (IL)|Elad Mentovich of Tel Aviv (IL)]][[Category:Elad Mentovich of Tel Aviv (IL)]]

[[:Category:Harrison Sangwha Kim of Morgan Hill CA (US)|Harrison Sangwha Kim of Morgan Hill CA (US)]][[Category:Harrison Sangwha Kim of Morgan Hill CA (US)]]

[[:Category:Mark North of Lancaster PA (US)|Mark North of Lancaster PA (US)]][[Category:Mark North of Lancaster PA (US)]]

[[:Category:Xinwei Lu of Shenzhen (CN)|Xinwei Lu of Shenzhen (CN)]][[Category:Xinwei Lu of Shenzhen (CN)]]

[[:Category:Tahir Cader of Spokane Valley WA (US)|Tahir Cader of Spokane Valley WA (US)]][[Category:Tahir Cader of Spokane Valley WA (US)]]

[[:Category:Fei Zhang of Shenzhen (CN)|Fei Zhang of Shenzhen (CN)]][[Category:Fei Zhang of Shenzhen (CN)]]

[[:Category:Yunseok Kim of Pleasanton CA (US)|Yunseok Kim of Pleasanton CA (US)]][[Category:Yunseok Kim of Pleasanton CA (US)]]

[[:Category:David Haley of Beaverton OR (US)|David Haley of Beaverton OR (US)]][[Category:David Haley of Beaverton OR (US)]]

[[:Category:Yuezhan Steven Zhu of San Jose CA (US)|Yuezhan Steven Zhu of San Jose CA (US)]][[Category:Yuezhan Steven Zhu of San Jose CA (US)]]

[[:Category:Lei Huang of Shenzhen (CN)|Lei Huang of Shenzhen (CN)]][[Category:Lei Huang of Shenzhen (CN)]]

==WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME==


This abstract first appeared for US patent application 20250003694 titled 'WICK STRUCTURE FOR OPTIMIZED THERMAL PERFORMANCE AND METHOD OF MAKING THE SAME




==Original Abstract Submitted==

a heat transfer apparatus including a housing and a wick structure is provided that is configured to dissipate heat from a heat source. the housing defines a chamber that holds working fluid. the wick structure includes a body and pores defined by the body. the heat transfer apparatus defines an evaporator section configured to evaporate the working fluid using heat from a heat source and a condenser section configured to dissipate heat carried by the evaporated working fluid through condensation of the evaporated working fluid. the wick structure has a repeatable, configurable, and controlled geometry optimized to move the working fluid from the condenser section to the evaporator section via capillary action. the body of the wick structure may have a gyroidal geometry. associated methods are also provided.



[[Category:F28D15/04]]
[[Category:F28D15/02]]
[[Category:CPC_F28D15/046]]